JP5366040B2 - Small product packaging and packaging method for small products - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package which can surely prevent a small product from being tilted, rolled over and reversed by oscillations in the housing recess section of an embossed carrier tape. <P>SOLUTION: This package 10 is constituted by including the embossed carrier tape 14 on which a large number of the housing recess sections 18 for an electronic component 12 are formed in a row in the longitudinal direction with equal intervals, and a top cover tape 16 which is separably bonded to the top surface of the embossed carrier tape, and closes the opening surfaces of the housing recess sections. A recess 24 is formed by processing at the section to cover the opening surface of the housing recess section 18 on the embossed carrier tape 14 of the top cover tape 16, and the lower surface of the recess section of the top cover tape is brought into contact with or made to approach the top surface of the electronic component 12 in the housing recess section. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a small product package in which a large number of small products such as semiconductor devices and electronic parts and precision mechanism components are accommodated in a single row and packaged in a long strip shape, and a large number of small products are accommodated in a single row. The present invention relates to a packaging method for small products to be packaged in a belt-like form.

  When packaging (individually packaging) electronic components such as small products such as semiconductor devices, a long band is formed, and a number of receiving recesses are formed in a line at equal intervals in the longitudinal direction. An embossed carrier tape having a large number of engagement holes formed at equal intervals in the longitudinal direction at the edge is used. Then, one electronic component is inserted into each receiving recess of the embossed carrier tape, and then a transparent or semi-transparent cover tape is placed on the upper surface of the embossed carrier tape so as to close the opening surfaces of the multiple receiving recesses. The electronic component is sealed in the housing recess by thermocompression bonding or pressure bonding.

When electronic components are packaged (taped) with an embossed carrier tape and transported or transported, if the electronic components are shaken, tilted, overturned, or reversed in the housing recess due to impact or vibration, the device Leads and external electrodes may be deformed or damaged. Further, when an electronic component is sucked out from the housing recess of the embossed carrier tape and mounted on the surface, a suction failure occurs and the productivity is affected. For this reason, various contrivances have been made to prevent the electronic component from moving within the housing recess of the embossed carrier tape. For example, a top cover tape crimping part that is thermocompression-bonded or pressure-bonded to the upper surface of the embossed carrier tape is continuously provided along the opening edge of the housing recess (embossing part) housing the electronic components, and further adjacent There has been proposed a packaging body that is provided intermittently between receiving recesses to suppress bending of a top cover tape that occurs after pressure bonding to an embossed carrier tape (see, for example, Patent Document 1). In addition, a package has been proposed in which a top cover tape that covers the upper surface of an embossed carrier tape is provided with a protrusion that regulates the position of an electronic component housed in a housing recess (see, for example, Patent Document 2). In addition, when the top cover tape is covered with the top cover tape on the embossed carrier tape by forming elastic downward projections that can enter into each recess of the embossed carrier tape at the position corresponding to the recess. In addition, a packaging body has been proposed in which downward projections are pressed against and pressed against the upper surface of each electronic component, and each electronic component is elastically held in the recess (see, for example, Patent Document 3). .
JP 2002-104501 A (page 3, FIG. 1) JP 2004-175419 A (3rd page, FIG. 2) Microfilm (No. 10-11, FIG. 2, FIG. 3) of Japanese Utility Model Application No. 62-158717 (Japanese Utility Model Publication No. 1-63661)

  However, in the package described in Patent Document 1, it is possible to suppress the bending of the top cover tape that occurs after pressure bonding to the embossed carrier tape, but depending on the shape of the electronic component, the inclination of the electronic component in the housing recess, It is not possible to reliably prevent rollover or inversion. This solves problems such as deformation and damage of electronic parts, and poor productivity due to suction failure when picking up and taking out electronic parts from the recesses of the embossed carrier tape. May not be possible. In addition, as described in Patent Document 2, the configuration in which the top cover tape that covers the upper surface of the embossed carrier tape is provided with a protrusion that regulates the position of the electronic component housed in the housing recess differs for each electronic component. It is necessary to prepare molds and prepare and prepare top cover tapes that are adapted to the shapes of various electronic components using these molds. Since there is no versatility as described above, there are problems that the manufacturing cost is high and the process management is troublesome. Also in the package described in Patent Document 3, it is necessary to form the protrusions of the top cover tape in advance by a method such as providing a cushion air bubble on a plastic film used for packaging. There are similar problems. Furthermore, as described in Patent Documents 2 and 3, the top cover tape with the protrusions is overlapped on the upper surface of the embossed carrier tape containing the small product in the housing recess, and the top cover tape is bonded. When misalignment occurs between the tape and the embossed carrier tape, small products are pressed by the bottom surface, side surface, and corners of the top cover tape protrusion when the top cover tape is superimposed on the top surface of the embossed carrier tape. As a result, small products such as precision parts may be deformed.

  The present invention has been made in view of the circumstances as described above, and the small product is reliably prevented from being tilted, overturned, or inverted by being shaken in the recessed portion of the embossed carrier tape. There is no risk that the product will be deformed or damaged, and there will be no loss of productivity when sucking out small products from the recesses of the embossed carrier tape, resulting in decreased productivity. Providing a small product package that is versatile without the need to change the structure of the top cover tape or the like for each small product to be tried, and that there is no risk of deformation of small products such as precision parts during packaging. In addition, an object of the present invention is to provide a method for packaging a small product that can obtain such a small product package.

The invention according to claim 1 is an embossed carrier tape in which a large number of receiving recesses for storing small products one by one are formed in a line at equal intervals in the longitudinal direction, and the upper surface of the embossed carrier tape is detachably bonded. A small product package comprising a top cover tape that closes open surfaces of the plurality of receiving recesses in which the small products are stored, wherein the small products have a thin stepped shape, and the embossed carrier tape receiving recesses The inner bottom surface is formed into a stepped surface corresponding to the shape of the small product, and the top cover tape is bonded to the top surface of the embossed carrier tape to form the opening surfaces of the multiple receiving recesses in which the small products are stored. When closing, a recess is added to the deep bottom side of the receiving recess in the portion of the top cover tape that covers the opening surface of each receiving recess of the embossed carrier tape. Formed and, wherein the lower surface of the recessed portion of the top cover tape and the contact or is close to the upper surface of small products that are accommodated in the accommodating recess.

According to the second aspect of the present invention, an embossed carrier tape having a plurality of receiving recesses formed in a line at equal intervals in the longitudinal direction is transported along the longitudinal direction while small products are loaded one by one in the receiving recesses. And a top cover tape overlaid on the top surface of the embossed carrier tape where the small product is inserted into the receiving recess, and the top surface of the receiving recess containing the small product is topped. A small-sized product by sequentially closing the cover with a cover tape, heating the portion of the top cover tape where the opening of the receiving recess of the embossed carrier tape is closed, and bonding the top cover tape to the top surface of the embossed carrier tape A small product packaging method comprising: a sealing step for sequentially sealing the housing recesses in the housing recesses; and the top in a softened state by heating following the sealing step. Pressing the portion of the bar tape where the small product is sealed in the housing recess, forming a recess in the top cover tape covering the opening surface of the housing recess, and forming the bottom surface of the recess of the top cover tape, The method further includes a tape processing step of abutting the upper surface of the small product accommodated in the accommodating recess and curing the top cover tape in a state where the force acting on the small product from the recessed portion becomes substantially zero.

According to a third aspect of the present invention, while the embossed carrier tape having a large number of receiving recesses formed in a line at equal intervals in the longitudinal direction is conveyed along the longitudinal direction, small products are loaded one by one in the receiving recesses. And a top cover tape overlaid on the top surface of the embossed carrier tape where the small product is inserted into the receiving recess, and the top surface of the receiving recess containing the small product is topped. A small-sized product by sequentially closing the cover with a cover tape, heating the portion of the top cover tape where the opening of the receiving recess of the embossed carrier tape is closed, and bonding the top cover tape to the top surface of the embossed carrier tape A small product packaging method including sequentially sealing in a housing recess, heating the top cover tape before the closing step, and heating The tape which forms the dent sequentially in the part which presses the part corresponding to the accommodation recessed part of the said embossed carrier tape of the top cover tape of the softened state, and is going to cover the opening surface of the accommodation recessed part of the top cover tape In the closing step that is further performed after the tape processing step, the lower surface of the recessed portion of the top cover tape that has been heated and softened is housed in the housing recess of the embossed carrier tape. It is characterized in that the top cover tape is cured in a state where it is brought into contact with the upper surface of the small product and the force acting on the small product from the recessed portion becomes almost zero.

According to a fourth aspect of the present invention, while the embossed carrier tape having a large number of receiving recesses formed in a line at equal intervals in the longitudinal direction is conveyed along the longitudinal direction, small products are loaded one by one in the receiving recesses. And a top cover tape overlaid on the top surface of the embossed carrier tape where the small product is inserted into the receiving recess, and the top surface of the receiving recess containing the small product is topped. A small-sized product by sequentially closing the cover with a cover tape, heating the portion of the top cover tape where the opening of the receiving recess of the embossed carrier tape is closed, and bonding the top cover tape to the top surface of the embossed carrier tape And a sealing step for sequentially sealing the embossed carrier tape with the embossed carrier tape. The inner bottom surface of the part is formed as a stepped surface corresponding to the shape of the small product, and the small product of the top cover tape heated and softened after the sealing step is sealed in the receiving recess. The recessed portion is sequentially formed on the deep bottom side of the housing recess in the portion of the top cover tape that covers the opening surface of the housing recess, and the lower surface of the recessed portion of the top cover tape is placed in the housing recess. The method further includes a tape processing step of contacting or approaching the upper surface of the accommodated small product.

According to the fifth aspect of the present invention, while the embossed carrier tape having a large number of receiving recesses formed in a line at equal intervals in the longitudinal direction is conveyed along the longitudinal direction, small products are loaded one by one in the receiving recesses. And a top cover tape overlaid on the top surface of the embossed carrier tape where the small product is inserted into the receiving recess, and the top surface of the receiving recess containing the small product is topped. A small-sized product by sequentially closing the cover with a cover tape, heating the portion of the top cover tape where the opening of the receiving recess of the embossed carrier tape is closed, and bonding the top cover tape to the top surface of the embossed carrier tape A small product having a thin stepped shape, and the embossed carrier tape includes: The inner bottom surface of the housing recess is formed in a stepped surface corresponding to the shape of the small product, and before the closing step, the top cover tape is heated and heated to soften the top cover tape, A tape processing step of pressing a portion corresponding to the housing recess of the embossed carrier tape to form a recess on the bottom side of the housing recess in the portion of the top cover tape that is to cover the opening surface of the housing recess. In addition, in the closing step that is performed subsequent to the tape processing step, the lower surface of the recessed portion of the top cover tape that has been heated and softened is contained in the recessed portion of the embossed carrier tape. It is characterized by contacting or approaching the upper surface.

The invention according to claim 6 is the packaging method according to claim 2 or claim 3 , wherein the small product has a step on its upper surface, and in the tape processing step, the dent of the top cover tape is changed to each of the different small products. It is characterized in that it is formed at a plurality of locations with different depth dimensions so as to correspond to the height of the upper surface.

In the small product packaging body of the invention according to claim 1 , the small product having a thin plate-like stepped shape is arranged and supported along the inner bottom surface of the receiving recess formed in the stepped surface. In addition, since the bottom surface of the recessed portion of the top cover tape is in contact with or close to the lower surface of the small product housed in the housing recess of the embossed carrier tape, the small product is shaken in the housing recess. Thus, it is reliably prevented from tilting, overturning or inverting. Therefore, there is no risk that the small product housed in the housing recess will be deformed or damaged, and there is no risk of poor suction when the small product is sucked out of the housing recess. There will be no decline. In addition, when the top cover tape is bonded to the upper surface of the embossed carrier tape to close the opening surface of the housing recess, it is only necessary to process and form the recess in the top cover tape. There is no need to create different molds for each product, and to prepare and prepare top cover tapes that are adapted to the shape of various small products using those molds. Versatile. And the recess of the top cover tape is formed after the small product is inserted into the housing recess of the embossed carrier tape and the top cover tape is bonded to the upper surface of the embossed carrier tape. Since the top cover tape provided with the protrusions is not overlapped and bonded to the upper surface of the embossed carrier tape containing the small product in the accommodating recess, it is not performed between the top cover tape and the embossed carrier tape. Even if misalignment or the like occurs, there is no concern that the small product is deformed by pressing the small product at the lower surface, side surface, or corner of the recessed portion of the top cover tape.

According to the packaging method of the invention according to claim 2 , in the tape processing step performed following the sealing step, the top cover tape in a heated and softened state is partially pressed, The embossed carrier tape has a recess that is formed in a portion that covers the opening surface of the receiving recess, and the lower surface of the recessed portion of the top cover tape contacts the upper surface of the small product stored in the receiving recess. The top cover tape is cured while the force acting on the product is almost zero. Moreover, according to the packaging method of the invention which concerns on Claim 3, in the tape processing process performed before a closure process, when the top cover tape in the state heated and softened is pressed partially, top cover tape of The recesses of the top cover tape are softened by heating in the closing step that is performed following the tape processing step, in which the recesses are sequentially formed in the portion of the embossed carrier tape that covers the opening surface of the receiving recess. The top cover tape is cured in a state in which the force acting on the small product from the recessed portion becomes almost zero.
Therefore, when the packaging method of each invention according to claim 2 and claim 3 is used, there is no possibility that the small product housed in the housing recess is deformed or damaged, and the small product is removed from the housing recess. Since there is no risk of poor suction when picking up and picking up, there is no loss of productivity, and when the top cover tape is bonded to the top surface of the embossed carrier tape to close the opening of the housing recess, Since the top cover tape is simply processed by forming a dent, different molds are created for each small product to be packaged as before, and these molds are used to adapt to the shape of various small products. Since there is no need to manufacture and prepare a top cover tape, a small product package having versatility can be obtained. And in the packaging method of the invention which concerns on Claim 2, after a small product is inserted in the accommodation recessed part of an embossed carrier tape and a top cover tape is adhere | attached on the upper surface of an embossed carrier tape, a dent is processed and formed in a top cover tape. Therefore, there is no concern that small products such as precision parts will be deformed by pressing the small products at the bottom, side and corners of the recessed portion of the top cover tape. Further, in the packaging method of the invention according to claim 3, the top cover tape in the state where the dent is formed and softened closes the opening surface of the embossed carrier tape in which the small-sized product is accommodated. There is no concern that small products such as precision parts will be deformed by pressing the small products at the bottom, side, or corners of the recessed portion of the cover tape.

According to the packaging method of the invention according to claim 4 , in the tape processing step performed following the sealing step, the top cover tape in a heated and softened state is partially pressed, Recesses are sequentially formed on the deep bottom side of the housing recess in the portion covering the opening surface of the housing recess of the embossed carrier tape, and the lower surface of the recessed portion of the top cover tape becomes lower than the small product housed in the housing recess. Abut or close to the upper surface. Further, according to the packaging method of the invention according to claim 5 , in the tape processing step performed before the closing step, the top cover tape in a heated and softened state is partially pressed, so that the top cover tape In the embossed carrier tape, a recess is sequentially formed on the deep bottom side of the housing recess in the portion to cover the opening surface of the housing recess, and the state is softened by heating in the closing step performed following this tape processing step. The lower surface of the recessed portion of the top cover tape contacts or approaches the lower upper surface of the small product housed in the housing recess. Therefore, if the packaging method of each invention concerning Claim 4 and Claim 5 is used, the small product packaging body of the invention concerning Claim 1 which produces the said effect can be obtained. And in the packaging method of the invention which concerns on Claim 4, after a small product is inserted in the accommodation recessed part of an embossing carrier tape, and a top cover tape is adhere | attached on the upper surface of an embossing carrier tape, a dent is processed and formed in a top cover tape. Therefore, there is no concern that small products such as precision parts will be deformed by pressing the small products at the bottom, side and corners of the recessed portion of the top cover tape. Further, in the packaging method of the invention according to claim 5 , the top cover tape in which the recess is formed and softened closes the opening surface of the embossed carrier tape in which the small-sized product is accommodated. There is no concern that small products such as precision parts will be deformed by pressing the small products at the bottom, side, or corners of the recessed portion of the cover tape.

When the packaging method of the invention according to claim 6 is used , each recessed portion formed at a plurality of positions of the top cover tape on each upper surface of the small product housed in the housing recessed portion of the embossed carrier tape at different height positions. By contacting each of the lower surfaces of the small product package, it is possible to obtain a small product package that reliably prevents the small product from being shaken, tilted, overturned, or inverted within the housing recess .

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best embodiment of the present invention will be described with reference to the drawings.
1 to 3 show an example of an embodiment of the present invention, FIG. 1 is a plan view showing a part of a small product package, and FIG. 2 is a longitudinal section taken along the line II-II in FIG. FIG. 3 is a partially enlarged longitudinal sectional view thereof.

  The package 10 includes an embossed carrier tape 14 for accommodating a large number of small products (hereinafter, referred to as “electronic parts”) 12 such as electronic parts such as semiconductor devices and precision mechanism parts, and the embossed carrier tape. 14 and a top cover tape 16 that is releasably bonded to the upper surface of 14. The basic configuration of the embossed carrier tape 14 is the same as that of the conventional one, and is formed of a plastic material having a long band shape. On the upper surface side of the embossed carrier tape 14, there are a number of sizes and depths such that the electronic components 12 can be accommodated corresponding to the planar shape of the electronic components 12 to be taped in a line at equal intervals in the longitudinal direction. A housing recess 18 is formed. In addition, a plurality of small circular engagement holes 20 that are engaged with each pin of the pin roller are formed in one side edge portion of the embossed carrier tape 14 at equal intervals in the longitudinal direction.

  The top cover tape 16 is formed in a long strip shape with a transparent or translucent resin film or the like, and the upper surface of the embossed carrier tape 14 is closed so that the opening surfaces of a large number of receiving recesses 18 are not covered and the engagement holes 20 are not covered. It is bonded by thermocompression bonding, pressure bonding, pressure-sensitive adhesive or the like. In the illustrated example, both side edges of the top cover tape 16 are thermocompression-bonded linearly to the opening edge of the housing recess 18 of the embossed carrier tape 14 along the longitudinal direction thereof, so that the adhesive portion 22 is formed. As described above, the electronic component 12 is sealed in the housing recess 18 by closing the opening surfaces of the many housing recesses 18 of the embossed carrier tape 14 with the top cover tape 16. When the electronic component 12 is taken out from the housing recess 18 of the embossed carrier tape 14 when the electronic component is surface-mounted, the top cover tape 16 is peeled off from the upper surface of the embossed carrier tape 14.

  In the top cover tape 16, recesses 24 are processed and formed in portions covering the opening surfaces of the receiving recesses 18 of the embossed carrier tape 14. In the illustrated example, a pair of recesses 24 and 24 are formed at positions corresponding to the vicinity of both ends of the housing recess 18 having a rectangular planar shape. And the lower surface of the formation part of a pair of dents 24 and 24 of the top cover tape 16 is contact | abutted to the upper surface of the both-ends edge part of the rectangular-shaped electronic component 12 accommodated in the accommodation recessed part 18, respectively. As described above, since the lower surfaces of the portions where the pair of recesses 24 and 24 are formed are in contact with the upper surfaces of both edge portions of the electronic component 12, the electronic component 12 is shaken in the housing recess 18 to tilt, roll over, or reverse. It is reliably prevented.

The recess 24 of the top cover tape 16 is formed by the following process.
First, the electronic components 12 are loaded one by one into the housing recess 18 while the embossed carrier tape 14 is conveyed along the longitudinal direction thereof. Then, as shown in a schematic front longitudinal sectional view in FIG. 4, the embossed carrier tape 14 with the electronic component 12 inserted into the accommodating recess 18 is intermittently conveyed along the longitudinal direction thereof, while the embossed carrier tape 14. The top cover tape 16 intermittently fed along the longitudinal direction is superposed on the upper surface of the portion where the electronic component 12 is inserted into the housing recess 18, and the opening surface of the housing recess 18 in which the electronic component 12 is accommodated. Are sequentially closed with the top cover tape 16. Subsequently, the embossed carrier tape 14 having the top cover tape 16 superimposed on the upper surface is intermittently conveyed, and the embossed carrier is moved to a position immediately below where the heater block 26 having a pair of linear heaters 28 at the bottom is installed. The tape 14 and the top cover tape 16 are fed. When the embossed carrier tape 14 and the top cover tape 16 are stopped, the heater block 26 is lowered and the linear heater 28 is pressed against the upper surface of the embossed carrier tape 14 with the top cover tape 16 interposed therebetween. The heater block 26 is raised. By the raising / lowering operation of the heater block 26, the top cover tape 16 is thermocompression bonded to the upper surface of the embossed carrier tape 14, and the electronic component 12 is sealed in the housing recess 18.

  Subsequently, the embossed carrier tape 14 in which the top cover tape 16 is thermocompression-bonded on the upper surface and the electronic component 12 is sealed in the housing recess 18, and a pair of pressing protrusions juxtaposed in the direction perpendicular to the tape transport direction is provided at the lower end. The tape processing tool 30 having the portion 32 is sent to a position immediately below. Then, in a state where the embossed carrier tape 14 is stopped, the tape processing tool 30 is lowered to accommodate the pair of pressing convex portions 32 in the state where the top cover tape 16 is softened by being heated by the heater block 26 in the previous stage. It presses against the part corresponding to the both-ends edge part of the electronic component 12 in the recessed part 18, and the tape processing tool 30 is raised after that. By the lifting and lowering operation of the tape processing tool 30, a pair of recesses 24 are formed at positions corresponding to both ends of the accommodation recess 18 of the embossed carrier tape 14 of the top cover tape 16, and the bottom surface of the recess 24 portion of the top cover tape 16. However, it abuts on the upper surfaces of both edge portions of the electronic component 12 housed in the housing recess 18.

  Here, the most important feature of the method according to the present invention is that, as described above, when the top cover tape 16 is heated and softened and still in a state of being easily plastically deformed, the recess 24 is formed in the top cover tape 16. is there. For example, when the lower surface of the recess 24 portion of the top cover tape 16 in the softened state immediately after the recess 24 is formed is pressed firmly against the electronic component 12 in the housing recess 18, the lower surface of the recess 24 portion is removed from the electronic component 12. The top cover tape 16 can be cured in a state where the reaction force is partially pushed back and the force acting on the electronic component 12 from the dent 24 is almost zero. For this reason, according to the present invention, it is not always necessary to manufacture a tape processing tool adapted to the shape of various small products, and only by using the versatile tape processing tool 30, the dent 24 adapted to each electronic component is used. Can be formed.

  Furthermore, according to the method of the present invention, after the electronic component 12 is inserted into the housing recess 18 of the embossed carrier tape 14, the dent 24 portion of the top cover tape 16 that can still be plastically deformed is pressed against the electronic component 12. The electronic component 12 itself acts like a male mold. For this reason, even if there are variations in the size of the receiving recess 18 of the embossed carrier tape 14 and variations in product dimensions, the recess 24 absorbs these variations. Corresponds to a female mold, and the lower surface of the dent 24 portion has an appropriate shape. Accordingly, the lower surface of the recess 24 portion of the top cover tape 16 and the upper surface of the electronic component 12 in the housing recess 18 of the embossed carrier tape 14 do not come into contact with each other. It is possible to reliably prevent the electronic component 12 from rattling.

  Next, FIGS. 5 and 6 show an embodiment in which the present invention is applied to an electronic component having a thin plate-like stepped shape, and FIG. 5 is a plan view showing a part of a small product package. These are VI-VI arrow longitudinal cross-sectional views of FIG.

  In the embossed carrier tape 36 of the package 34, the inner bottom surface of the housing recess 40 that houses the electronic component 38 having a thin plate-like stepped shape is formed on a stepped surface corresponding to the shape of the electronic component 38. Only one recess 44 of the top cover tape 42 is formed on the deep bottom side of the housing recess 40 of the embossed carrier tape 36. Further, the top cover tape 42 is linearly thermocompression bonded to the opening edge of the receiving recess 40 of the embossed carrier tape 36 at both side edges thereof, and a continuous adhesive portion 46 is formed. A portion closer to the center than both side edge portions of the embossed carrier tape 36 is linearly thermocompression-bonded between adjacent housing recesses 40 to form intermittent adhesive portions 48. Structures other than these are the same as those of the package 10 shown in FIGS. 1 to 3, and reference numeral 50 in FIG. 5 denotes a pin roller pin formed in a row at one side edge of the embossed carrier tape 36. This is an engagement hole.

  In the package 34, as shown in FIG. 6, the electronic component 38 is supported on the inner bottom surface of the housing recess 40 of the embossed carrier tape 36 along the stepped surface forming the inner bottom surface, and the top. The lower surface of the recess 44 portion of the cover tape 42 is in contact with the lower upper surface of the electronic component 38. For this reason, the electronic component 38 is reliably prevented from being tilted, overturned, or reversed in the housing recess 40. The recess 44 of the top cover tape 42 is formed by a process similar to the process described above with reference to FIG.

  7 and 8 show an embodiment in which the present invention is applied to an electronic component having a step on the upper surface, FIG. 7 is a plan view showing a part of a small product package, and FIG. It is a VIII-VIII arrow longitudinal cross-sectional view.

  The structure of the embossed carrier tape 54 of the package 52 is the same as that of the package 10 shown in FIGS. 1 to 3, and a large number of receiving recesses 58 for holding the electronic components 56 one by one at regular intervals in the longitudinal direction. A large number of small circular engagement holes 60 are formed in one row at equal intervals in the longitudinal direction. The top cover tape 62 has a shallow recess 64a formed at a portion corresponding to the upper step 56a on the upper surface of the electronic component 56 accommodated in the receiving recess 56, and corresponds to the lower step 56b on the upper surface of the electronic component 56. A deep-bottomed dent 64b is formed at a portion to be formed. The top cover tape 62 is linearly thermocompression bonded to the opening edge of the housing recess 58 of the embossed carrier tape 54 at both side edges thereof to form a continuous adhesive portion 66.

  In the package 52, the top cover tape 62 is formed with a plurality of dents 64a and 64b having different depth dimensions so as to correspond to different heights of the upper surfaces of the electronic components 56, respectively, in the illustrated example. 8, the lower surface of the shallow recess 64 a of the top cover tape 62 contacts the upper step 56 a of the upper surface of the electronic component 56, and the lower surface of the deep recess 64 b of the electronic component 56. It is in contact with the lower step 56b on the upper surface. For this reason, the electronic component 56 is reliably prevented from being tilted, overturned, or reversed in the housing recess 58. The recesses 64a and 64b of the top cover tape 62 are formed by a process similar to the process described above with reference to FIG.

  9 and 10 show an embodiment in which the present invention is applied to a metal contact spring which is a precision mechanism component, FIG. 9 is a plan view showing a part of a small product package, and FIG. FIG. 10 is a longitudinal sectional view taken along the line XX in FIG. 9.

  The embossed carrier tape 70 of the package 68 has a plurality of receiving recesses 74 formed in a shape corresponding to the planar shape of the contact springs 72 for receiving the contact springs 72 one by one in the longitudinal direction at regular intervals. In addition, a plurality of small circular engagement holes 76 are formed in one side edge portion at equal intervals in the longitudinal direction, like the packaging bodies 10, 34, 52 described above. In the top cover tape 78, a recess 80 having a rectangular planar shape is formed at a portion corresponding to the center of the upper surface of the contact spring 72 accommodated in the accommodation recess 74. The lower surface of the formation part of this dent 80 is formed in a planar shape. The top cover tape 78 is thermocompression bonded in a linear shape at both side edges thereof to form a continuous adhesive portion 82.

  In the package 68, the lower surface of the recess 80 portion of the top cover tape 78 abuts on the upper surface of the central portion of the contact spring 72 accommodated in the accommodation recess 74, and the lower surface of the recess 80 portion and the contact spring 72 in the illustrated example. As a result of the surface contact with the upper surface of the central portion, the contact spring 72 can be reliably prevented from being tilted, overturned or reversed in the housing recess 74. The recess 80 of the top cover tape 78 is formed by a process similar to that described above with reference to FIG.

  Next, FIG. 11 shows an embodiment in which the positions of the recesses formed in the top cover tape are different in the package 68 shown in FIGS. 9 and 10, and the small product package of FIG. It is a figure which shows the longitudinal cross section corresponded to an arrow longitudinal cross section. In FIG. 11, each component member / element labeled with the same symbol as that used in FIG. 10 has the same function / action as each component member / element described with reference to FIGS. 9 and 10. The description about them is omitted.

  In the top cover tape 86 of the package 84, a recess 88 is formed at a portion corresponding to the contact portion 72 a of the contact spring 72 accommodated in the accommodation recess 74 of the embossed carrier tape 70. The lower surface of the formation portion of the recess 88 is in close contact with the contact portion 72 a of the contact spring 72 in the housing recess 74, and the contact portion 72 a is protected in a state covered with the top cover tape 86.

  In the above method described with reference to FIG. 4, the opening surface of the housing recess 18 of the embossed carrier tape 14 is closed with the top cover tape 16, and the top cover tape 16 is thermocompression bonded to the upper surface of the embossed carrier tape 14. The recess 24 is formed in the top cover tape 16 after sealing the sealing recess 18 in the top cover tape 16, but before the top cover tape 16 closes the opening surface of the storage recess 18 of the embossed carrier tape 14, the top cover tape A recess 24 may be formed in 16. FIG. 12 is a schematic front longitudinal sectional view for explaining the series of steps. In FIG. 12, members and elements denoted by the same reference numerals as those used in FIG. 4 are members and elements similar to those described above.

  First, the electronic components 12 are loaded one by one into the accommodating recess 18 while intermittently transporting the embossed carrier tape 14 along its longitudinal direction. On the other hand, the top cover tape 16 is heated and softened by the heater 90 while the top cover tape 16 is intermittently conveyed along the longitudinal direction thereof. Subsequently, the tape processing tool 30 having a pair of pressing projections 32 arranged in parallel in the direction orthogonal to the tape conveyance direction at the tip, and the top cover facing the tape processing tool 30 with the top cover tape 16 therebetween The top cover tape 16 is fed into the installation position of the female block 92 in which a pair of concave portions 94 corresponding to the pair of pressing convex portions 32 are formed on the opposing surfaces close to the tape 16. Then, in a state where the top cover tape 16 (and the embossed carrier tape 14) is stopped, the tape processing tool 30 is moved in a direction approaching the female block 92, and the pair of pressing convex portions 32 is in a softened state. After pressing against the top cover tape 16, the tape processing tool 30 is moved in a direction away from the female block 92. By the reciprocating operation of the tape processing tool 30, a pair of recesses 24 are formed in the top cover tape 16. The electronic component 12 is inserted into the receiving recess 18 of the embossed carrier tape 14 while intermittently transporting the embossed carrier tape 14 with the electronic component 12 inserted into the receiving recess 18 along the longitudinal direction thereof. The top cover tape 16 intermittently fed along the longitudinal direction is superimposed on the upper surface of the portion, and the opening surface of the housing recess 18 in which the electronic component 12 is housed is sequentially closed with the top cover tape 16. At this time, the lower surface of the recess 24 portion of the top cover tape 16 in which the recess 24 is formed and heated and softened is pressed against the upper surface of the electronic component 12 housed in the housing recess 18 of the embossed carrier tape 14, The lower surface of the recess 24 portion of the top cover tape 16 comes into contact with the upper surfaces of both end edges of the electronic component 12 housed in the housing recess 18.

  Subsequently, the embossed carrier tape 14 having the top cover tape 16 superimposed on the upper surface is intermittently conveyed, and the embossed carrier is moved to a position immediately below where the heater block 26 having a pair of linear heaters 28 at the bottom is installed. The tape 14 and the top cover tape 16 are fed. When the embossed carrier tape 14 and the top cover tape 16 are stopped, the heater block 26 is lowered and the linear heater 28 is pressed against the upper surface of the embossed carrier tape 14 with the top cover tape 16 interposed therebetween. The heater block 26 is raised. By the raising / lowering operation of the heater block 26, the top cover tape 16 is thermocompression bonded to the upper surface of the embossed carrier tape 14, and the electronic component 12 is sealed in the housing recess 18.

It is a top view which shows one example of embodiment of this invention and shows a part of small product packaging body. It is a II-II arrow longitudinal cross-sectional view of FIG. FIG. 3 is a partially enlarged longitudinal sectional view of the small product package shown in FIG. 2. It is a schematic front longitudinal cross-sectional view for demonstrating one example of the process of manufacturing the small product package shown in FIG. It is a top view which shows another embodiment of this invention and shows a part of small product packaging body. It is a VI-VI arrow longitudinal cross-sectional view of FIG. It is a top view which shows another embodiment of this invention, and shows a part of small product packaging body. It is a VIII-VIII arrow longitudinal cross-sectional view of FIG. It is a top view which shows another embodiment of this invention, and shows a part of small product packaging body. FIG. 10 is a longitudinal sectional view taken along the line XX in FIG. 9. FIG. 10 shows still another embodiment of the present invention, and is a view showing a vertical cross section of a small product package corresponding to the vertical cross section taken along the line XX of FIG. 9. It is a schematic front longitudinal cross-sectional view for demonstrating another example of the process of manufacturing the small product package shown in FIG.

10, 34, 52, 68, 84 Small product packaging 12, 38, 56 Electronic parts 14, 36, 54, 70 Embossed carrier tape 16, 42, 62, 78, 86 Top cover tape 18, 40, 58, 74 Recess 20, 50, 60, 76 Engagement hole 22, 46, 48, 66, 82 Adhesion 24, 44, 64a, 64b, 80, 88 Recess 26 Heater block 30 Tape processing tool 72 Contact spring (precision mechanism component)
72a Contact portion of contact spring 90 Heater 92 Female block

Claims (6)

An embossed carrier tape having a large number of receiving recesses for receiving small products one by one in a line at equal intervals in the longitudinal direction;
A top cover tape that is releasably adhered to the upper surface of the embossed carrier tape and closes the opening surfaces of the plurality of receiving recesses in which small products are stored;
In a small product package with
The small product has a thin plate-like stepped shape, and the inner bottom surface of the receiving recess of the embossed carrier tape is formed on a stepped surface corresponding to the shape of the small product,
When the top cover tape is bonded to the upper surface of the embossed carrier tape to close the opening surfaces of the multiple receiving recesses in which small products are stored, the opening of each receiving recess of the embossed carrier tape of the top cover tape A recess is formed on the deep bottom side of the receiving recess in the portion covering the surface, and the lower surface of the recessed portion of the top cover tape is brought into contact with or close to the upper surface of a small product stored in the receiving recess. A small product package characterized by that. A charging step of charging small products one by one in the receiving recesses while transporting along the longitudinal direction an embossed carrier tape formed with a large number of receiving recesses in a row at equal intervals in the longitudinal direction;
A top cover tape is overlaid on the top surface of the embossed carrier tape where the small product is inserted into the receiving recess, and the opening of the receiving recess in which the small product is stored is sequentially closed with the top cover tape. Process,
Sealing that heats the portion of the top cover tape that closes the opening of the receiving recess of the embossed carrier tape, adheres the top cover tape to the upper surface of the embossed carrier tape, and sequentially seals small products in the receiving recess. Process,
In the packaging method of small products including
Following the sealing step, the portion of the top cover tape that has been heated and softened is pressed against the portion where the small product is sealed in the housing recess, and the top cover tape covers the opening of the housing recess In this state, the bottom surface of the concave portion of the top cover tape is brought into contact with the upper surface of the small product housed in the housing recess so that the force acting on the small product from the concave portion becomes almost zero. A packaging method for small products, further comprising a tape processing step of curing the top cover tape. A charging step of charging small products one by one in the receiving recesses while transporting along the longitudinal direction an embossed carrier tape formed with a large number of receiving recesses in a row at equal intervals in the longitudinal direction;
A top cover tape is overlaid on the top surface of the embossed carrier tape where the small product is inserted into the receiving recess, and the opening of the receiving recess in which the small product is stored is sequentially closed with the top cover tape. Process,
Sealing that heats the portion of the top cover tape that closes the opening of the receiving recess of the embossed carrier tape, adheres the top cover tape to the upper surface of the embossed carrier tape, and sequentially seals small products in the receiving recess. Process,
In the packaging method of small products including
Prior to the closing step, the top cover tape is heated, and the portion of the top cover tape that has been heated and softened is pressed against the receiving recess of the embossed carrier tape, so that the receiving recess of the top cover tape A tape processing step of sequentially forming a recess in a portion to cover the opening surface of
In the closing step that follows the tape processing step, the lower surface of the recessed portion of the top cover tape that has been heated and softened is applied to the upper surface of a small product that is accommodated in the recessed portion of the embossed carrier tape. A method of packaging a small product, characterized in that the top cover tape is cured in a state in which the force applied to the small product from the recessed portion is almost zero. A charging step of charging small products one by one in the receiving recesses while transporting along the longitudinal direction an embossed carrier tape formed with a large number of receiving recesses in a row at equal intervals in the longitudinal direction;
A top cover tape is overlaid on the top surface of the embossed carrier tape where the small product is inserted into the receiving recess, and the opening of the receiving recess in which the small product is stored is sequentially closed with the top cover tape. Process,
Sealing that heats the portion of the top cover tape that closes the opening of the receiving recess of the embossed carrier tape, adheres the top cover tape to the upper surface of the embossed carrier tape, and sequentially seals small products in the receiving recess. Process,
In the packaging method of small products including
The small product has a thin plate-like stepped shape, and the inner bottom surface of the receiving recess of the embossed carrier tape is formed on a stepped surface corresponding to the shape of the small product,
Following the sealing step, the portion of the top cover tape that has been heated and softened is pressed against the portion where the small product is sealed in the housing recess, and the top cover tape covers the opening of the housing recess Further comprising a tape processing step in which a recess is sequentially formed on the deep bottom side of the housing recess and the lower surface of the recessed portion of the top cover tape is brought into contact with or close to the upper surface of the small product housed in the housing recess. A packaging method for small products. A charging step of charging small products one by one in the receiving recesses while transporting along the longitudinal direction an embossed carrier tape formed with a large number of receiving recesses in a row at equal intervals in the longitudinal direction;
A top cover tape is overlaid on the top surface of the embossed carrier tape where the small product is inserted into the receiving recess, and the opening of the receiving recess in which the small product is stored is sequentially closed with the top cover tape. Process,
Sealing that heats the portion of the top cover tape that closes the opening of the receiving recess of the embossed carrier tape, adheres the top cover tape to the upper surface of the embossed carrier tape, and sequentially seals small products in the receiving recess. Process,
In the packaging method of small products including
The small product has a thin plate-like stepped shape, and the inner bottom surface of the receiving recess of the embossed carrier tape is formed on a stepped surface corresponding to the shape of the small product,
Prior to the closing step, the top cover tape is heated, and the portion of the top cover tape that has been heated and softened is pressed against the receiving recess of the embossed carrier tape, so that the receiving recess of the top cover tape A tape processing step of sequentially forming a recess on the deep bottom side of the housing recess in the portion to cover the opening surface of
In the closing step that follows the tape processing step, the lower surface of the recessed portion of the top cover tape that has been heated and softened is applied to the upper surface of a small product that is accommodated in the recessed portion of the embossed carrier tape. A packaging method for small-sized products, characterized in that it is in contact with or close to each other. A small product has a step on its upper surface,
4. The small size according to claim 2 or 3 , wherein, in the tape processing step, the recesses of the top cover tape are formed at a plurality of locations with different depth dimensions so as to correspond to different top surface heights of the small product. Product packaging method.

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