GB2098801B - Method of assembling a semiconductor package - Google Patents

Method of assembling a semiconductor package

Info

Publication number
GB2098801B
GB2098801B GB8214182A GB8214182A GB2098801B GB 2098801 B GB2098801 B GB 2098801B GB 8214182 A GB8214182 A GB 8214182A GB 8214182 A GB8214182 A GB 8214182A GB 2098801 B GB2098801 B GB 2098801B
Authority
GB
United Kingdom
Prior art keywords
assembling
semiconductor package
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8214182A
Other languages
English (en)
Other versions
GB2098801A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of GB2098801A publication Critical patent/GB2098801A/en
Application granted granted Critical
Publication of GB2098801B publication Critical patent/GB2098801B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB8214182A 1981-05-18 1982-05-14 Method of assembling a semiconductor package Expired GB2098801B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8109817A FR2506075A1 (fr) 1981-05-18 1981-05-18 Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection

Publications (2)

Publication Number Publication Date
GB2098801A GB2098801A (en) 1982-11-24
GB2098801B true GB2098801B (en) 1985-01-03

Family

ID=9258561

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8214182A Expired GB2098801B (en) 1981-05-18 1982-05-14 Method of assembling a semiconductor package

Country Status (7)

Country Link
JP (1) JPS57196549A (nl)
KR (1) KR900002119B1 (nl)
DE (1) DE3217345A1 (nl)
FR (1) FR2506075A1 (nl)
GB (1) GB2098801B (nl)
IT (1) IT1152406B (nl)
NL (1) NL186206C (nl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617647A (ja) * 1984-06-21 1986-01-14 Toshiba Corp 回路基板
JPS61218151A (ja) * 1985-03-23 1986-09-27 Hitachi Ltd 半導体装置
JP2712461B2 (ja) * 1988-12-27 1998-02-10 日本電気株式会社 半導体装置の容器
DE3931634A1 (de) * 1989-09-22 1991-04-04 Telefunken Electronic Gmbh Halbleiterbauelement
DE4201931C1 (nl) * 1992-01-24 1993-05-27 Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh + Co.Kg, 4788 Warstein, De

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
FR1468122A (fr) * 1965-02-17 1967-02-03 Motorola Inc Boîtier pour semi-conducteurs
US3515952A (en) * 1965-02-17 1970-06-02 Motorola Inc Mounting structure for high power transistors
DE1564815A1 (de) * 1966-08-27 1970-02-26 Standard Elek K Lorenz Ag Verfahren zum Einbau von Halbleiteranordnungen in miniaturisierte Schaltungen
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
JPS5116258B2 (nl) * 1971-10-30 1976-05-22
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
JPS5272170A (en) * 1975-12-12 1977-06-16 Nec Corp Package for semiconductor elements
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof

Also Published As

Publication number Publication date
FR2506075B1 (nl) 1984-10-19
NL186206C (nl) 1990-10-01
KR840000076A (ko) 1984-01-30
KR900002119B1 (ko) 1990-04-02
DE3217345A1 (de) 1982-12-02
NL8202010A (nl) 1982-12-16
DE3217345C2 (nl) 1987-07-02
IT1152406B (it) 1986-12-31
IT8221289A0 (it) 1982-05-14
JPS57196549A (en) 1982-12-02
JPH0119269B2 (nl) 1989-04-11
FR2506075A1 (fr) 1982-11-19
NL186206B (nl) 1990-05-01
GB2098801A (en) 1982-11-24

Similar Documents

Publication Publication Date Title
DE3271995D1 (en) Method of manufacturing a semiconductor device
GB2081159B (en) Method of manufacturing a semiconductor device
DE3470253D1 (en) Method of manufacturing a semiconductor device having small dimensions
DE3172663D1 (en) Method of making a matrix of interconnected semiconductor devices
DE3271762D1 (en) Dual-in-line package assembly
DE3167203D1 (en) Method of manufacturing a semiconductor device
EP0171662A3 (en) Method of fabricating a chip interposer
DE3175085D1 (en) Method of manufacturing a semiconductor device
EP0214690A3 (en) A method of manufacturing a semiconductor device
GB2206448B (en) A method of producing a semiconductor device
DE3567320D1 (en) A method of forming a semiconductor device using a mask
GB2102623B (en) Method of manufacturing a semiconductors memory device
EP0187421A3 (en) Method of manufacturing a semiconductor device
DE3462773D1 (en) A package and method for fabrication thereof
GB2081160B (en) Method of manufacturing a semiconductor device
DE3365143D1 (en) Method of manufacturing a semiconductor device
DE3565441D1 (en) Method for manufacturing a semiconductor device
GB2081161B (en) Method of manufacturing a semiconductor device
DE3164765D1 (en) Method of manufacturing a semiconductor element
GB2156857B (en) Method of manufacturing a semiconductor device
GB2183093B (en) Method of manufacturing a semiconductor device
GB2098801B (en) Method of assembling a semiconductor package
DE3274923D1 (en) A method of producing a semiconductor device
DE3369952D1 (en) A package and a method of manufacturing said package
GB2147289B (en) A method of bonding parts together

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930514