NL151560B - Werkwijze voor het vervaardigen van een halfgeleiderinrichting voorzien van een isolerende glaslaag en halfgeleiderinrichting vervaardigd volgens de werkwijze. - Google Patents

Werkwijze voor het vervaardigen van een halfgeleiderinrichting voorzien van een isolerende glaslaag en halfgeleiderinrichting vervaardigd volgens de werkwijze.

Info

Publication number
NL151560B
NL151560B NL707014024A NL7014024A NL151560B NL 151560 B NL151560 B NL 151560B NL 707014024 A NL707014024 A NL 707014024A NL 7014024 A NL7014024 A NL 7014024A NL 151560 B NL151560 B NL 151560B
Authority
NL
Netherlands
Prior art keywords
semi
conductor device
procedure
manufacture
glass layer
Prior art date
Application number
NL707014024A
Other languages
English (en)
Other versions
NL7014024A (nl
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26673563&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=NL151560(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Intel Corp filed Critical Intel Corp
Publication of NL7014024A publication Critical patent/NL7014024A/xx
Publication of NL151560B publication Critical patent/NL151560B/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76819—Smoothing of the dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/043—Dual dielectric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/133—Reflow oxides and glasses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
  • Formation Of Insulating Films (AREA)
  • Electrodes Of Semiconductors (AREA)
NL707014024A 1970-01-22 1970-09-23 Werkwijze voor het vervaardigen van een halfgeleiderinrichting voorzien van een isolerende glaslaag en halfgeleiderinrichting vervaardigd volgens de werkwijze. NL151560B (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US484170A 1970-01-22 1970-01-22
US00292510A US3825442A (en) 1970-01-22 1972-09-27 Method of a semiconductor device wherein film cracking is prevented by formation of a glass layer

Publications (2)

Publication Number Publication Date
NL7014024A NL7014024A (nl) 1971-07-26
NL151560B true NL151560B (nl) 1976-11-15

Family

ID=26673563

Family Applications (1)

Application Number Title Priority Date Filing Date
NL707014024A NL151560B (nl) 1970-01-22 1970-09-23 Werkwijze voor het vervaardigen van een halfgeleiderinrichting voorzien van een isolerende glaslaag en halfgeleiderinrichting vervaardigd volgens de werkwijze.

Country Status (5)

Country Link
US (1) US3825442A (nl)
DE (1) DE2040180B2 (nl)
FR (1) FR2077260B1 (nl)
GB (1) GB1326947A (nl)
NL (1) NL151560B (nl)

Families Citing this family (46)

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US3833919A (en) * 1972-10-12 1974-09-03 Ncr Multilevel conductor structure and method
US3986903A (en) * 1974-03-13 1976-10-19 Intel Corporation Mosfet transistor and method of fabrication
US4030952A (en) * 1974-04-18 1977-06-21 Fairchild Camera And Instrument Corporation Method of MOS circuit fabrication
US3887733A (en) * 1974-04-24 1975-06-03 Motorola Inc Doped oxide reflow process
US3912558A (en) * 1974-05-03 1975-10-14 Fairchild Camera Instr Co Method of MOS circuit fabrication
DE2445594A1 (de) * 1974-09-24 1976-04-08 Siemens Ag Verfahren zur herstellung integrierter schaltungen
JPS5142480A (en) * 1974-10-08 1976-04-10 Nippon Electric Co Handotaisochino seizohoho
GB1504484A (en) * 1975-08-13 1978-03-22 Tokyo Shibaura Electric Co Semiconductor device and a method for manufacturing the same
DE2634095C2 (de) * 1976-07-29 1982-11-04 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Abflachung und Einebnung von Stufen auf der Oberfläche einer integrierte Schaltungen aufweisenden Halbleiterscheibe
IT1089299B (it) 1977-01-26 1985-06-18 Mostek Corp Procedimento per fabbricare un dispositivo semiconduttore
US4183135A (en) * 1977-08-29 1980-01-15 Motorola, Inc. Hermetic glass encapsulation for semiconductor die and method
JPS5492175A (en) * 1977-12-29 1979-07-21 Fujitsu Ltd Manufacture of semiconductor device
US4214917A (en) * 1978-02-10 1980-07-29 Emm Semi Process of forming a semiconductor memory cell with continuous polysilicon run circuit elements
US4191603A (en) * 1978-05-01 1980-03-04 International Business Machines Corporation Making semiconductor structure with improved phosphosilicate glass isolation
US4251571A (en) * 1978-05-02 1981-02-17 International Business Machines Corporation Method for forming semiconductor structure with improved isolation between two layers of polycrystalline silicon
JPS54147789A (en) * 1978-05-11 1979-11-19 Matsushita Electric Ind Co Ltd Semiconductor divice and its manufacture
US4668973A (en) * 1978-06-19 1987-05-26 Rca Corporation Semiconductor device passivated with phosphosilicate glass over silicon nitride
USRE32351E (en) * 1978-06-19 1987-02-17 Rca Corporation Method of manufacturing a passivating composite comprising a silicon nitride (SI1 3N4) layer and a phosphosilicate glass (PSG) layer for a semiconductor device layer
JPS5534444A (en) * 1978-08-31 1980-03-11 Fujitsu Ltd Preparation of semiconductor device
US4206254A (en) * 1979-02-28 1980-06-03 International Business Machines Corporation Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern
US4355454A (en) * 1979-09-05 1982-10-26 Texas Instruments Incorporated Coating device with As2 -O3 -SiO2
DE2937993A1 (de) * 1979-09-20 1981-04-02 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von integrierten mos-halbleiterschaltungen nach der silizium-gate-technologie
JPS5669835A (en) * 1979-11-09 1981-06-11 Japan Electronic Ind Dev Assoc<Jeida> Method for forming thin film pattern
CA1174285A (en) * 1980-04-28 1984-09-11 Michelangelo Delfino Laser induced flow of integrated circuit structure materials
US4542037A (en) * 1980-04-28 1985-09-17 Fairchild Camera And Instrument Corporation Laser induced flow of glass bonded materials
US4284659A (en) * 1980-05-12 1981-08-18 Bell Telephone Laboratories Insulation layer reflow
JPS57126147A (en) * 1981-01-28 1982-08-05 Fujitsu Ltd Manufacture of semiconductor device
US4455325A (en) * 1981-03-16 1984-06-19 Fairchild Camera And Instrument Corporation Method of inducing flow or densification of phosphosilicate glass for integrated circuits
US4492717A (en) * 1981-07-27 1985-01-08 International Business Machines Corporation Method for forming a planarized integrated circuit
DE3130666A1 (de) * 1981-08-03 1983-02-17 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen integrieter mos-feldeffekttransistoren mit einer phosphorsilikatglasschicht als zwischenoxidschicht
DE3131050A1 (de) * 1981-08-05 1983-02-24 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von integrierten mos-feldeffekttransistoren unter verwendung einer aus phosphorsilikatglas bestehenden obewrflaechenschicht auf dem zwischenoxid zwischen polysiliziumebene und metall-leiterbahnebene
DE3133516A1 (de) * 1981-08-25 1983-03-17 Siemens AG, 1000 Berlin und 8000 München Verfahren zum verrunden des zwischenoxids zwischen polysiliziumebene und metall-leiterbahnebene beim herstellen von integrierten n-kanal-mos-feldeffekttransistoren
JPS58101442A (ja) * 1981-12-11 1983-06-16 Hitachi Ltd 電気的装置用基板
US4476621A (en) * 1983-02-01 1984-10-16 Gte Communications Products Corporation Process for making transistors with doped oxide densification
US4496608A (en) * 1984-03-02 1985-01-29 Xerox Corporation P-Glass reflow technique
US4663414A (en) * 1985-05-14 1987-05-05 Stauffer Chemical Company Phospho-boro-silanol interlayer dielectric films and preparation
DE3881074T2 (de) * 1987-02-27 1993-09-02 Toshiba Kawasaki Kk Nichtfluechtige, durch ultraviolette strahlung loeschbare halbleiterspeicheranordnung und verfahren zu ihrer herstellung.
US4784973A (en) * 1987-08-24 1988-11-15 Inmos Corporation Semiconductor contact silicide/nitride process with control for silicide thickness
US4948743A (en) * 1988-06-29 1990-08-14 Matsushita Electronics Corporation Method of manufacturing a semiconductor device
EP0388075B1 (en) * 1989-03-16 1996-11-06 STMicroelectronics, Inc. Contacts for semiconductor devices
JP2556138B2 (ja) * 1989-06-30 1996-11-20 日本電気株式会社 半導体装置の製造方法
JP3128811B2 (ja) * 1990-08-07 2001-01-29 セイコーエプソン株式会社 半導体装置の製造方法
JP3584338B2 (ja) * 1994-03-03 2004-11-04 ローム・ユーエスエー・インク 電気的に消去及びプログラム可能なデバイスの消去方法
US5419787A (en) * 1994-06-24 1995-05-30 The United States Of America As Represented By The Secretary Of The Air Force Stress reduced insulator
US5738931A (en) * 1994-09-16 1998-04-14 Kabushiki Kaisha Toshiba Electronic device and magnetic device
US6087733A (en) * 1998-06-12 2000-07-11 Intel Corporation Sacrificial erosion control features for chemical-mechanical polishing process

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US3383568A (en) * 1965-02-04 1968-05-14 Texas Instruments Inc Semiconductor device utilizing glass and oxides as an insulator for hermetically sealing the junctions
US3475234A (en) * 1967-03-27 1969-10-28 Bell Telephone Labor Inc Method for making mis structures
US3615941A (en) * 1968-05-07 1971-10-26 Hitachi Ltd Method for manufacturing semiconductor device with passivation film

Also Published As

Publication number Publication date
DE2040180A1 (de) 1971-07-29
DE2040180B2 (de) 1977-08-25
US3825442A (en) 1974-07-23
FR2077260A1 (nl) 1971-10-22
FR2077260B1 (nl) 1976-07-23
GB1326947A (en) 1973-08-15
NL7014024A (nl) 1971-07-26

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