BE787811A - Dispositif semiconducteur insensible a la fatigue thermique - Google Patents

Dispositif semiconducteur insensible a la fatigue thermique

Info

Publication number
BE787811A
BE787811A BE787811A BE787811A BE787811A BE 787811 A BE787811 A BE 787811A BE 787811 A BE787811 A BE 787811A BE 787811 A BE787811 A BE 787811A BE 787811 A BE787811 A BE 787811A
Authority
BE
Belgium
Prior art keywords
semiconductor device
thermal fatigue
device insensitive
insensitive
fatigue
Prior art date
Application number
BE787811A
Other languages
English (en)
French (fr)
Inventor
A E Roswell
G K Clymer
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of BE787811A publication Critical patent/BE787811A/xx

Links

Classifications

    • H10W76/132—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/352—
    • H10W72/884—
    • H10W90/753—
    • H10W90/754—
BE787811A 1971-08-26 1972-08-21 Dispositif semiconducteur insensible a la fatigue thermique BE787811A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17519671A 1971-08-26 1971-08-26

Publications (1)

Publication Number Publication Date
BE787811A true BE787811A (fr) 1972-12-18

Family

ID=22639336

Family Applications (1)

Application Number Title Priority Date Filing Date
BE787811A BE787811A (fr) 1971-08-26 1972-08-21 Dispositif semiconducteur insensible a la fatigue thermique

Country Status (11)

Country Link
US (1) US3735208A (enExample)
JP (1) JPS4831056A (enExample)
AU (1) AU463308B2 (enExample)
BE (1) BE787811A (enExample)
CA (1) CA967291A (enExample)
DE (1) DE2240468A1 (enExample)
FR (1) FR2150488B1 (enExample)
GB (1) GB1341648A (enExample)
IT (1) IT963530B (enExample)
MY (1) MY7400320A (enExample)
NL (1) NL7211633A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187736A (enExample) * 1975-01-31 1976-07-31 Hitachi Ltd
GB2132413A (en) * 1982-12-24 1984-07-04 Plessey Co Plc Microwave device package
US4486511A (en) * 1983-06-27 1984-12-04 National Semiconductor Corporation Solder composition for thin coatings
CH662007A5 (en) * 1983-12-21 1987-08-31 Bbc Brown Boveri & Cie Method of soldering semiconductor components
JPS60234346A (ja) * 1984-05-07 1985-11-21 Nec Corp 半導体装置
US6583673B2 (en) * 2001-02-26 2003-06-24 Infineon Technologies Ag Stability enhanced multistage power amplifier
JP6239840B2 (ja) * 2013-03-27 2017-11-29 ローム株式会社 半導体装置および半導体装置の製造方法
US10319654B1 (en) * 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1048358B (enExample) * 1955-08-12 1959-01-08
US2986678A (en) * 1957-06-20 1961-05-30 Motorola Inc Semiconductor device
NL244815A (enExample) * 1959-02-09
GB1064290A (en) * 1963-01-14 1967-04-05 Motorola Inc Method of making semiconductor devices
GB1030540A (en) * 1964-01-02 1966-05-25 Gen Electric Improvements in and relating to semi-conductor diodes
US3331997A (en) * 1964-12-31 1967-07-18 Wagner Electric Corp Silicon diode with solder composition attaching ohmic contacts

Also Published As

Publication number Publication date
FR2150488B1 (enExample) 1976-01-23
FR2150488A1 (enExample) 1973-04-06
CA967291A (en) 1975-05-06
US3735208A (en) 1973-05-22
AU463308B2 (en) 1975-07-24
MY7400320A (en) 1974-12-31
AU4573272A (en) 1974-03-07
IT963530B (it) 1974-01-21
DE2240468A1 (de) 1973-03-01
NL7211633A (enExample) 1973-02-28
JPS4831056A (enExample) 1973-04-24
GB1341648A (en) 1973-12-25

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