NL163899C - Werkwijze voor het bevestigen van aansluitgeleiders aan op een halfgeleiderlichaam aangebrachte metalen aan- sluitgebied. - Google Patents

Werkwijze voor het bevestigen van aansluitgeleiders aan op een halfgeleiderlichaam aangebrachte metalen aan- sluitgebied.

Info

Publication number
NL163899C
NL163899C NL6817050.A NL6817050A NL163899C NL 163899 C NL163899 C NL 163899C NL 6817050 A NL6817050 A NL 6817050A NL 163899 C NL163899 C NL 163899C
Authority
NL
Netherlands
Prior art keywords
fingers
frame member
semiconductor body
connection area
metal connection
Prior art date
Application number
NL6817050.A
Other languages
English (en)
Dutch (nl)
Other versions
NL163899B (nl
NL6817050A (cg-RX-API-DMAC10.html
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of NL6817050A publication Critical patent/NL6817050A/xx
Publication of NL163899B publication Critical patent/NL163899B/xx
Application granted granted Critical
Publication of NL163899C publication Critical patent/NL163899C/xx

Links

Classifications

    • H10P72/0446—
    • H10W70/421—
    • H10W70/442—
    • H10W72/30—
    • H10W76/157—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07633—
    • H10W72/655—

Landscapes

  • Die Bonding (AREA)
  • Push-Button Switches (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
NL6817050.A 1967-12-15 1968-11-28 Werkwijze voor het bevestigen van aansluitgeleiders aan op een halfgeleiderlichaam aangebrachte metalen aan- sluitgebied. NL163899C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69104167A 1967-12-15 1967-12-15

Publications (3)

Publication Number Publication Date
NL6817050A NL6817050A (cg-RX-API-DMAC10.html) 1969-06-17
NL163899B NL163899B (nl) 1980-05-16
NL163899C true NL163899C (nl) 1980-10-15

Family

ID=24774934

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6817050.A NL163899C (nl) 1967-12-15 1968-11-28 Werkwijze voor het bevestigen van aansluitgeleiders aan op een halfgeleiderlichaam aangebrachte metalen aan- sluitgebied.

Country Status (6)

Country Link
BE (1) BE725467A (cg-RX-API-DMAC10.html)
DE (1) DE1813164B2 (cg-RX-API-DMAC10.html)
FR (1) FR1599198A (cg-RX-API-DMAC10.html)
GB (1) GB1199849A (cg-RX-API-DMAC10.html)
IE (1) IE32531B1 (cg-RX-API-DMAC10.html)
NL (1) NL163899C (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices
DE2840973A1 (de) * 1978-09-20 1980-03-27 Siemens Ag Verfahren zur herstellung pruefbarer halbleiter-miniaturgehaeuse in bandform
US4721992A (en) * 1986-06-26 1988-01-26 National Semiconductor Corporation Hinge tape
KR102152906B1 (ko) * 2018-11-20 2020-09-09 세메스 주식회사 본딩 장치 및 본딩 방법

Also Published As

Publication number Publication date
BE725467A (cg-RX-API-DMAC10.html) 1969-06-13
IE32531L (en) 1969-06-15
NL163899B (nl) 1980-05-16
DE1813164B2 (de) 1971-12-23
DE1813164A1 (de) 1969-07-03
FR1599198A (cg-RX-API-DMAC10.html) 1970-07-15
GB1199849A (en) 1970-07-22
NL6817050A (cg-RX-API-DMAC10.html) 1969-06-17
IE32531B1 (en) 1973-09-05

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee