CN102745406A - Electronic component carrier tape structure - Google Patents
Electronic component carrier tape structure Download PDFInfo
- Publication number
- CN102745406A CN102745406A CN2012102746811A CN201210274681A CN102745406A CN 102745406 A CN102745406 A CN 102745406A CN 2012102746811 A CN2012102746811 A CN 2012102746811A CN 201210274681 A CN201210274681 A CN 201210274681A CN 102745406 A CN102745406 A CN 102745406A
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- Prior art keywords
- carrier band
- electronic component
- components
- electronic devices
- boss
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Abstract
The invention discloses an electronic component carrier tape structure. The electronic component carrier tape structure comprises a bearing area and a conveying area, the bearing area is provided with a plurality of mold cavities which are arranged at intervals along the length direction of a carrier tape, the conveying area is provided with a plurality of chain holes which are arranged at intervals along the length direction of the carrier tape, one induction hole which penetrates through the bottom wall of each mold cavity is disposed in each mold cavity, two bosses are arranged in each mold cavity, a gap for installing the head of an electronic component is reserved between each two bosses, each two bosses are in a contact with a same inner wall of each mold cavity, the surface of each two bosses, which is in a contact with the electronic component, includes an inclined guide surface and a vertical surface, and the length of the inclined guide surface in a vertical direction is smaller than that of the vertical surface in the vertical direction. The electronic component carrier tape structure has the advantages that the positioning is accurate, the structure is convenient to place in the electronic component, and the placing of the electronic component is smooth.
Description
Technical field
The present invention relates to the packaging structure field of electronic product, relate to a kind of carrier band structure of electronic devices and components in particular.
Background technology
The manner of packing of electronic devices and components generally is to be divided into carrier band packing and pallet packing, in general, when the electronic product upperlimit selects to adopt the carrier band packing less than 30mm, otherwise just uses pallet packing.The advantage of carrier band packing is that cost is low high with efficient, and can realize easily reaching the standard grade automatically, realizes the SMT technology.
At present; This carrier band generally includes electronic devices and components bearing area and conveyor zones; This bearing area and conveyor zones are all extended setting along the bearing of trend of carrier band, and this bearing area comprises a plurality of die cavities that are provided with at interval, and each die cavity is an accomodating unit; This conveyor zones then comprises a plurality of chains hole that is provided with at interval, can make whole carrier band realized the automation conveying by drive through this chain hole.
But still there is following defective at least in above-mentioned traditional carrier band:
One, above-mentioned traditional carrier band in use owing to be loaded in the die cavity between the electronic component and automation mounting device also across the diapire that the bearing area die cavity is arranged, so exist carrier band to locate problem not too accurately;
Two, the die cavity of above-mentioned traditional carrier band only is to play the effect of holding electronic component, and aspect the electronic component installing and locating and be convenient to electronic element base pin and the aspect is set still has deficiency.
In view of this, the inventor has this case to produce to the above-mentioned defective in-depth study of existing carrier band structure then.
Summary of the invention
The object of the present invention is to provide a kind of electronic devices and components carrier band structure, with solve existing carrier band structure have the location not too accurately, that convenience is installed is relatively poor and be not easy to problem such as pin discharging.
In order to reach above-mentioned purpose, solution of the present invention is:
A kind of electronic devices and components carrier band structure comprises bearing area and conveyor zones, and this bearing area has a plurality of die cavities that are provided with at interval along the carrier band length direction, and this conveyor zones has a plurality of chains hole that is provided with at interval along the carrier band length direction; Wherein, Be provided with in each die cavity through the sensing hole of die cavity diapire; Also be provided with two boss in each die cavity, leave the space that the sub-components and parts head of power supply is provided with between these two boss, these two boss all contact with the same inwall of die cavity; The surface that these two boss contact with electronic devices and components comprises oblique surface and vertical plane, this oblique surface in the length of vertical direction less than the length of vertical plane at vertical direction.
Further, the angle of this oblique surface and boss upper surface and vertical plane is 45 degree, and the projection width of this oblique surface on the boss upper surface is also less than the width of upper surface.
Further, this oblique surface is 0.3mm in the length of vertical direction, and this vertical plane is 0.92mm in the length of vertical direction.
After adopting said structure; A kind of electronic devices and components carrier band structure that the present invention relates to; It is at first through being provided with sensing hole in each die cavity, and makes and improved the follow-up accuracy that mounts of electronic devices and components greatly in the automation mounting device accurate position of perception electronic devices and components better; Simultaneously owing to also be provided with boss in each die cavity; Thereby can so that the operator electronic devices and components are packed in the carrier band; In addition because the setting of this oblique surface, vertical plane; Especially oblique surface in vertical direction length less than vertical plane, so make electronic devices and components and pin thereof can not ride on the oblique surface, thereby avoided electronic devices and components when packing die cavity into, to overturn or the generation of situation such as inclination.
Description of drawings
Fig. 1 is the structural representation that the present invention relates to a kind of electronic devices and components carrier band structure;
Fig. 2 is the cutaway view Amplified image of A-A line among Fig. 1;
Fig. 3 is the structural representation when the present invention relates to a kind of electronic devices and components carrier band structure and being incorporated with electronic devices and components.
Among the figure:
The specific embodiment
In order further to explain technical scheme of the present invention, come the present invention is set forth in detail through specific embodiment below.
To shown in Figure 3, a kind of electronic devices and components carrier band structure 100 that the present invention relates to comprises bearing area and conveyor zones like Fig. 1, and this bearing area has a plurality of die cavities 1, and these a plurality of die cavities 1 are provided with along the carrier band length direction at interval; This conveyor zones has a plurality of chains hole 2, and this a plurality of chains hole 2 also is provided with along the length direction of carrier band at interval, so can drive whole carrier band structure 100 through this a plurality of chains hole 2, promptly realizes the translocation to whole carrier band structure 100.
Improvements of the present invention are: be provided with sensing hole 11 in each die cavity 1; This sensing hole 11 is through the diapire of die cavity 1; Setting through this sensing hole 11; Can be so that the automation mounting device accurate position of perception electronic devices and components 200 have better been improved the electronic devices and components 200 follow-up accuracys that mount greatly.
In addition; Also be provided with two boss 12 in each die cavity 1, leave the space 13 that sub-components and parts 200 heads of power supply are provided with between these two boss 12, these two boss 12 all contact with die cavity 1 same inwall; Please with reference to shown in Figure 3; The head of these electronic devices and components 200 can be embedded in space 13, is convenient to electronic devices and components 200 are assembled in the carrier band structure 100 thereby can play, and has improved packaging efficiency; Again, the surface that these two boss 12 contact with electronic devices and components 200 comprises oblique surface 122 and vertical plane 123, this oblique surface 122 in the length of vertical direction less than the length of vertical plane 123 at vertical direction; Please with reference to shown in Figure 2, this oblique surface is 0.3mm in the length of vertical direction, and this vertical plane is 0.92mm in the length of vertical direction.
More specifically, this oblique surface 122 is 45 degree with the angle of boss 12 upper surfaces 121 and vertical plane 123, and the projection width of this oblique surface 122 on boss 12 upper surfaces 121 is also less than the width of upper surface 121.Promptly shorten the length of oblique surface 122 as far as possible, so make electronic devices and components 200 and pin thereof can not ride on the oblique surface 122, thereby avoided electronic devices and components 200 when packing die cavity 1 into, to overturn or the generation of situation such as inclination.
The foregoing description and graphic and non-limiting product form of the present invention and style, the those of ordinary skill of any affiliated technical field all should be regarded as not breaking away from patent category of the present invention to its suitable variation or modification of doing.
Claims (3)
1. an electronic devices and components carrier band structure comprises bearing area and conveyor zones, and this bearing area has a plurality of die cavities that are provided with at interval along the carrier band length direction, and this conveyor zones has a plurality of chains hole that is provided with at interval along the carrier band length direction; It is characterized in that; Be provided with in each die cavity through the sensing hole of die cavity diapire; Also be provided with two boss in each die cavity, leave the space that the sub-components and parts head of power supply is provided with between these two boss, these two boss all contact with the same inwall of die cavity; The surface that these two boss contact with electronic devices and components comprises oblique surface and vertical plane, this oblique surface in the length of vertical direction less than the length of vertical plane at vertical direction.
2. a kind of electronic devices and components carrier band structure as claimed in claim 1 is characterized in that, the angle of this oblique surface and boss upper surface and vertical plane is 45 degree, and the projection width of this oblique surface on the boss upper surface is also less than the width of upper surface.
3. a kind of electronic devices and components carrier band structure as claimed in claim 1 is characterized in that this oblique surface is 0.3mm in the length of vertical direction, and this vertical plane is 0.92mm in the length of vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102746811A CN102745406A (en) | 2012-08-03 | 2012-08-03 | Electronic component carrier tape structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102746811A CN102745406A (en) | 2012-08-03 | 2012-08-03 | Electronic component carrier tape structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102745406A true CN102745406A (en) | 2012-10-24 |
Family
ID=47026001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102746811A Pending CN102745406A (en) | 2012-08-03 | 2012-08-03 | Electronic component carrier tape structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102745406A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107662762A (en) * | 2016-07-27 | 2018-02-06 | 太阳诱电株式会社 | Carrier band, electronic unit containing belt and its manufacture method of electronic unit containing belt |
| CN109906192A (en) * | 2016-11-09 | 2019-06-18 | 信越聚合物株式会社 | The manufacturing method of electronic component carrier band |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1196871A (en) * | 1995-09-15 | 1998-10-21 | 美国3M公司 | Component carrier tape having static dissipative properties |
| CN1215690A (en) * | 1997-10-27 | 1999-05-05 | 住友电木株式会社 | Carrier tape for electronic components |
| US20020005371A1 (en) * | 2000-07-11 | 2002-01-17 | Mamoru Susaki | Embossed carrier tape for electronic devices |
| CN201321208Y (en) * | 2008-08-26 | 2009-10-07 | 安费诺科耐特(西安)科技有限公司 | Packaging carrier band for sticking coaxial connector |
| CN202687074U (en) * | 2012-08-03 | 2013-01-23 | 厦门市海德龙电子有限公司 | Carrying band structure for electronic component |
-
2012
- 2012-08-03 CN CN2012102746811A patent/CN102745406A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1196871A (en) * | 1995-09-15 | 1998-10-21 | 美国3M公司 | Component carrier tape having static dissipative properties |
| CN1215690A (en) * | 1997-10-27 | 1999-05-05 | 住友电木株式会社 | Carrier tape for electronic components |
| US20020005371A1 (en) * | 2000-07-11 | 2002-01-17 | Mamoru Susaki | Embossed carrier tape for electronic devices |
| CN201321208Y (en) * | 2008-08-26 | 2009-10-07 | 安费诺科耐特(西安)科技有限公司 | Packaging carrier band for sticking coaxial connector |
| CN202687074U (en) * | 2012-08-03 | 2013-01-23 | 厦门市海德龙电子有限公司 | Carrying band structure for electronic component |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107662762A (en) * | 2016-07-27 | 2018-02-06 | 太阳诱电株式会社 | Carrier band, electronic unit containing belt and its manufacture method of electronic unit containing belt |
| CN109906192A (en) * | 2016-11-09 | 2019-06-18 | 信越聚合物株式会社 | The manufacturing method of electronic component carrier band |
| CN109906192B (en) * | 2016-11-09 | 2021-03-30 | 信越聚合物株式会社 | Method for manufacturing carrier tape for electronic parts |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhou Haiming Inventor after: Yu Huaiming Inventor before: Zhou Haiming |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: ZHOU HAIMING TO: ZHOU HAIMING YU HUAIMING |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121024 |