JPS516515B1 - - Google Patents

Info

Publication number
JPS516515B1
JPS516515B1 JP47031247A JP3124772A JPS516515B1 JP S516515 B1 JPS516515 B1 JP S516515B1 JP 47031247 A JP47031247 A JP 47031247A JP 3124772 A JP3124772 A JP 3124772A JP S516515 B1 JPS516515 B1 JP S516515B1
Authority
JP
Japan
Prior art keywords
cross
cross under
region
hermetic seal
seal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47031247A
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS516515B1 publication Critical patent/JPS516515B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP47031247A 1971-04-01 1972-03-30 Pending JPS516515B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13033971A 1971-04-01 1971-04-01

Publications (1)

Publication Number Publication Date
JPS516515B1 true JPS516515B1 (enExample) 1976-02-28

Family

ID=22444221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47031247A Pending JPS516515B1 (enExample) 1971-04-01 1972-03-30

Country Status (2)

Country Link
US (1) US3748543A (enExample)
JP (1) JPS516515B1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548700B2 (enExample) * 1973-01-30 1980-12-08
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device
EP0069733A1 (en) * 1981-01-15 1983-01-19 Mostek Corporation Integrated circuit package
FR2527837A1 (fr) * 1982-05-25 1983-12-02 Thomson Csf Boitier d'encapsulation d'un dispositif semi-conducteur fonctionnant a tres haute tension, et son procede de fabrication
US5381037A (en) * 1993-06-03 1995-01-10 Advanced Micro Devices, Inc. Lead frame with selected inner leads coupled to an inner frame member for an integrated circuit package assemblies
CN1117395C (zh) * 1994-03-18 2003-08-06 日立化成工业株式会社 半导体组件的制造方法及半导体组件
KR20040015114A (ko) * 2001-04-23 2004-02-18 가부시끼가이샤 도시바 화상 표시 장치, 화상 표시 장치의 제조 방법 및 제조 장치
US7836586B2 (en) * 2008-08-21 2010-11-23 National Semiconductor Corporation Thin foil semiconductor package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3158788A (en) * 1960-08-15 1964-11-24 Fairchild Camera Instr Co Solid-state circuitry having discrete regions of semi-conductor material isolated by an insulating material
US3189973A (en) * 1961-11-27 1965-06-22 Bell Telephone Labor Inc Method of fabricating a semiconductor device
DE1249466B (enExample) * 1963-10-29 1900-01-01
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
US3489956A (en) * 1966-09-30 1970-01-13 Nippon Electric Co Semiconductor device container

Also Published As

Publication number Publication date
US3748543A (en) 1973-07-24

Similar Documents

Publication Publication Date Title
GB1238569A (enExample)
GB1341294A (en) Electronic header system having omni-directional heat dissipating characteristics
KR880003419A (ko) 반도체 장치
KR900701039A (ko) 집적회로 칩용 밀봉형 팩키지
KR950004467A (ko) 반도체장치 및 그 제조방법
GB1252055A (enExample)
GB1292636A (en) Semiconductor devices and methods for their fabrication
JPS516515B1 (enExample)
GB1038007A (en) Electrical assembly
GB1382203A (en) Package for microwave semiconductor device
GB1214200A (en) Improvements in or relating to semiconductor devices
GB1240977A (en) Improvements in or relating to semiconductor components
US3303265A (en) Miniature semiconductor enclosure
GB1098752A (en) A semiconductor device
MY7400320A (en) Thermal fatigue-free semiconductor device
JPS5683048A (en) Semiconductor device
US4190735A (en) Semiconductor device package
KR970053693A (ko) 테 부재로 봉합된 교화체로 약한 장치를 패키지하는 방법
KR890013753A (ko) 반도체장치
GB1210584A (en) Semiconductor device and method of manufacturing the same
JPS55140250A (en) Semiconductor device
JPS56165341A (en) Semiconductor device
JPS5735354A (en) Sealing method for semiconductor housing container
GB2013027A (en) Integrated circuit packages
KR920010862A (ko) 반도체 장치 및 이것에 사용되는 리드프레임