SE429699B - Halvledarelement med ett skyddsbeleggningsmaterial av en organisk polymer och forfarande for dess framstellning - Google Patents
Halvledarelement med ett skyddsbeleggningsmaterial av en organisk polymer och forfarande for dess framstellningInfo
- Publication number
- SE429699B SE429699B SE7608727A SE7608727A SE429699B SE 429699 B SE429699 B SE 429699B SE 7608727 A SE7608727 A SE 7608727A SE 7608727 A SE7608727 A SE 7608727A SE 429699 B SE429699 B SE 429699B
- Authority
- SE
- Sweden
- Prior art keywords
- procedure
- manufacturing
- semiconductor element
- organic polymer
- protective material
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229920000620 organic polymer Polymers 0.000 title 1
- 230000001681 protective effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3192—Multilayer coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10156—Shape being other than a cuboid at the periphery
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US60183875A | 1975-08-04 | 1975-08-04 | |
| US05/601,839 US4017340A (en) | 1975-08-04 | 1975-08-04 | Semiconductor element having a polymeric protective coating and glass coating overlay |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE7608727L SE7608727L (sv) | 1977-02-05 |
| SE429699B true SE429699B (sv) | 1983-09-19 |
Family
ID=27083963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7608727A SE429699B (sv) | 1975-08-04 | 1976-08-03 | Halvledarelement med ett skyddsbeleggningsmaterial av en organisk polymer och forfarande for dess framstellning |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS584816B2 (xx) |
| DE (1) | DE2634568C2 (xx) |
| FR (1) | FR2320634A1 (xx) |
| GB (1) | GB1553243A (xx) |
| NL (1) | NL185044C (xx) |
| SE (1) | SE429699B (xx) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2655725A1 (de) * | 1975-12-11 | 1977-06-16 | Gen Electrit Co | Halbleiterelement mit einem schutzueberzug |
| GB1563421A (en) * | 1975-12-18 | 1980-03-26 | Gen Electric | Polyimide-siloxane copolymer protective coating for semiconductor devices |
| JPS5978954A (ja) * | 1982-10-22 | 1984-05-08 | Nitto Electric Ind Co Ltd | 光学ガラスフアイバ用被覆材料 |
| JPH0693451B2 (ja) * | 1984-03-31 | 1994-11-16 | 株式会社東芝 | 半導体装置及びその製造方法 |
| EP0347518A1 (de) * | 1988-03-28 | 1989-12-27 | Asea Brown Boveri Ag | Passivierung eines Halbleiterbauelementes |
| WO1997012403A1 (fr) * | 1995-09-27 | 1997-04-03 | Hitachi, Ltd. | Diode |
| FR2797995B1 (fr) * | 1999-08-25 | 2002-03-22 | Gemplus Card Int | Procede de protection de puces de circuit integre par depot de couche mince isolante |
| FR2797996B1 (fr) * | 1999-08-25 | 2003-10-03 | Gemplus Card Int | Procede de protection de puces de circuit integre par depot de couche mince isolante |
| DE102007033288A1 (de) | 2007-07-17 | 2009-01-22 | Siemens Ag | Elektronisches Bauelement und Vorrichtung mit hoher Isolationsfestigkeit sowie Verfahren zu deren Herstellung |
| EP3113219B1 (de) * | 2015-06-30 | 2020-03-11 | SEMIKRON Elektronik GmbH & Co. KG | Halbleiterbauelement und verfahren zu dessen herstellung |
| JP6704359B2 (ja) * | 2017-01-10 | 2020-06-03 | 三菱電機株式会社 | 電力用半導体装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3034079A (en) * | 1959-05-11 | 1962-05-08 | Microwave Ass | Hermetically sealed semiconductors |
| US3338859A (en) * | 1966-06-30 | 1967-08-29 | Dow Corning | Silicone polyimides |
| US3481781A (en) * | 1967-03-17 | 1969-12-02 | Rca Corp | Silicate glass coating of semiconductor devices |
| US3615913A (en) * | 1968-11-08 | 1971-10-26 | Westinghouse Electric Corp | Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating |
| US3619733A (en) * | 1969-08-18 | 1971-11-09 | Rca Corp | Semiconductor device with multilevel metalization and method of making the same |
| US3597269A (en) * | 1969-09-30 | 1971-08-03 | Westinghouse Electric Corp | Surfce stabilization of semiconductor power devices and article |
| US3643136A (en) * | 1970-05-22 | 1972-02-15 | Gen Electric | Glass passivated double beveled semiconductor device with partially spaced preform |
| IE35063B1 (en) * | 1970-05-22 | 1975-10-29 | Gen Electric | Semiconductor device with polymeric passivant bonded preform |
| IE35247B1 (en) * | 1970-06-08 | 1975-12-24 | Gen Electric | Improvements in ceramic passivated semi-conductor device and process for its manufacture |
| JPS4723980U (xx) * | 1971-03-19 | 1972-11-17 | ||
| US3740305A (en) * | 1971-10-01 | 1973-06-19 | Gen Electric | Composite materials bonded with siloxane containing polyimides |
| JPS5144071B2 (xx) * | 1972-06-14 | 1976-11-26 |
-
1976
- 1976-07-21 GB GB3033676A patent/GB1553243A/en not_active Expired
- 1976-07-30 FR FR7623319A patent/FR2320634A1/fr active Granted
- 1976-07-30 NL NL7608544A patent/NL185044C/xx not_active IP Right Cessation
- 1976-07-31 DE DE19762634568 patent/DE2634568C2/de not_active Expired
- 1976-08-03 SE SE7608727A patent/SE429699B/xx not_active IP Right Cessation
- 1976-08-04 JP JP51092407A patent/JPS584816B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL7608544A (nl) | 1977-02-08 |
| NL185044C (nl) | 1990-01-02 |
| GB1553243A (en) | 1979-09-26 |
| FR2320634B1 (xx) | 1983-01-07 |
| NL185044B (nl) | 1989-08-01 |
| FR2320634A1 (fr) | 1977-03-04 |
| JPS5228266A (en) | 1977-03-03 |
| DE2634568A1 (de) | 1977-02-17 |
| DE2634568C2 (de) | 1985-06-20 |
| JPS584816B2 (ja) | 1983-01-27 |
| SE7608727L (sv) | 1977-02-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |
Ref document number: 7608727-9 Effective date: 19910315 Format of ref document f/p: F |