NL185044C - Halfgeleider-component en werkwijze voor het vervaardigen daarvan. - Google Patents

Halfgeleider-component en werkwijze voor het vervaardigen daarvan.

Info

Publication number
NL185044C
NL185044C NL7608544A NL7608544A NL185044C NL 185044 C NL185044 C NL 185044C NL 7608544 A NL7608544 A NL 7608544A NL 7608544 A NL7608544 A NL 7608544A NL 185044 C NL185044 C NL 185044C
Authority
NL
Netherlands
Prior art keywords
making
semiconductor component
semiconductor
component
Prior art date
Application number
NL7608544A
Other languages
English (en)
Other versions
NL7608544A (nl
NL185044B (nl
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/601,839 external-priority patent/US4017340A/en
Application filed by Gen Electric filed Critical Gen Electric
Publication of NL7608544A publication Critical patent/NL7608544A/nl
Publication of NL185044B publication Critical patent/NL185044B/nl
Application granted granted Critical
Publication of NL185044C publication Critical patent/NL185044C/nl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/296Organo-silicon compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3171Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3192Multilayer coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid
    • H01L2924/10156Shape being other than a cuboid at the periphery

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
NL7608544A 1975-08-04 1976-07-30 Halfgeleider-component en werkwijze voor het vervaardigen daarvan. NL185044C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60183875A 1975-08-04 1975-08-04
US05/601,839 US4017340A (en) 1975-08-04 1975-08-04 Semiconductor element having a polymeric protective coating and glass coating overlay

Publications (3)

Publication Number Publication Date
NL7608544A NL7608544A (nl) 1977-02-08
NL185044B NL185044B (nl) 1989-08-01
NL185044C true NL185044C (nl) 1990-01-02

Family

ID=27083963

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7608544A NL185044C (nl) 1975-08-04 1976-07-30 Halfgeleider-component en werkwijze voor het vervaardigen daarvan.

Country Status (6)

Country Link
JP (1) JPS584816B2 (nl)
DE (1) DE2634568C2 (nl)
FR (1) FR2320634A1 (nl)
GB (1) GB1553243A (nl)
NL (1) NL185044C (nl)
SE (1) SE429699B (nl)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE418433B (sv) * 1975-12-11 1981-05-25 Gen Electric Halvledarelement med ett skikt av ett polymert siloxan-innehallande membranmaterial med variabel permeabilitet anbringat pa utvalda ytomraden av elementet
GB1563421A (en) * 1975-12-18 1980-03-26 Gen Electric Polyimide-siloxane copolymer protective coating for semiconductor devices
JPS5978954A (ja) * 1982-10-22 1984-05-08 Nitto Electric Ind Co Ltd 光学ガラスフアイバ用被覆材料
JPH0693451B2 (ja) * 1984-03-31 1994-11-16 株式会社東芝 半導体装置及びその製造方法
EP0347518A1 (de) * 1988-03-28 1989-12-27 Asea Brown Boveri Ag Passivierung eines Halbleiterbauelementes
WO1997012403A1 (fr) * 1995-09-27 1997-04-03 Hitachi, Ltd. Diode
FR2797996B1 (fr) * 1999-08-25 2003-10-03 Gemplus Card Int Procede de protection de puces de circuit integre par depot de couche mince isolante
FR2797995B1 (fr) * 1999-08-25 2002-03-22 Gemplus Card Int Procede de protection de puces de circuit integre par depot de couche mince isolante
DE102007033288A1 (de) 2007-07-17 2009-01-22 Siemens Ag Elektronisches Bauelement und Vorrichtung mit hoher Isolationsfestigkeit sowie Verfahren zu deren Herstellung
EP3113219B1 (de) * 2015-06-30 2020-03-11 SEMIKRON Elektronik GmbH & Co. KG Halbleiterbauelement und verfahren zu dessen herstellung
JP6704359B2 (ja) * 2017-01-10 2020-06-03 三菱電機株式会社 電力用半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3034079A (en) * 1959-05-11 1962-05-08 Microwave Ass Hermetically sealed semiconductors
US3338859A (en) * 1966-06-30 1967-08-29 Dow Corning Silicone polyimides
US3481781A (en) * 1967-03-17 1969-12-02 Rca Corp Silicate glass coating of semiconductor devices
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
US3619733A (en) * 1969-08-18 1971-11-09 Rca Corp Semiconductor device with multilevel metalization and method of making the same
US3597269A (en) * 1969-09-30 1971-08-03 Westinghouse Electric Corp Surfce stabilization of semiconductor power devices and article
US3643136A (en) * 1970-05-22 1972-02-15 Gen Electric Glass passivated double beveled semiconductor device with partially spaced preform
IE35063B1 (en) * 1970-05-22 1975-10-29 Gen Electric Semiconductor device with polymeric passivant bonded preform
IE35247B1 (en) * 1970-06-08 1975-12-24 Gen Electric Improvements in ceramic passivated semi-conductor device and process for its manufacture
JPS4723980U (nl) * 1971-03-19 1972-11-17
US3740305A (en) * 1971-10-01 1973-06-19 Gen Electric Composite materials bonded with siloxane containing polyimides
JPS5144071B2 (nl) * 1972-06-14 1976-11-26

Also Published As

Publication number Publication date
SE7608727L (sv) 1977-02-05
NL7608544A (nl) 1977-02-08
NL185044B (nl) 1989-08-01
DE2634568C2 (de) 1985-06-20
FR2320634B1 (nl) 1983-01-07
JPS5228266A (en) 1977-03-03
JPS584816B2 (ja) 1983-01-27
GB1553243A (en) 1979-09-26
FR2320634A1 (fr) 1977-03-04
SE429699B (sv) 1983-09-19
DE2634568A1 (de) 1977-02-17

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
A85 Still pending on 85-01-01
V1 Lapsed because of non-payment of the annual fee