MY201078A - Conductive paste, method for producing electronic component, and method for producing laminated ceramic capacitor - Google Patents
Conductive paste, method for producing electronic component, and method for producing laminated ceramic capacitorInfo
- Publication number
- MY201078A MY201078A MYPI2020001023A MYPI2020001023A MY201078A MY 201078 A MY201078 A MY 201078A MY PI2020001023 A MYPI2020001023 A MY PI2020001023A MY PI2020001023 A MYPI2020001023 A MY PI2020001023A MY 201078 A MY201078 A MY 201078A
- Authority
- MY
- Malaysia
- Prior art keywords
- producing
- conductive paste
- electronic component
- ceramic capacitor
- laminated ceramic
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 2
- 239000003985 ceramic capacitor Substances 0.000 title 1
- 239000002270 dispersing agent Substances 0.000 abstract 5
- 230000002378 acidificating effect Effects 0.000 abstract 3
- 239000000843 powder Substances 0.000 abstract 2
- 239000011230 binding agent Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Conductive Materials (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017165893A JP7013731B2 (ja) | 2017-08-30 | 2017-08-30 | 導電性ペースト、並びに、電子部品及び積層セラミックコンデンサの製造方法 |
PCT/IB2018/058469 WO2019043671A2 (fr) | 2017-08-30 | 2018-10-30 | Pâte électroconductrice, composant électronique et condensateur à base de céramique multicouche |
Publications (1)
Publication Number | Publication Date |
---|---|
MY201078A true MY201078A (en) | 2024-02-03 |
Family
ID=65525049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2020001023A MY201078A (en) | 2017-08-30 | 2018-10-30 | Conductive paste, method for producing electronic component, and method for producing laminated ceramic capacitor |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7013731B2 (fr) |
KR (1) | KR102569072B1 (fr) |
CN (1) | CN111386579B (fr) |
MY (1) | MY201078A (fr) |
WO (1) | WO2019043671A2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7517156B2 (ja) | 2019-02-12 | 2024-07-17 | 住友金属鉱山株式会社 | 導電性ペースト、電子部品及び積層セラミックコンデンサ |
CN114467149A (zh) * | 2019-09-26 | 2022-05-10 | 住友金属矿山株式会社 | 导电性组合物、导电性浆料、电子部件以及叠层陶瓷电容器 |
CN113436886A (zh) * | 2021-04-28 | 2021-09-24 | 佛山市顺德区百锐新电子材料有限公司 | 一种水性mlcc专用辊印镍浆及其制备方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4433162B2 (ja) * | 2004-02-05 | 2010-03-17 | 株式会社村田製作所 | セラミックスラリー、セラミックスラリーの製造方法、及び積層セラミック電子部品の製造方法 |
JP3944495B2 (ja) | 2004-06-28 | 2007-07-11 | Tdk株式会社 | 導電性ペースト、積層セラミック電子部品及びその製造方法 |
JP4507750B2 (ja) * | 2004-08-05 | 2010-07-21 | 昭栄化学工業株式会社 | 導電性ペースト |
JP4482930B2 (ja) * | 2004-08-05 | 2010-06-16 | 昭栄化学工業株式会社 | 導電性ペースト |
JP4930808B2 (ja) | 2010-01-29 | 2012-05-16 | 住友金属鉱山株式会社 | 導電性ペースト |
JP5556561B2 (ja) | 2010-10-06 | 2014-07-23 | 住友金属鉱山株式会社 | 銀粉及びその製造方法 |
KR101198004B1 (ko) * | 2010-12-10 | 2012-11-05 | 삼성전기주식회사 | 적층 세라믹 커패시터용 세라믹 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 이들의 제조방법 |
JP5569747B2 (ja) | 2011-02-18 | 2014-08-13 | 住友金属鉱山株式会社 | 積層セラミックコンデンサ内部電極に用いられるグラビア印刷用導電性ペースト |
JP6292014B2 (ja) | 2014-05-12 | 2018-03-14 | 株式会社村田製作所 | 導電性ペーストおよびセラミック電子部品 |
JP6314728B2 (ja) * | 2014-07-30 | 2018-04-25 | 住友金属鉱山株式会社 | 導電性ペーストの製造方法及びこれにより得られる導電性ペースト |
KR102410080B1 (ko) | 2014-07-31 | 2022-06-16 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 도전성 페이스트 |
JP6948111B2 (ja) | 2016-02-09 | 2021-10-13 | ナミックス株式会社 | 樹脂組成物、導電性銅ペースト、および半導体装置 |
WO2017150438A1 (fr) * | 2016-02-29 | 2017-09-08 | 住友金属鉱山株式会社 | Pâte électroconductrice, composant électronique et condensateur à base de céramique laminée |
-
2017
- 2017-08-30 JP JP2017165893A patent/JP7013731B2/ja active Active
-
2018
- 2018-10-30 CN CN201880056607.8A patent/CN111386579B/zh active Active
- 2018-10-30 KR KR1020207005891A patent/KR102569072B1/ko active IP Right Grant
- 2018-10-30 WO PCT/IB2018/058469 patent/WO2019043671A2/fr active Application Filing
- 2018-10-30 MY MYPI2020001023A patent/MY201078A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2019043671A2 (fr) | 2019-03-07 |
JP7013731B2 (ja) | 2022-02-01 |
KR20210068314A (ko) | 2021-06-09 |
CN111386579A (zh) | 2020-07-07 |
JP2019046581A (ja) | 2019-03-22 |
CN111386579B (zh) | 2023-12-12 |
KR102569072B1 (ko) | 2023-08-21 |
WO2019043671A3 (fr) | 2019-05-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY188260A (en) | Conductive paste, electronic component, and multilayer ceramic capacitor | |
MY201078A (en) | Conductive paste, method for producing electronic component, and method for producing laminated ceramic capacitor | |
MX2017002587A (es) | Composicion que incluye una resina curable y arcilla modificada de forma organofilica para aplicaciones de pozo de petroleo subterraneo. | |
MY176105A (en) | Thermosetting resin composition, cured product obtained therefrom, and active ester resin for use therein | |
GB201208610D0 (en) | Monomers, polymers and organic electronic devices | |
WO2015061596A3 (fr) | Connecteur unifié pour de multiples interfaces | |
PH12017502242A1 (en) | Conductive paste comprising lubricating oils and semiconductor device | |
BR112013004884A2 (pt) | pasta condutiva, dispositivo eletrônico e método para produzir um dispositivo elétrico | |
MY169978A (en) | Low dielectric loss thermoset resin system at high frequency for use in electrical components | |
MY189234A (en) | Epoxy resin composition, resin layer-attached carrier material metal base circuit substrate, and electronic device | |
TW200710877A (en) | Conductive paste for multilayer electronic components and multilayer electronic component using same | |
WO2010034597A3 (fr) | Groupe d'ancrage pour monocouches de composés organiques sur métal et composant électronique organique résultant | |
WO2014184102A3 (fr) | Procédé de dépôt de couches épaisses de cuivre sur des matériaux frittés | |
TW201612103A (en) | Sorting of carbon nanotubes | |
WO2019043674A3 (fr) | Pâte conductrice, composant électronique et condensateur céramique multicouche | |
WO2016049212A8 (fr) | Condensateurs pour cartes de circuits imprimés multicouches | |
GB2566908A8 (en) | Use of conductive ink in downhole electromagnetic antenna applications | |
EP4242286A3 (fr) | Matériaux pour dispositifs électroniques | |
EP2966946A3 (fr) | Procédé pour la fabrication d'une disposition électronique par écriture directe avec des feuilles fabriquées | |
MX2015008414A (es) | Portador de componentes. | |
WO2019043673A3 (fr) | Pâte conductrice, composant électronique et condensateur à base de céramique multicouche | |
EP2688259A3 (fr) | Communications avec égalisation adaptative | |
CN104529415A (zh) | 高强度电瓷配方 | |
PH12015501631A1 (en) | Multi-level metalization on a ceramic substrate | |
WO2019043672A3 (fr) | Pâte électroconductrice, composant électronique et condensateur à base de céramique multicouche |