MY205472A - Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board - Google Patents

Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board

Info

Publication number
MY205472A
MY205472A MYPI2021002226A MYPI2021002226A MY205472A MY 205472 A MY205472 A MY 205472A MY PI2021002226 A MYPI2021002226 A MY PI2021002226A MY PI2021002226 A MYPI2021002226 A MY PI2021002226A MY 205472 A MY205472 A MY 205472A
Authority
MY
Malaysia
Prior art keywords
copper foil
treated
copper
carrier
wiring board
Prior art date
Application number
MYPI2021002226A
Other languages
English (en)
Inventor
Mitsuyoshi Matsuda
Tsubasa Kato
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY205472A publication Critical patent/MY205472A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
MYPI2021002226A 2018-11-19 2019-10-02 Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board MY205472A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018216720 2018-11-19
PCT/JP2019/038866 WO2020105289A1 (ja) 2018-11-19 2019-10-02 表面処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
MY205472A true MY205472A (en) 2024-10-22

Family

ID=70773985

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021002226A MY205472A (en) 2018-11-19 2019-10-02 Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board

Country Status (6)

Country Link
JP (1) JP7453154B2 (ja)
KR (1) KR102802888B1 (ja)
CN (1) CN112969824B (ja)
MY (1) MY205472A (ja)
TW (1) TWI740231B (ja)
WO (1) WO2020105289A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022255420A1 (ja) * 2021-06-03 2022-12-08
US12060647B2 (en) 2021-07-06 2024-08-13 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
US11540389B1 (en) 2021-07-06 2022-12-27 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
TWI756155B (zh) 2021-07-19 2022-02-21 長春石油化學股份有限公司 表面處理銅箔及銅箔基板
EP4404280A4 (en) * 2021-09-14 2025-09-03 Kaneka Corp SOLAR CELL
CN113943954B (zh) * 2021-12-01 2023-06-30 青海诺德新材料有限公司 一种2-3微米无针孔载体电解铜箔的制备方法
WO2023190833A1 (ja) 2022-03-30 2023-10-05 古河電気工業株式会社 表面処理銅箔、銅張積層板、及びプリント配線板
WO2024070248A1 (ja) * 2022-09-28 2024-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
CN120677846A (zh) * 2023-03-23 2025-09-19 三井金属矿业株式会社 印刷电路板的制造方法
JPWO2024195539A1 (ja) * 2023-03-23 2024-09-26
CN120835943A (zh) * 2023-03-27 2025-10-24 三菱综合材料株式会社 带覆膜的铜端子材及其制造方法
WO2024203977A1 (ja) * 2023-03-30 2024-10-03 宇部エクシモ株式会社 フレキシブル金属張積層板、及びその製造方法
WO2024219160A1 (ja) * 2023-03-30 2024-10-24 宇部エクシモ株式会社 フレキシブル金属張積層板、及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4538375B2 (ja) * 2005-05-31 2010-09-08 日鉱金属株式会社 プリント配線基板用金属材料
TWI482882B (zh) * 2012-09-10 2015-05-01 Ｊｘ日鑛日石金屬股份有限公司 Surface treatment of copper foil and the use of its laminated board
TWI515342B (zh) 2013-09-05 2016-01-01 三井金屬鑛業股份有限公司 表面處理銅箔、使用該表面處理銅箔所得之貼銅積層板以及印刷配線板
JP6497881B2 (ja) * 2013-10-04 2019-04-10 Ｊｘ金属株式会社 圧延銅箔、それを用いた銅張積層板、プリント配線板、電子機器、回路接続部材の製造方法及び回路接続部材
CN105814242B (zh) * 2013-12-10 2018-08-10 Ｊｘ金属株式会社 表面处理铜箔、覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法
MY186266A (en) * 2015-03-31 2021-07-01 Mitsui Mining & Smelting Co Ltd Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board
KR101895745B1 (ko) * 2015-07-03 2018-09-05 미쓰이금속광업주식회사 조면화 처리 동박, 동장 적층판 및 프린트 배선판
MY186397A (en) * 2015-07-29 2021-07-22 Namics Corp Roughened copper foil, copper-clad laminate, and printed wiring board
WO2017179416A1 (ja) 2016-04-14 2017-10-19 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
CN108696987B (zh) * 2017-03-31 2021-11-30 Ｊｘ金属株式会社 表面处理铜箔、附有载体的铜箔、积层体、印刷布线板的制造方法及电子机器的制造方法

Also Published As

Publication number Publication date
JP7453154B2 (ja) 2024-03-19
TWI740231B (zh) 2021-09-21
CN112969824B (zh) 2024-10-18
JPWO2020105289A1 (ja) 2021-09-30
CN112969824A (zh) 2021-06-15
TW202020233A (zh) 2020-06-01
KR102802888B1 (ko) 2025-05-07
KR20210090608A (ko) 2021-07-20
WO2020105289A1 (ja) 2020-05-28

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