NL6817050A - - Google Patents

Info

Publication number
NL6817050A
NL6817050A NL6817050A NL6817050A NL6817050A NL 6817050 A NL6817050 A NL 6817050A NL 6817050 A NL6817050 A NL 6817050A NL 6817050 A NL6817050 A NL 6817050A NL 6817050 A NL6817050 A NL 6817050A
Authority
NL
Netherlands
Prior art keywords
fingers
frame member
bonded
aligned
integrated circuit
Prior art date
Application number
NL6817050A
Other languages
English (en)
Other versions
NL163899C (nl
NL163899B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6817050A publication Critical patent/NL6817050A/xx
Publication of NL163899B publication Critical patent/NL163899B/xx
Application granted granted Critical
Publication of NL163899C publication Critical patent/NL163899C/xx

Links

Classifications

    • H10P72/0446—
    • H10W70/421—
    • H10W70/442—
    • H10W72/30—
    • H10W76/157—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07633—
    • H10W72/655—

Landscapes

  • Die Bonding (AREA)
  • Push-Button Switches (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
NL6817050.A 1967-12-15 1968-11-28 Werkwijze voor het bevestigen van aansluitgeleiders aan op een halfgeleiderlichaam aangebrachte metalen aan- sluitgebied. NL163899C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69104167A 1967-12-15 1967-12-15

Publications (3)

Publication Number Publication Date
NL6817050A true NL6817050A (cg-RX-API-DMAC10.html) 1969-06-17
NL163899B NL163899B (nl) 1980-05-16
NL163899C NL163899C (nl) 1980-10-15

Family

ID=24774934

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6817050.A NL163899C (nl) 1967-12-15 1968-11-28 Werkwijze voor het bevestigen van aansluitgeleiders aan op een halfgeleiderlichaam aangebrachte metalen aan- sluitgebied.

Country Status (6)

Country Link
BE (1) BE725467A (cg-RX-API-DMAC10.html)
DE (1) DE1813164B2 (cg-RX-API-DMAC10.html)
FR (1) FR1599198A (cg-RX-API-DMAC10.html)
GB (1) GB1199849A (cg-RX-API-DMAC10.html)
IE (1) IE32531B1 (cg-RX-API-DMAC10.html)
NL (1) NL163899C (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices
DE2840973A1 (de) * 1978-09-20 1980-03-27 Siemens Ag Verfahren zur herstellung pruefbarer halbleiter-miniaturgehaeuse in bandform
US4721992A (en) * 1986-06-26 1988-01-26 National Semiconductor Corporation Hinge tape
KR102152906B1 (ko) * 2018-11-20 2020-09-09 세메스 주식회사 본딩 장치 및 본딩 방법

Also Published As

Publication number Publication date
BE725467A (cg-RX-API-DMAC10.html) 1969-06-13
NL163899C (nl) 1980-10-15
IE32531L (en) 1969-06-15
NL163899B (nl) 1980-05-16
DE1813164B2 (de) 1971-12-23
DE1813164A1 (de) 1969-07-03
FR1599198A (cg-RX-API-DMAC10.html) 1970-07-15
GB1199849A (en) 1970-07-22
IE32531B1 (en) 1973-09-05

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee