GB1341648A - Thermal fatigue-free semiconductor device - Google Patents

Thermal fatigue-free semiconductor device

Info

Publication number
GB1341648A
GB1341648A GB3806672A GB3806672A GB1341648A GB 1341648 A GB1341648 A GB 1341648A GB 3806672 A GB3806672 A GB 3806672A GB 3806672 A GB3806672 A GB 3806672A GB 1341648 A GB1341648 A GB 1341648A
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
thermal fatigue
free semiconductor
enclosure
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3806672A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of GB1341648A publication Critical patent/GB1341648A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB3806672A 1971-08-26 1972-08-15 Thermal fatigue-free semiconductor device Expired GB1341648A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17519671A 1971-08-26 1971-08-26

Publications (1)

Publication Number Publication Date
GB1341648A true GB1341648A (en) 1973-12-25

Family

ID=22639336

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3806672A Expired GB1341648A (en) 1971-08-26 1972-08-15 Thermal fatigue-free semiconductor device

Country Status (11)

Country Link
US (1) US3735208A (enExample)
JP (1) JPS4831056A (enExample)
AU (1) AU463308B2 (enExample)
BE (1) BE787811A (enExample)
CA (1) CA967291A (enExample)
DE (1) DE2240468A1 (enExample)
FR (1) FR2150488B1 (enExample)
GB (1) GB1341648A (enExample)
IT (1) IT963530B (enExample)
MY (1) MY7400320A (enExample)
NL (1) NL7211633A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2132413A (en) * 1982-12-24 1984-07-04 Plessey Co Plc Microwave device package

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187736A (enExample) * 1975-01-31 1976-07-31 Hitachi Ltd
US4486511A (en) * 1983-06-27 1984-12-04 National Semiconductor Corporation Solder composition for thin coatings
CH662007A5 (en) * 1983-12-21 1987-08-31 Bbc Brown Boveri & Cie Method of soldering semiconductor components
JPS60234346A (ja) * 1984-05-07 1985-11-21 Nec Corp 半導体装置
US6583673B2 (en) * 2001-02-26 2003-06-24 Infineon Technologies Ag Stability enhanced multistage power amplifier
JP6239840B2 (ja) * 2013-03-27 2017-11-29 ローム株式会社 半導体装置および半導体装置の製造方法
US10319654B1 (en) * 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1048358B (enExample) * 1955-08-12 1959-01-08
US2986678A (en) * 1957-06-20 1961-05-30 Motorola Inc Semiconductor device
BE584431A (enExample) * 1959-02-09
GB1064290A (en) * 1963-01-14 1967-04-05 Motorola Inc Method of making semiconductor devices
GB1030540A (en) * 1964-01-02 1966-05-25 Gen Electric Improvements in and relating to semi-conductor diodes
US3331997A (en) * 1964-12-31 1967-07-18 Wagner Electric Corp Silicon diode with solder composition attaching ohmic contacts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2132413A (en) * 1982-12-24 1984-07-04 Plessey Co Plc Microwave device package

Also Published As

Publication number Publication date
FR2150488B1 (enExample) 1976-01-23
NL7211633A (enExample) 1973-02-28
JPS4831056A (enExample) 1973-04-24
AU463308B2 (en) 1975-07-24
BE787811A (fr) 1972-12-18
US3735208A (en) 1973-05-22
CA967291A (en) 1975-05-06
IT963530B (it) 1974-01-21
FR2150488A1 (enExample) 1973-04-06
DE2240468A1 (de) 1973-03-01
AU4573272A (en) 1974-03-07
MY7400320A (en) 1974-12-31

Similar Documents

Publication Publication Date Title
JPS5624376B2 (enExample)
CA975870A (en) High heat dissipation solder-reflow flip chip transistor
MY7400320A (en) Thermal fatigue-free semiconductor device
IT995781B (it) Dispositivi semiconduttori
GB1305156A (enExample)
GB1210584A (en) Semiconductor device and method of manufacturing the same
CA966573A (en) Semiconductor device having an electroluminescent diode
AU466371B2 (en) Device for mechanically and/or electrically connecting a semiconductor device toa substrate
GB969483A (en) Improvements in or relating to semiconductor assemblies and methods of forming such assemblies
GB1371828A (en) Mounting for temperature-senstive electrical device
GB1015907A (en) Improvements in electrical components
GB822678A (en) Improvements in and relating to semi-conductive devices
CA837296A (en) Encapsuled electronic semiconductor device
GB1139543A (en) Construction of semiconductor junction diodes
CA859944A (en) Semiconductor device with integral heat dissipators
AU3660171A (en) Semiconductor device employing high temperature metal grid
CA860542A (en) Microwave generating semiconductor device
CA835593A (en) Electronic semiconductor device
CA871898A (en) Semiconductor device and circuit
GB1152357A (en) Headers for Semiconductor Devices
ES247600A1 (es) Un dispositivo semi-conductor
GB1097268A (en) Housing for semiconductor dices
CA836794A (en) Epoxy encapsulated semiconductor device
CA852390A (en) Semiconductor device and circuit arrangement comprising a semiconductor device
CA848553A (en) Semiconductor device and circuit

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee