MY7400320A - Thermal fatigue-free semiconductor device - Google Patents

Thermal fatigue-free semiconductor device

Info

Publication number
MY7400320A
MY7400320A MY320/74A MY7400320A MY7400320A MY 7400320 A MY7400320 A MY 7400320A MY 320/74 A MY320/74 A MY 320/74A MY 7400320 A MY7400320 A MY 7400320A MY 7400320 A MY7400320 A MY 7400320A
Authority
MY
Malaysia
Prior art keywords
semiconductor device
thermal fatigue
free semiconductor
enclosure
substrate
Prior art date
Application number
MY320/74A
Other languages
English (en)
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of MY7400320A publication Critical patent/MY7400320A/xx

Links

Classifications

    • H10W76/132—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/352—
    • H10W72/884—
    • H10W90/753—
    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
MY320/74A 1971-08-26 1974-12-30 Thermal fatigue-free semiconductor device MY7400320A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17519671A 1971-08-26 1971-08-26

Publications (1)

Publication Number Publication Date
MY7400320A true MY7400320A (en) 1974-12-31

Family

ID=22639336

Family Applications (1)

Application Number Title Priority Date Filing Date
MY320/74A MY7400320A (en) 1971-08-26 1974-12-30 Thermal fatigue-free semiconductor device

Country Status (11)

Country Link
US (1) US3735208A (enExample)
JP (1) JPS4831056A (enExample)
AU (1) AU463308B2 (enExample)
BE (1) BE787811A (enExample)
CA (1) CA967291A (enExample)
DE (1) DE2240468A1 (enExample)
FR (1) FR2150488B1 (enExample)
GB (1) GB1341648A (enExample)
IT (1) IT963530B (enExample)
MY (1) MY7400320A (enExample)
NL (1) NL7211633A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187736A (enExample) * 1975-01-31 1976-07-31 Hitachi Ltd
GB2132413A (en) * 1982-12-24 1984-07-04 Plessey Co Plc Microwave device package
US4486511A (en) * 1983-06-27 1984-12-04 National Semiconductor Corporation Solder composition for thin coatings
CH662007A5 (en) * 1983-12-21 1987-08-31 Bbc Brown Boveri & Cie Method of soldering semiconductor components
JPS60234346A (ja) * 1984-05-07 1985-11-21 Nec Corp 半導体装置
US6583673B2 (en) * 2001-02-26 2003-06-24 Infineon Technologies Ag Stability enhanced multistage power amplifier
JP6239840B2 (ja) * 2013-03-27 2017-11-29 ローム株式会社 半導体装置および半導体装置の製造方法
US10319654B1 (en) * 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1048358B (enExample) * 1955-08-12 1959-01-08
US2986678A (en) * 1957-06-20 1961-05-30 Motorola Inc Semiconductor device
NL244815A (enExample) * 1959-02-09
GB1064290A (en) * 1963-01-14 1967-04-05 Motorola Inc Method of making semiconductor devices
GB1030540A (en) * 1964-01-02 1966-05-25 Gen Electric Improvements in and relating to semi-conductor diodes
US3331997A (en) * 1964-12-31 1967-07-18 Wagner Electric Corp Silicon diode with solder composition attaching ohmic contacts

Also Published As

Publication number Publication date
FR2150488B1 (enExample) 1976-01-23
FR2150488A1 (enExample) 1973-04-06
CA967291A (en) 1975-05-06
US3735208A (en) 1973-05-22
AU463308B2 (en) 1975-07-24
AU4573272A (en) 1974-03-07
BE787811A (fr) 1972-12-18
IT963530B (it) 1974-01-21
DE2240468A1 (de) 1973-03-01
NL7211633A (enExample) 1973-02-28
JPS4831056A (enExample) 1973-04-24
GB1341648A (en) 1973-12-25

Similar Documents

Publication Publication Date Title
JPS5624376B2 (enExample)
ES389451A1 (es) Perfeccionamientos en los componentes semiconductores y procedimiento de fabricacion correspondiente.
CA975870A (en) High heat dissipation solder-reflow flip chip transistor
MY7400320A (en) Thermal fatigue-free semiconductor device
JPS516515B1 (enExample)
GB1305156A (enExample)
GB1210584A (en) Semiconductor device and method of manufacturing the same
JPS53135579A (en) Liquid sealing semiconductor device
AU476330B2 (en) Semiconductor device having an electroluminescent diode
AU466371B2 (en) Device for mechanically and/or electrically connecting a semiconductor device toa substrate
GB998637A (en) Electronic devices
GB969483A (en) Improvements in or relating to semiconductor assemblies and methods of forming such assemblies
GB1371828A (en) Mounting for temperature-senstive electrical device
GB1015907A (en) Improvements in electrical components
AU467762B2 (en) Semiconductor device employing high temperature metal grid
GB822678A (en) Improvements in and relating to semi-conductive devices
CA837296A (en) Encapsuled electronic semiconductor device
GB1139543A (en) Construction of semiconductor junction diodes
CA859944A (en) Semiconductor device with integral heat dissipators
CA860542A (en) Microwave generating semiconductor device
CA835593A (en) Electronic semiconductor device
CA871898A (en) Semiconductor device and circuit
GB1152357A (en) Headers for Semiconductor Devices
ES247600A1 (es) Un dispositivo semi-conductor
CA836794A (en) Epoxy encapsulated semiconductor device