NL1024074A1 - Inregelinstrument-evaluatiesysteem, inregelinstrument-evaluatiewerkwijze, een computerprogrammaproduct en een werkwijze voor het vervaardigen van een halfgeleiderinrichting. - Google Patents
Inregelinstrument-evaluatiesysteem, inregelinstrument-evaluatiewerkwijze, een computerprogrammaproduct en een werkwijze voor het vervaardigen van een halfgeleiderinrichting.Info
- Publication number
- NL1024074A1 NL1024074A1 NL1024074A NL1024074A NL1024074A1 NL 1024074 A1 NL1024074 A1 NL 1024074A1 NL 1024074 A NL1024074 A NL 1024074A NL 1024074 A NL1024074 A NL 1024074A NL 1024074 A1 NL1024074 A1 NL 1024074A1
- Authority
- NL
- Netherlands
- Prior art keywords
- balancing instrument
- instrument evaluation
- manufacturing
- semiconductor device
- computer program
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002234053A JP3875158B2 (ja) | 2002-08-09 | 2002-08-09 | 露光装置判定システム、露光装置判定方法、露光装置判定プログラム及び半導体装置の製造方法 |
JP2002234053 | 2002-08-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
NL1024074A1 true NL1024074A1 (nl) | 2004-02-10 |
NL1024074C2 NL1024074C2 (nl) | 2006-09-06 |
Family
ID=32019000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL1024074A NL1024074C2 (nl) | 2002-08-09 | 2003-08-08 | Inregelinstrument-evaluatiesysteem, inregelinstrument-evaluatiewerkwijze, een computerprogrammaproduct en een werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
Country Status (5)
Country | Link |
---|---|
US (2) | US7269470B2 (nl) |
JP (1) | JP3875158B2 (nl) |
CN (1) | CN100337239C (nl) |
NL (1) | NL1024074C2 (nl) |
TW (1) | TWI269942B (nl) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3875158B2 (ja) * | 2002-08-09 | 2007-01-31 | 株式会社東芝 | 露光装置判定システム、露光装置判定方法、露光装置判定プログラム及び半導体装置の製造方法 |
JP3959383B2 (ja) * | 2003-10-17 | 2007-08-15 | 株式会社東芝 | 露光装置補正システム、露光装置補正方法及び半導体装置製造方法 |
US20050240895A1 (en) * | 2004-04-20 | 2005-10-27 | Smith Adlai H | Method of emulation of lithographic projection tools |
US7448012B1 (en) | 2004-04-21 | 2008-11-04 | Qi-De Qian | Methods and system for improving integrated circuit layout |
KR100639676B1 (ko) * | 2004-09-21 | 2006-10-30 | 삼성전자주식회사 | 반도체 제조용 포토리소그라피 설비 제어시스템 및 그제어방법 |
US7148954B2 (en) * | 2005-03-23 | 2006-12-12 | Asml Netherlands B.V. | Lithographic apparatus and method for its use |
JP2007142275A (ja) | 2005-11-21 | 2007-06-07 | Toshiba Corp | フォトマスクの判定方法、半導体装置の製造方法及びプログラム |
JP4664232B2 (ja) * | 2006-05-16 | 2011-04-06 | 東京エレクトロン株式会社 | 熱処理板の温度設定方法,プログラム,プログラムを記録したコンピュータ読み取り可能な記録媒体及び熱処理板の温度設定装置 |
JP4664233B2 (ja) * | 2006-05-22 | 2011-04-06 | 東京エレクトロン株式会社 | 熱処理板の温度設定方法,プログラム,プログラムを記録したコンピュータ読み取り可能な記録媒体及び熱処理板の温度設定装置 |
JP4922112B2 (ja) | 2006-09-13 | 2012-04-25 | エーエスエムエル マスクツールズ ビー.ブイ. | パターン分解フィーチャのためのモデルベースopcを行うための方法および装置 |
JP4850664B2 (ja) * | 2006-11-02 | 2012-01-11 | 東京エレクトロン株式会社 | 熱処理板の温度設定方法、プログラム、プログラムを記録したコンピュータ読み取り可能な記録媒体及び熱処理板の温度設定装置 |
JP4796476B2 (ja) * | 2006-11-07 | 2011-10-19 | 東京エレクトロン株式会社 | 熱処理板の温度設定方法、プログラム、プログラムを記録したコンピュータ読み取り可能な記録媒体及び熱処理板の温度設定装置 |
JP5147284B2 (ja) * | 2007-05-11 | 2013-02-20 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US7910863B2 (en) | 2007-09-20 | 2011-03-22 | Tokyo Electron Limited | Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate |
JP5252932B2 (ja) | 2008-01-18 | 2013-07-31 | 株式会社東芝 | 半導体装置の製造方法 |
US9483959B2 (en) | 2008-08-21 | 2016-11-01 | Lincoln Global, Inc. | Welding simulator |
US8851896B2 (en) | 2008-08-21 | 2014-10-07 | Lincoln Global, Inc. | Virtual reality GTAW and pipe welding simulator and setup |
US9196169B2 (en) | 2008-08-21 | 2015-11-24 | Lincoln Global, Inc. | Importing and analyzing external data using a virtual reality welding system |
US9318026B2 (en) | 2008-08-21 | 2016-04-19 | Lincoln Global, Inc. | Systems and methods providing an enhanced user experience in a real-time simulated virtual reality welding environment |
US9280913B2 (en) | 2009-07-10 | 2016-03-08 | Lincoln Global, Inc. | Systems and methods providing enhanced education and training in a virtual reality environment |
JP2010182718A (ja) * | 2009-02-03 | 2010-08-19 | Toshiba Corp | 露光方法及び露光システム |
US8274013B2 (en) | 2009-03-09 | 2012-09-25 | Lincoln Global, Inc. | System for tracking and analyzing welding activity |
US9773429B2 (en) | 2009-07-08 | 2017-09-26 | Lincoln Global, Inc. | System and method for manual welder training |
US9011154B2 (en) | 2009-07-10 | 2015-04-21 | Lincoln Global, Inc. | Virtual welding system |
KR101732750B1 (ko) * | 2009-07-17 | 2017-05-24 | 케이엘에이-텐코 코포레이션 | 설계 및 결함 데이터를 사용한 스캐너 성능 비교 및 매칭 |
NL2008957A (en) * | 2011-07-08 | 2013-01-09 | Asml Netherlands Bv | Methods and systems for pattern design with tailored response to wavefront aberration. |
US9097978B2 (en) * | 2012-02-03 | 2015-08-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus to characterize photolithography lens quality |
US20130297061A1 (en) * | 2012-05-03 | 2013-11-07 | National Taiwan University | Method and computer-aided design system of manufacturing an optical system |
US20160093233A1 (en) | 2012-07-06 | 2016-03-31 | Lincoln Global, Inc. | System for characterizing manual welding operations on pipe and other curved structures |
US9767712B2 (en) * | 2012-07-10 | 2017-09-19 | Lincoln Global, Inc. | Virtual reality pipe welding simulator and setup |
US10930174B2 (en) | 2013-05-24 | 2021-02-23 | Lincoln Global, Inc. | Systems and methods providing a computerized eyewear device to aid in welding |
US20150072323A1 (en) | 2013-09-11 | 2015-03-12 | Lincoln Global, Inc. | Learning management system for a real-time simulated virtual reality welding training environment |
US10083627B2 (en) | 2013-11-05 | 2018-09-25 | Lincoln Global, Inc. | Virtual reality and real welding training system and method |
US9836987B2 (en) | 2014-02-14 | 2017-12-05 | Lincoln Global, Inc. | Virtual reality pipe welding simulator and setup |
CN106233358A (zh) | 2014-06-02 | 2016-12-14 | 林肯环球股份有限公司 | 用于人工焊工培训的系统和方法 |
EP3319066A1 (en) | 2016-11-04 | 2018-05-09 | Lincoln Global, Inc. | Magnetic frequency selection for electromagnetic position tracking |
US10878591B2 (en) | 2016-11-07 | 2020-12-29 | Lincoln Global, Inc. | Welding trainer utilizing a head up display to display simulated and real-world objects |
US10913125B2 (en) | 2016-11-07 | 2021-02-09 | Lincoln Global, Inc. | Welding system providing visual and audio cues to a welding helmet with a display |
US10997872B2 (en) | 2017-06-01 | 2021-05-04 | Lincoln Global, Inc. | Spring-loaded tip assembly to support simulated shielded metal arc welding |
KR101959627B1 (ko) * | 2017-06-12 | 2019-03-18 | 에스케이 주식회사 | 실제 반도체 제조물을 복제한 가상 반도체 제조물 제공 방법 및 시스템 |
US11557223B2 (en) | 2018-04-19 | 2023-01-17 | Lincoln Global, Inc. | Modular and reconfigurable chassis for simulated welding training |
US11475792B2 (en) | 2018-04-19 | 2022-10-18 | Lincoln Global, Inc. | Welding simulator with dual-user configuration |
US11035980B2 (en) * | 2018-07-24 | 2021-06-15 | Faro Technologies, Inc. | Laser scanner with projector |
US11379633B2 (en) * | 2019-06-05 | 2022-07-05 | X Development Llc | Cascading models for optimization of fabrication and design of a physical device |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3289319B2 (ja) | 1992-06-22 | 2002-06-04 | 株式会社ニコン | リソグラフィ方法及び該方法を用いた露光装置、及び露光方法 |
JPH07134393A (ja) | 1993-06-29 | 1995-05-23 | Nikon Corp | リソグラフィ・システム |
US5675495A (en) * | 1995-05-18 | 1997-10-07 | Hella K.G. Hueck & Co. | Process for the design of free form reflectors which accounts for manufacturing tolerances |
JPH08334888A (ja) | 1995-06-07 | 1996-12-17 | Hitachi Ltd | マスクパターンデータ検査装置、及びマスクパターンデータ最適設計装置 |
JP3331822B2 (ja) | 1995-07-17 | 2002-10-07 | ソニー株式会社 | マスクパターン補正方法とそれを用いたマスク、露光方法および半導体装置 |
JPH09162107A (ja) * | 1995-12-11 | 1997-06-20 | Nikon Corp | 投影露光方法 |
JP3934719B2 (ja) * | 1995-12-22 | 2007-06-20 | 株式会社東芝 | 光近接効果補正方法 |
JP3348586B2 (ja) * | 1995-12-28 | 2002-11-20 | ソニー株式会社 | 電子線リソグラフィ技術における近接効果補正法 |
US5801954A (en) * | 1996-04-24 | 1998-09-01 | Micron Technology, Inc. | Process for designing and checking a mask layout |
US5862058A (en) * | 1996-05-16 | 1999-01-19 | International Business Machines Corporation | Optical proximity correction method and system |
JP4313856B2 (ja) | 1997-02-28 | 2009-08-12 | 株式会社東芝 | 半導体装置の製造方法 |
JP4131880B2 (ja) | 1997-07-31 | 2008-08-13 | 株式会社東芝 | マスクデータ作成方法及びマスクデータ作成装置 |
JP3274396B2 (ja) * | 1997-11-07 | 2002-04-15 | 株式会社東芝 | パターン測定方法 |
TW513617B (en) * | 1999-04-21 | 2002-12-11 | Asml Corp | Lithographic projection apparatus and method of manufacturing a device using a lithographic projection apparatus |
JP2003500847A (ja) * | 1999-05-20 | 2003-01-07 | マイクロニック レーザー システムズ アクチボラゲット | リソグラフィに於ける誤差低減方法 |
JP2001085317A (ja) | 1999-09-17 | 2001-03-30 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JP3348419B2 (ja) * | 1999-09-24 | 2002-11-20 | 株式会社東芝 | 収差測定方法、収差測定システム及び収差測定マスク |
JP2002041126A (ja) * | 2000-07-27 | 2002-02-08 | Toshiba Corp | 半導体デバイスの生産方法及び生産システム |
JP2002132986A (ja) | 2000-10-18 | 2002-05-10 | Canon Inc | 情報提供方法及び情報提供システム |
JP2002184667A (ja) | 2000-12-14 | 2002-06-28 | Nikon Corp | 補正部材の製造方法、投影光学系の製造方法および露光装置の調整方法 |
JP2002190443A (ja) | 2000-12-20 | 2002-07-05 | Hitachi Ltd | 露光方法およびその露光システム |
JP3927003B2 (ja) * | 2001-06-27 | 2007-06-06 | 株式会社東芝 | 露光方法 |
JP2003031477A (ja) * | 2001-07-17 | 2003-01-31 | Hitachi Ltd | 半導体装置の製造方法およびシステム |
JP4073735B2 (ja) * | 2001-08-23 | 2008-04-09 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置の投影システムの収差を測定する方法、およびデバイス製造方法 |
JP3875158B2 (ja) * | 2002-08-09 | 2007-01-31 | 株式会社東芝 | 露光装置判定システム、露光装置判定方法、露光装置判定プログラム及び半導体装置の製造方法 |
-
2002
- 2002-08-09 JP JP2002234053A patent/JP3875158B2/ja not_active Expired - Lifetime
-
2003
- 2003-08-05 CN CNB031532020A patent/CN100337239C/zh not_active Expired - Fee Related
- 2003-08-05 TW TW092121376A patent/TWI269942B/zh not_active IP Right Cessation
- 2003-08-08 US US10/636,625 patent/US7269470B2/en active Active
- 2003-08-08 NL NL1024074A patent/NL1024074C2/nl not_active IP Right Cessation
-
2007
- 2007-08-03 US US11/882,620 patent/US7546178B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20070288113A1 (en) | 2007-12-13 |
US20040088071A1 (en) | 2004-05-06 |
TWI269942B (en) | 2007-01-01 |
NL1024074C2 (nl) | 2006-09-06 |
CN1480788A (zh) | 2004-03-10 |
US7269470B2 (en) | 2007-09-11 |
US7546178B2 (en) | 2009-06-09 |
CN100337239C (zh) | 2007-09-12 |
TW200406648A (en) | 2004-05-01 |
JP2004079586A (ja) | 2004-03-11 |
JP3875158B2 (ja) | 2007-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NL1024074A1 (nl) | Inregelinstrument-evaluatiesysteem, inregelinstrument-evaluatiewerkwijze, een computerprogrammaproduct en een werkwijze voor het vervaardigen van een halfgeleiderinrichting. | |
DE602004029632D1 (de) | Kollisionsdetektionsvorrichtung, Kollisionsdetektionsverfahren und Computerprogramm | |
NL1022452A1 (nl) | Werkwijze en inrichting voor het verwerken van ingangssignalen van een weergeefinrichting. | |
DE602004018445D1 (de) | Navigationsvorrichtung, Verfahren und Computerprogramm | |
TWI320536B (en) | Method and system for finding an equivalent circuit representation for one or more elements in an integrated circuit, and computer program product thereof | |
NL1032187A1 (nl) | Werkwijze voor het genereren van een maskerpatroon, systeem voor het genereren van een maskerpatroon en computerprogrammaproduct. | |
EP1636667A4 (en) | SYSTEMS, METHODS, AND COMPUTER PROGRAM PRODUCTS FOR THE MODELING OF UNCERTAIN FUTURE BENEFITS | |
NL1029167A1 (nl) | Werkwijzen en systemen voor gegevensintegratie. | |
NL1027363A1 (nl) | Werkwijze en inrichting voor Z-asvolgwerking en collimatie. | |
NL1029261A1 (nl) | Inrichting en werkwijze voor het bewerken van een kleurensignaal. | |
AU2003289109A1 (en) | Information processing device, information processing method, and computer program | |
AU2003289110A1 (en) | Information processing device, information processing method, and computer program | |
NL1022210A1 (nl) | Systeem voor het vervaardigen van halfgeleiderproducten. | |
DE602005019019D1 (de) | Informationsverarbeitungsvorrichtung, Informationsverarbeitungsverfahren, Halbleiterbauelement und Computerprogramm | |
EP1603047A4 (en) | INFORMATION PROCESSING DEVICE AND METHOD, AND COMPUTER PROGRAM | |
NL1024689A1 (nl) | Werkwijze en inrichting voor het detecteren van structurele, perfusie-, en functionele afwijkingen. | |
NL1027723A1 (nl) | Werkwijze, inrichting, computerprogramma en computerprogrammaproduct voor het beheren van een digitale informatietechnologie-IT-infrastructuur. | |
EP1607937A4 (en) | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND COMPUTER PROGRAM | |
DE602006014131D1 (de) | Klassifikationswörterbuch-aktualisierungsvorrichtung, computerprogrammprodukt dafür und verfahren zu | |
NL1028888A1 (nl) | Inrichting voor ontvlechten en werkwijze met gebruikmaking van gedetecteerde lijnbibber. | |
AU2003289111A1 (en) | Information processing device, information processing method, and computer program | |
NL1026665A1 (nl) | Reticule, inrichting voor het bewaken van een optisch stelsel, werkwijze voor het bewaken van een optisch stelsel en werkwijze voor het vervaardigen van een reticule. | |
EP1722303A4 (en) | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND COMPUTER PROGRAM | |
DE60330762D1 (de) | Datenverarbeitungssystem, datenverarbeitungsverfahren, datenverarbeitungseinrichtung und datenverarbeitungsprogramm | |
DE60301103D1 (de) | Sitzsteuerungseinrichtung, -verfahren und -computerprogramm |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AD1A | A request for search or an international type search has been filed | ||
RD2N | Patents in respect of which a decision has been taken or a report has been made (novelty report) |
Effective date: 20060502 |
|
PD2B | A search report has been drawn up | ||
MM | Lapsed because of non-payment of the annual fee |
Effective date: 20170901 |