SE7608727L - Halvledarelement med skyddsbeleggning av polymer - Google Patents

Halvledarelement med skyddsbeleggning av polymer

Info

Publication number
SE7608727L
SE7608727L SE7608727A SE7608727A SE7608727L SE 7608727 L SE7608727 L SE 7608727L SE 7608727 A SE7608727 A SE 7608727A SE 7608727 A SE7608727 A SE 7608727A SE 7608727 L SE7608727 L SE 7608727L
Authority
SE
Sweden
Prior art keywords
polymer
semiconductor element
protective coating
protective
coating
Prior art date
Application number
SE7608727A
Other languages
English (en)
Other versions
SE429699B (sv
Inventor
A J Yerman
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/601,839 external-priority patent/US4017340A/en
Application filed by Gen Electric filed Critical Gen Electric
Publication of SE7608727L publication Critical patent/SE7608727L/sv
Publication of SE429699B publication Critical patent/SE429699B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3192—Multilayer coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10156—Shape being other than a cuboid at the periphery

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
SE7608727A 1975-08-04 1976-08-03 Halvledarelement med ett skyddsbeleggningsmaterial av en organisk polymer och forfarande for dess framstellning SE429699B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60183875A 1975-08-04 1975-08-04
US05/601,839 US4017340A (en) 1975-08-04 1975-08-04 Semiconductor element having a polymeric protective coating and glass coating overlay

Publications (2)

Publication Number Publication Date
SE7608727L true SE7608727L (sv) 1977-02-05
SE429699B SE429699B (sv) 1983-09-19

Family

ID=27083963

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7608727A SE429699B (sv) 1975-08-04 1976-08-03 Halvledarelement med ett skyddsbeleggningsmaterial av en organisk polymer och forfarande for dess framstellning

Country Status (6)

Country Link
JP (1) JPS584816B2 (sv)
DE (1) DE2634568C2 (sv)
FR (1) FR2320634A1 (sv)
GB (1) GB1553243A (sv)
NL (1) NL185044C (sv)
SE (1) SE429699B (sv)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2655725A1 (de) * 1975-12-11 1977-06-16 Gen Electrit Co Halbleiterelement mit einem schutzueberzug
GB1563421A (en) * 1975-12-18 1980-03-26 Gen Electric Polyimide-siloxane copolymer protective coating for semiconductor devices
JPS5978954A (ja) * 1982-10-22 1984-05-08 Nitto Electric Ind Co Ltd 光学ガラスフアイバ用被覆材料
JPH0693451B2 (ja) * 1984-03-31 1994-11-16 株式会社東芝 半導体装置及びその製造方法
EP0347518A1 (de) * 1988-03-28 1989-12-27 Asea Brown Boveri Ag Passivierung eines Halbleiterbauelementes
WO1997012403A1 (fr) * 1995-09-27 1997-04-03 Hitachi, Ltd. Diode
FR2797995B1 (fr) * 1999-08-25 2002-03-22 Gemplus Card Int Procede de protection de puces de circuit integre par depot de couche mince isolante
FR2797996B1 (fr) * 1999-08-25 2003-10-03 Gemplus Card Int Procede de protection de puces de circuit integre par depot de couche mince isolante
DE102007033288A1 (de) 2007-07-17 2009-01-22 Siemens Ag Elektronisches Bauelement und Vorrichtung mit hoher Isolationsfestigkeit sowie Verfahren zu deren Herstellung
EP3113219B1 (de) * 2015-06-30 2020-03-11 SEMIKRON Elektronik GmbH & Co. KG Halbleiterbauelement und verfahren zu dessen herstellung
JP6704359B2 (ja) * 2017-01-10 2020-06-03 三菱電機株式会社 電力用半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3034079A (en) * 1959-05-11 1962-05-08 Microwave Ass Hermetically sealed semiconductors
US3338859A (en) * 1966-06-30 1967-08-29 Dow Corning Silicone polyimides
US3481781A (en) * 1967-03-17 1969-12-02 Rca Corp Silicate glass coating of semiconductor devices
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
US3619733A (en) * 1969-08-18 1971-11-09 Rca Corp Semiconductor device with multilevel metalization and method of making the same
US3597269A (en) * 1969-09-30 1971-08-03 Westinghouse Electric Corp Surfce stabilization of semiconductor power devices and article
IE35063B1 (en) * 1970-05-22 1975-10-29 Gen Electric Semiconductor device with polymeric passivant bonded preform
US3643136A (en) * 1970-05-22 1972-02-15 Gen Electric Glass passivated double beveled semiconductor device with partially spaced preform
IE35247B1 (en) * 1970-06-08 1975-12-24 Gen Electric Improvements in ceramic passivated semi-conductor device and process for its manufacture
JPS4723980U (sv) * 1971-03-19 1972-11-17
US3740305A (en) * 1971-10-01 1973-06-19 Gen Electric Composite materials bonded with siloxane containing polyimides
JPS5144071B2 (sv) * 1972-06-14 1976-11-26

Also Published As

Publication number Publication date
JPS5228266A (en) 1977-03-03
FR2320634B1 (sv) 1983-01-07
GB1553243A (en) 1979-09-26
DE2634568A1 (de) 1977-02-17
DE2634568C2 (de) 1985-06-20
NL7608544A (nl) 1977-02-08
JPS584816B2 (ja) 1983-01-27
SE429699B (sv) 1983-09-19
NL185044B (nl) 1989-08-01
NL185044C (nl) 1990-01-02
FR2320634A1 (fr) 1977-03-04

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