NL7211633A - - Google Patents

Info

Publication number
NL7211633A
NL7211633A NL7211633A NL7211633A NL7211633A NL 7211633 A NL7211633 A NL 7211633A NL 7211633 A NL7211633 A NL 7211633A NL 7211633 A NL7211633 A NL 7211633A NL 7211633 A NL7211633 A NL 7211633A
Authority
NL
Netherlands
Prior art keywords
enclosure
substrate
die
solder
sealed
Prior art date
Application number
NL7211633A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7211633A publication Critical patent/NL7211633A/xx

Links

Classifications

    • H10W76/132—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/352—
    • H10W72/884—
    • H10W90/753—
    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
NL7211633A 1971-08-26 1972-08-25 NL7211633A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17519671A 1971-08-26 1971-08-26

Publications (1)

Publication Number Publication Date
NL7211633A true NL7211633A (enExample) 1973-02-28

Family

ID=22639336

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7211633A NL7211633A (enExample) 1971-08-26 1972-08-25

Country Status (11)

Country Link
US (1) US3735208A (enExample)
JP (1) JPS4831056A (enExample)
AU (1) AU463308B2 (enExample)
BE (1) BE787811A (enExample)
CA (1) CA967291A (enExample)
DE (1) DE2240468A1 (enExample)
FR (1) FR2150488B1 (enExample)
GB (1) GB1341648A (enExample)
IT (1) IT963530B (enExample)
MY (1) MY7400320A (enExample)
NL (1) NL7211633A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187736A (enExample) * 1975-01-31 1976-07-31 Hitachi Ltd
GB2132413A (en) * 1982-12-24 1984-07-04 Plessey Co Plc Microwave device package
US4486511A (en) * 1983-06-27 1984-12-04 National Semiconductor Corporation Solder composition for thin coatings
CH662007A5 (en) * 1983-12-21 1987-08-31 Bbc Brown Boveri & Cie Method of soldering semiconductor components
JPS60234346A (ja) * 1984-05-07 1985-11-21 Nec Corp 半導体装置
US6583673B2 (en) * 2001-02-26 2003-06-24 Infineon Technologies Ag Stability enhanced multistage power amplifier
JP6239840B2 (ja) * 2013-03-27 2017-11-29 ローム株式会社 半導体装置および半導体装置の製造方法
US10319654B1 (en) * 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1048358B (enExample) * 1955-08-12 1959-01-08
US2986678A (en) * 1957-06-20 1961-05-30 Motorola Inc Semiconductor device
NL244815A (enExample) * 1959-02-09
GB1064290A (en) * 1963-01-14 1967-04-05 Motorola Inc Method of making semiconductor devices
GB1030540A (en) * 1964-01-02 1966-05-25 Gen Electric Improvements in and relating to semi-conductor diodes
US3331997A (en) * 1964-12-31 1967-07-18 Wagner Electric Corp Silicon diode with solder composition attaching ohmic contacts

Also Published As

Publication number Publication date
FR2150488B1 (enExample) 1976-01-23
FR2150488A1 (enExample) 1973-04-06
CA967291A (en) 1975-05-06
US3735208A (en) 1973-05-22
AU463308B2 (en) 1975-07-24
MY7400320A (en) 1974-12-31
AU4573272A (en) 1974-03-07
BE787811A (fr) 1972-12-18
IT963530B (it) 1974-01-21
DE2240468A1 (de) 1973-03-01
JPS4831056A (enExample) 1973-04-24
GB1341648A (en) 1973-12-25

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Legal Events

Date Code Title Description
BV The patent application has lapsed