MY195582A - Method For Manufacturing Electronic Component Carrier Tape - Google Patents

Method For Manufacturing Electronic Component Carrier Tape

Info

Publication number
MY195582A
MY195582A MYPI2019001777A MYPI2019001777A MY195582A MY 195582 A MY195582 A MY 195582A MY PI2019001777 A MYPI2019001777 A MY PI2019001777A MY PI2019001777 A MYPI2019001777 A MY PI2019001777A MY 195582 A MY195582 A MY 195582A
Authority
MY
Malaysia
Prior art keywords
stepped
receiver
embossed
resin sheet
electronic component
Prior art date
Application number
MYPI2019001777A
Inventor
Aizawa Junichi
Original Assignee
Shin Etsu Polymer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Publication of MY195582A publication Critical patent/MY195582A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The present invention provides a method for manufacturing an electronic component carrier tape to integrally form embossed storages (30) for semiconductor packages (10) on a resin sheet (1) of a stepped structure by press forming the resin sheet (1). The resin sheet (1) is formed with multiple flange portions (2) opposed to each other, multiple stepped walls (5) each connected to the opposing part (4) of the multiple flange portions (2) and extended toward the undersurface of the flange portion (2), and a stepped receiver (6) supported between the multiple stepped walls (5) at a lower level than the flange portion (2). The embossed storage (30) is formed of an opening (31) in the stepped receiver (6), an enclosing wall (32) extending from the opening (31) toward the undersurface of the stepped receiver (6) and a bottom (33) connected to the enclosing wall (32). When the semiconductor package (10) is stored in the embossed storage (30), the top face (13) of the semiconductor package (10) is positioned at a level higher than the stepped receiver (6) and at a level lower than the surface of the flange portions (2). This configuration prevents thin electronic components from popping out from the embossed storage, being damaged and falling out. (Fig.4)
MYPI2019001777A 2016-11-09 2017-10-20 Method For Manufacturing Electronic Component Carrier Tape MY195582A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016218906A JP6751652B2 (en) 2016-11-09 2016-11-09 Manufacturing method of carrier tape for electronic components
PCT/JP2017/038084 WO2018088178A1 (en) 2016-11-09 2017-10-20 Method for manufacturing carrier tape for electronic component

Publications (1)

Publication Number Publication Date
MY195582A true MY195582A (en) 2023-02-02

Family

ID=62109179

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019001777A MY195582A (en) 2016-11-09 2017-10-20 Method For Manufacturing Electronic Component Carrier Tape

Country Status (4)

Country Link
JP (1) JP6751652B2 (en)
CN (1) CN109906192B (en)
MY (1) MY195582A (en)
WO (1) WO2018088178A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2593498Y2 (en) * 1992-07-20 1999-04-12 信越ポリマー株式会社 Carrier tape
JPH0741040A (en) * 1993-07-29 1995-02-10 Shin Etsu Polymer Co Ltd Production of carrier tape
JPH09267344A (en) * 1996-03-31 1997-10-14 Press Kogyo Kk Method and mold for press molding
JP3360551B2 (en) * 1996-11-08 2002-12-24 ソニー株式会社 Transport container for square chip components
US6568535B1 (en) * 2000-01-14 2003-05-27 Peak International Ltd. Apparatus and methods for improving uniform cover tape adhesion on a carrier tape
CN2433214Y (en) * 2000-07-27 2001-06-06 彭志敏 Improved structure of coiled band for packing electronic element
JP2006151398A (en) * 2004-11-25 2006-06-15 Yamaha Corp Packing tape carrier for semiconductor integrated circuit
JP5366040B2 (en) * 2008-08-06 2013-12-11 株式会社イー・ピー・アイ Small product packaging and packaging method for small products
TWI482725B (en) * 2011-05-06 2015-05-01 Lextar Electronics Corp Modified sealing tape structure
CN102745406A (en) * 2012-08-03 2012-10-24 厦门市海德龙电子有限公司 Electronic component carrier tape structure
JP6430811B2 (en) * 2014-12-24 2018-11-28 信越ポリマー株式会社 Carrier tape for electronic parts and method for manufacturing the same
JP6446262B2 (en) * 2014-12-25 2018-12-26 信越ポリマー株式会社 Carrier tape for electronic parts and method for manufacturing the same

Also Published As

Publication number Publication date
CN109906192B (en) 2021-03-30
CN109906192A (en) 2019-06-18
JP2018076093A (en) 2018-05-17
JP6751652B2 (en) 2020-09-09
WO2018088178A1 (en) 2018-05-17

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