JP2008222256A - Carrier tape and its manufacturing method, cover tape, embossed carrier package and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an embossed carrier package for stably supplying electronic components by decreasing a difference between cover tapes relative to a peeling strength. <P>SOLUTION: This embossed carrier package 22 comprises a carrier tape 21 with a plurality of storage recesses 2 and a cover tape 12 for sealing the recesses 2 adhered to the tape 21. A recess 3 shallower than the recess 2 is formed on the front face of both sides in the width direction of the recess 2 of the tape 21. The adhesive part 13 of the tape 21 and the tape 12 is formed along the length direction of the tape 21 and superimposes on the recess 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an embossed carrier package that is one of the packaging forms of products such as electronic components, a carrier tape and a cover tape used for the embossed carrier package, a method for producing the carrier tape, and production of the embossed carrier package. About the method.

  Conventionally, when an electronic component or the like is manufactured, a non-defective product is selected by final electrical characteristic inspection and appearance inspection, and the non-defective electronic component or the like is stored in a storage recess of the carrier tape. And it seals with a cover tape, a series of packing bodies are formed and shipped.

  FIG. 10A is a plan view showing a conventional embossed carrier package 31 in which the electronic component 14 is housed, and FIG. 10B is a view taken along the line AA in FIG. c) is a BB arrow line view in Drawing 10 (a). In the carrier tape 1, a transport sprocket hole 4 is formed on one side in the length direction. A plurality of storage recesses 2 having a concave cross section are provided at predetermined intervals along the length direction of the carrier tape 1. The storage recess 2 is for storing the electronic component 14, and a partition 18 is provided between the storage recesses 2.

  In the taping of the electronic component 14, the cover tape 12 is bonded to the upper surface of the carrier tape 1 in which the electronic component 14 is disposed in the storage recess 2 so as to cover the upper surface. At this time, the adhesive portion 13 between the carrier tape 1 and the cover tape 12 is formed to have an equal width along the length direction of the carrier tape 1 on each upper surface on both sides in the width direction across the storage recess 2 of the carrier tape 1. Is done.

  11A is a plan view showing a state where the cover tape 12 is bonded to the carrier tape 1, FIG. 11B is a view taken along the line AA in FIG. 11A, and FIG. It is a BB arrow line view in Fig.11 (a). When adhering the cover tape 12 to the carrier tape 1, a guide rail 17 is placed on the carrier tape 1 and moved in a take-up reel (not shown) direction (arrow direction E) at a predetermined pitch, and a guide A trowel 15 disposed so as to be movable up and down above the rail 17 and a heater (not shown) for heating the trowel 15 are used. The iron 15 has a pair of pressing portions 15 a that are smaller than each width of the upper surface excluding the housing recess 2 and the sprocket hole 4 in the width direction of the carrier tape 1.

  To form the embossed carrier package 31, first, the electronic component 14 is stored in the storage recess 2 of the carrier tape 1 placed on the guide rail 17. Then, the cover tape 12 is supplied to the upper surface of the carrier tape 1, and then the iron 15 heated by the heater is lowered onto the cover tape 12. Then, the cover tape 12 is thermocompression bonded onto the carrier tape 1 by the pair of pressing portions 15a pressing the cover tape 12 from above. The thermocompression bonding by the iron 15 is repeatedly performed in accordance with the movement pitch of the carrier tape 1, and the carrier tape 1 and the cover tape 12 are continuously bonded.

Patent Document 1 listed below discloses an embossed carrier package containing electronic components, and further describes a method for manufacturing an embossed carrier package using a guide rail and a trowel.
JP 7-112708 A

However, the conventional embossed carrier package 31 shown in FIG. 10 has the following problems.
Since the carrier tape 1 is formed with a storage recess 2 having a concave cross section, after the cover tape 12 is adhered, the take-up reel has a polygonal shape in which the partitioning portion 18 between the storage recesses 2 is bent to become a bent portion. It is wound up. In addition, since the winding is performed not only immediately after the cover tape 12 is bonded, but also several times such as inspecting whether or not the electronic component 14 is stored in the storage recess 2, the bending portion 18 is bent. The load of is heavy.

  For this reason, while the winding is repeated, the peel strength of the portion Y corresponding to both sides in the width direction of the partition portion 18 of the bonded portion 13 (that is, the portion surrounded by the two-dot chain line in FIG. 10A) is shown in FIG. a portion X that is lowered as shown in the graph shown in a) and is not subjected to bending load corresponding to both sides in the width direction of the housing recess 2 of the adhesive portion 13 (that is, a portion surrounded by a broken line in FIG. 10A) There is a large difference in the peel strength of the cover tape 12 at the site Y.

  Therefore, if the overall peel strength is increased in order to reinforce the peel strength of the portion Y, the peel strength of the portion X is increased, and the mounting machine that supplies the carrier tape 1 has the ability to peel the cover tape 12. I had to raise it. Usually, the range of the peel strength of the cover tape 12 is determined so as to match the peelability of the cover tape 12 of the mounting machine, and if the peel strength of the cover tape 12 is not controlled within the standard range, the peeling process, That is, there is a problem that the supply of the electronic component 14 is hindered in the mounting process or the like.

  In addition, the large difference in the peel strength causes the carrier tape 1 to vibrate so that the electronic component 14 stored in the storage recess 2 may or may not jump out of the storage recess 2. Inclination is caused, and this causes a pickup error when the electronic component 14 is taken out.

  Moreover, in the said patent document 1, the part corresponding to the width direction both sides of the partition part of an adhesion part is enlarged by enlarging the adhesion area of a partition part by enlarging the width | variety of the press part which contacts a cover tape of a iron in a partition part. The peeling strength of the part corresponding to both sides of the partition part of the bonding part and the peeling strength of the part corresponding to both sides of the storage recess part of the bonding part are reduced. However, in such a method, it is necessary to prepare a trowel having a shape that matches the position of the partition portion of the carrier tape, and there is a problem that the process becomes complicated.

  The present invention reduces the difference in peel strength by reducing the adhesive strength between the cover tape and the parts located on both sides of the carrier tape storage recess, and enables stable supply of products (electronic parts, etc.). It is an object of the present invention to provide a method for producing a tape and a carrier tape, a cover tape, an embossed carrier package, and a method for producing an embossed carrier package.

In order to solve the above-described problem, the first invention is a carrier in which a plurality of storage recesses for storing products are formed at predetermined intervals in the length direction, and the storage recesses are sealed with a cover tape. A tape,
A partition is formed between the storage recesses,
On the surface on both sides in the width direction of the storage recess, a recess that is shallower than the storage recess is formed,
The recessed portion overlaps the adhesive portion with the cover tape.

  According to this, when bonding the cover tape to the surface of the carrier tape by thermocompression bonding using an adhesive device, the pressure and heat from the adhesive device are less likely to be transmitted to the dent compared to other locations, and the adhesive strength is reduced. To do. For this reason, the peeling strength of the adhesion part of the cover tape in the position corresponding to a storage recessed part can be made small compared with the past. As a result, the difference between the peel strength at the site corresponding to the cover recess of the cover tape and the peel strength at the site corresponding to the partition portion of the cover tape can be reduced, so that the vibration of the carrier tape during product mounting can be reduced. It is possible to prevent this, and a stable product can be supplied.

  Further, the second invention is a method of manufacturing the carrier tape according to the first invention, wherein a step of forming a carrier sprocket hole by punching the carrier tape using a common mold, and the carrier tape And the step of forming a recess on the surface of the substrate.

According to this, the time required for manufacturing the carrier tape can be shortened.
The third invention is an embossed carrier package using the carrier tape according to the first invention,
The product is stored in the storage recess,
The cover tape is bonded to the surface of the carrier tape, and the storage recess is sealed with the cover tape.
The adhesion part of a carrier tape and a cover tape is formed along the length direction of a carrier tape, and overlaps on a dent part.

  According to this, since the difference between the peel strength at the portion corresponding to the cover recess of the cover tape and the peel strength at the portion corresponding to the partition portion of the cover tape can be reduced, the vibration of the carrier tape during product mounting can be reduced. Can be prevented, and stable supply of products can be achieved.

Moreover, this 4th invention is a manufacturing method of the embossed carrier packing body as described in the said 3rd invention,
After the product is stored in the storage recess of the carrier tape, the cover tape is pressed from the upper surface of the cover tape to the surface of the carrier tape by using an adhesive device and bonded.

The fifth invention is a cover tape for sealing a storage recess by bonding a plurality of storage recesses for storing products to the surface of a carrier tape formed at predetermined intervals in the length direction. And
It has a narrow part with a narrow dimension in the width direction,
A plurality of narrow portions are formed in the length direction,
The space | interval between each narrow part in a length direction is the same as the space | interval between each storage recessed part of a carrier tape.

  According to this, when each narrow portion of the cover tape is placed on each storage recess of the carrier tape, and the cover tape is bonded to the surface of the carrier tape by thermocompression bonding using an adhesive device, The adhesive part with the carrier tape is located on both sides in the width direction of each storage recess of the carrier tape, and the adhesive part of the cover tape other than the narrow part of the cover tape and the carrier tape is formed between the storage recesses of the carrier tape. It can be positioned on both sides of the partition portion in the width direction, and the width of the adhesive portion between the narrow portion of the cover tape and the carrier tape is narrower than the width of the adhesive portion between the portion other than the narrow portion of the cover tape and the carrier tape. be able to.

  For this reason, the peeling strength of the adhesion part of the cover tape in the position corresponding to a storage recessed part can be made small compared with the past. As a result, the difference between the peel strength at the site corresponding to the cover recess of the cover tape and the peel strength at the site corresponding to the partition portion of the cover tape can be reduced, so that the vibration of the carrier tape during product mounting can be reduced. It is possible to prevent this, and a stable product can be supplied.

Moreover, this 6th invention is an embossed carrier packaging body using the cover tape and the carrier tape as described in said 5th invention,
A partition is formed between the storage recesses of the carrier tape,
The product is stored in the storage recess of the carrier tape,
With each narrow portion of the cover tape disposed on each storage recess of the carrier tape, the cover tape is bonded to the surface of the carrier tape and each storage recess is sealed with the cover tape,
The adhesive part between the narrow part of the cover tape and the carrier tape is located on both sides of each storage recess of the carrier tape,
The part of the cover tape other than the narrow part of the cover tape and the carrier tape are located on both sides of each partition of the carrier tape,
The width of the adhesive portion between the narrow portion of the cover tape and the carrier tape is narrower than the width of the adhesive portion between the portion other than the narrow portion of the cover tape and the carrier tape.

  According to this, the peeling strength of the adhesion part of the cover tape in the position corresponding to a storage recessed part can be made small compared with the past. As a result, the difference between the peel strength at the site corresponding to the cover recess of the cover tape and the peel strength at the site corresponding to the partition portion of the cover tape can be reduced, so that the vibration of the carrier tape during product mounting can be reduced. It is possible to prevent this, and a stable product can be supplied.

Moreover, this 7th invention is a manufacturing method of the embossed carrier packing body as described in the said 6th invention,
After storing the product in the storage recess of the carrier tape,
Place each narrow part of the cover tape on each storage recess of the carrier tape,
There is a step of pressing and adhering the cover tape to the surface of the carrier tape from the upper surface of the cover tape using the adhesive device so that the end portion in the width direction of the narrow portion of the cover tape is in contact with the pressing portion of the adhesive device. And
At the time of the said process, the press part of an adhesion | attachment apparatus protrudes from the edge part in the width direction of the narrow part of a cover tape to the outer side of the width direction.

  According to this, each narrow part of the cover tape is arranged on each storage recess of the carrier tape, the cover tape is pressed by the pressing part of the bonding device, and the cover tape is bonded to the surface of the carrier tape by thermocompression bonding. . At this time, since the pressing portion of the bonding device protrudes from the end in the width direction of the narrow portion of the cover tape to the outside in the width direction, the width of the adhesive portion between the narrow portion of the cover tape and the carrier tape is set to the narrow portion of the cover tape. It can be formed narrower than the width of the bonded portion between the other portion and the carrier tape.

  As described above, according to the present invention, it is possible to reduce the difference between the peel strength at the portion corresponding to the housing recess portion of the cover tape and the peel strength at the portion corresponding to the partition portion of the cover tape. The vibration of the carrier tape at the time can be prevented, and a stable product can be supplied.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The same members as those described above are denoted by the same reference numerals and description thereof is omitted.
(Embodiment 1)
First, the carrier tape in Embodiment 1 is demonstrated. 1A is a plan view of the carrier tape 21, FIG. 1B is a view taken along the line AA in FIG. 1A, and FIG. 1C is a BB arrow in FIG. 1A. FIG.

  In the carrier tape 21, a sprocket hole 4 for conveyance is formed on one side in the length direction. A plurality of storage recesses 2 having a concave cross section are provided at predetermined intervals along the length direction of the carrier tape 21. The storage recess 2 is for storing an electronic component 14 (an example of a product), and a partition 18 is provided between the storage recesses 2. On the surface of the carrier tape 21 on both sides in the width direction of the storage recess 2, a recess 3 that is shallower than the storage recess 2 is formed. Usually, the depth of the storage recess 2 is 0.5 mm to 5 mm, and the depth of the recess 3 is 0.1 mm to 0.3 mm. However, these numerical values are examples, and are limited to these values. Is not to be done.

  FIG. 2 is a diagram illustrating a manufacturing process of the carrier tape 21. The carrier tape 21 is conveyed at a predetermined pitch in a direction D indicated by an arrow. First, as a first step, a resin-made belt-like sheet before the storage recess 2 is formed is heated by the heating platen 5. Next, in the second step, the belt-like sheet that has been pitch-transferred with the length corresponding to the entire length of the metal mold 6 as one pitch is sent to the metal mold 6 and pressure is applied from the pipe 7 to store the concave recess in the belt-like sheet. 2 is formed. In the present embodiment, the concave pressure molding is shown, but concave convex molding, concave convex molding using pressure air, convex pressure molding, and vacuum molding can also be applied.

  Next, in the third step, the sprocket hole 4 is punched out by the sprocket hole punching die 9 attached to the upper die 8a of the die base 8 (common die), and at the same time, the concave portion attached to the upper die 8a. The recess 3 is also formed by the metal mold 10.

  FIG. 3 is a diagram showing details of the third step, and FIG. 3 (a) shows a state before the upper mold 8a of the mold base 8 is pushed down to the lower mold 8b, and FIG. 3 (b). Fig. 3C is a view showing a state in which the upper die 8a is lowered to the lower die 8b, and Fig. 3C is a view showing a state where the upper die 8a is lifted from the lower die 8b and the machining is completed. 4 is a detailed view of the upper mold 8a of the mold base 8, FIG. 4 (a) is a view taken along the line BB in FIG. 3 (a), and FIG. 4 (b) is in FIG. 4 (a). AA arrow line view is shown.

  As shown in FIG. 4, the upper mold 8a of the mold base 8 is provided with a plurality of sprocket hole punching molds 9 and recessed part molds 10, and each recessed part mold 10 has a plurality of protrusions at its tip. Part 11. Thereby, the recess 3 is formed on the surface of the carrier tape 21. The recess portion mold 10 and the convex portion 11 are heated by a heater (not shown), and the resin carrier tape 21 can be easily deformed. Thus, by attaching the sprocket hole punching die 9 and the recess die 10 to the upper die 8a of the die base 8, the sprocket hole 4 and the recess 3 can be simultaneously formed without increasing the number of man-hours. can do. Thereby, the time required to manufacture the carrier tape 21 can be shortened.

  In the present embodiment, as shown in FIGS. 4 (a) and 4 (b), the convex portion 11 is formed in a rectangular shape, but as shown in FIGS. 4 (c) and 4 (d). Thus, the convex part 11 may be formed in a round shape, or as shown in FIG. 4E and FIG. 4F, the convex part 11 having a corrugated cross section may be used.

The carrier tape 21 is completed through the above steps.
Next, the structure of the embossed carrier package 22 using the carrier tape 21 will be described.
5 shows the embossed carrier package 22, FIG. 5 (a) is a plan view of the embossed carrier package 22, FIG. 5 (b) is an AA arrow view in FIG. 5 (a), and FIG. 5 (c). Shows a BB arrow view in FIG.

  According to this, the electronic component 14 is arrange | positioned in each accommodation recessed part 2, and the cover tape 12 is adhere | attached on the upper surface of the carrier tape 21 in the state which covers the upper surface. The adhesive portion 13 between the carrier tape 21 and the cover tape 12 is formed to have an equal width along the length direction of the carrier tape 21 on each upper surface on both sides in the width direction across the storage recess 2. 3 is overlaid.

Next, a manufacturing method for forming the embossed carrier package 22 will be described.
6A is a plan view showing a state where the cover tape 12 is bonded to the carrier tape 21, FIG. 6B is a view taken along the line AA in FIG. 6A, and FIG. It is a BB arrow line view in Fig.6 (a).

  When the cover tape 12 is bonded to the carrier tape 21, the guide rail 17 is placed on the carrier tape 21 and moved in a take-up reel (not shown) direction (arrow direction E) at a predetermined pitch, and a guide A trowel 15 (an example of a bonding apparatus) disposed so as to be movable up and down above the rail 17 and a heater (not shown) for heating the trowel 15 are used. The iron 15 has a pair of pressing portions 15 a smaller than the respective widths of the upper surface excluding the housing recess 2 and the sprocket hole 4 in the width direction of the carrier tape 21.

  In order to form the embossed carrier package 22, first, the electronic component 14 is stored in the storage recess 2 of the carrier tape 21 placed on the guide rail 17. Then, the cover tape 12 is supplied to the upper surface of the carrier tape 21, and then the iron 15 heated by the heater is lowered onto the cover tape 12. Then, the pressing portion 15 a of the iron 15 presses the cover tape 12 from above, so that the cover tape 12 is thermocompression bonded onto the carrier tape 21. The thermocompression bonding by the iron 15 is repeatedly performed according to the moving pitch of the carrier tape 21, and the carrier tape 21 and the cover tape 12 are continuously bonded.

When the cover tape 12 is thermocompression bonded to the carrier tape 21, the recess 3 is less likely to transmit pressure and heat from the trowel 15 than at other locations, and the adhesive strength is reduced. For this reason, as shown in the graph of FIG. 12B, the cover tape 12 in the portion X corresponding to both sides in the width direction of the storage recess 2 of the adhesive portion 13 (that is, the portion surrounded by the broken line in FIG. 5A). The peel strength can be reduced as compared with the conventional case. Thereby, the peeling strength of the cover tape 12 in the part X and the peeling of the cover tape 12 in the part Y corresponding to both sides of the partition portion 18 of the bonding part 13 (that is, the part surrounded by the two-dot chain line in FIG. 5A). Since the difference with the strength can be reduced, the vibration of the carrier tape 21 at the time of mounting the electronic component 14 can be prevented, and the electronic component 14 can be stably supplied.
(Embodiment 2)
Next, the cover tape in Embodiment 2 of this invention is demonstrated. Fig.7 (a) is a top view of the cover tape 26, FIG.7 (b) is an AA arrow line view in Fig.7 (a).

  The cover tape 26 has a narrow portion 26a having a narrow dimension in the width direction and a wide portion 26b having a width wider than the narrow portion 26a. A plurality of the narrow portions 26 a and the wide portions 26 b are alternately formed in the length direction of the cover tape 26. The interval F between the narrow portions 26a in the length direction of the cover tape 26 is the same as the interval G (see FIG. 8A) between the storage recesses 2 of the carrier tape 21. The width of the wide portion 26b is the same as the width of the cover tape 12 in the first embodiment and the width of the conventional cover tape 12.

  FIG. 8 is a view of an embossed carrier package 27 using the cover tape 26, FIG. 8A is a plan view of the embossed carrier package 27, and FIG. 8B is an AA view in FIG. 8A. It is an arrow view. According to this, the electronic component 14 is arrange | positioned in each accommodation recessed part 2, and the cover tape 26 is adhere | attached on the upper surface of the carrier tape 1 in the state which covers the upper surface. Each narrow portion 26 a of the cover tape 26 is disposed on each storage recess 2 of the carrier tape 1, and each wide portion 26 b is disposed on each partition portion 18.

  The adhesive portion 13 between the carrier tape 1 and the cover tape 26 is formed along the length direction of the carrier tape 1 on each upper surface on both sides in the width direction across the storage recess 2. Among the adhesive portions 13, the adhesive portions 13 a between the narrow portion 26 a of the cover tape 26 and the carrier tape 1 are located on both sides in the width direction of the storage recess 2 of the carrier tape 1. In addition, the adhesive portions 13 b between the wide portion 26 b (corresponding to portions other than the narrow portion 26 a) of the cover tape 26 and the carrier tape 1 are located on both sides in the width direction of the partition portion 18 of the carrier tape 1. The width Wa of the bonding portion 13a is formed narrower than the width Wb of the bonding portion 13b.

Next, a manufacturing method for forming the embossed carrier package 27 will be described.
9A is a plan view showing a state where the cover tape 26 is bonded to the carrier tape 1, FIG. 9B is a view taken along the line AA in FIG. 9A, and FIG. It is a BB arrow line view in Fig.9 (a). When the cover tape 26 is bonded to the carrier tape 1, the guide rail 17 is placed on the carrier tape 1 and moved in a take-up reel (not shown) direction (arrow direction E) at a predetermined pitch, and a guide A trowel 15 (an example of a bonding apparatus) disposed so as to be movable up and down above the rail 17 and a heater (not shown) for heating the trowel 15 are used. The iron 15 has a pair of pressing portions 15 a that are smaller than each width of the upper surface excluding the housing recess 2 and the sprocket hole 4 in the width direction of the carrier tape 1.

  The width W1 of the narrow portion 26a of the cover tape 26 is set to be smaller than the width W2 between the outer side surfaces of the pair of pressing portions 15a and larger than the width W3 between the inner side surfaces. The width W4 of the wide portion 26b of the cover tape 26 is set to be equal to or greater than the width W2 between the outer surfaces of the pair of pressing portions 15a.

  In order to form the embossed carrier package 27, first, the electronic component 14 is stored in the storage recess 2 of the carrier tape 1 placed on the guide rail 17. Then, the cover tape 26 is supplied to the upper surface of the carrier tape 1 so that the narrow portion 26 a of the cover tape 26 is positioned on the housing recess 2 of the carrier tape 1.

  Thereafter, the iron 15 heated by the heater is lowered onto the cover tape 26. When the pressing portion 15 a presses the cover tape 26 from above, the cover tape 26 is thermocompression bonded onto the carrier tape 1. The thermocompression bonding by the iron 15 is repeatedly performed in accordance with the movement pitch of the carrier tape 1, and the carrier tape 1 and the cover tape 26 are continuously bonded.

  In the thermocompression bonding, since the relationship of width W3 <width W1 <width W2 and the relationship of width W2 ≦ width W4 are satisfied, both pressing portions 15a of the trowel 15 are connected to the cover tape 26 as shown in FIG. The width of the bonding portion 13a of the portion X (that is, the portion surrounded by the broken line in FIG. 8A) that protrudes from the end in the width direction of the narrow portion 26a to the outside in the width direction and corresponds to both sides in the width direction of the storage recess 2 Wa is formed narrower than the width Wb of the bonding portion 13b of the portion Y corresponding to both sides in the width direction of the partition portion 18 (that is, the portion surrounded by the two-dot chain line in FIG. 8A). For this reason, the peeling strength of the adhesion part 13a of the cover tape 26 in the said part X can be made small compared with the past. As a result, the difference between the peel strength of the adhesive portion 13a of the cover tape 26 at the portion X and the peel strength of the adhesive portion 13b of the cover tape 26 at the portion Y can be reduced. The vibration of the carrier tape 1 can be prevented, and the electronic component 14 can be supplied stably.

  The embossed carrier package may be formed by bonding the cover tape 26 (see FIG. 7) shown in the second embodiment to the carrier tape 21 (see FIG. 1) shown in the first embodiment.

  The embossed carrier package according to the present invention can reduce the difference in peel strength between the carrier tape and the cover tape, and can prevent vibration of the carrier tape that occurs when the cover tape is peeled off when mounting the electronic component. It is useful for packing bodies to be stored.

It is a figure of the carrier tape in Embodiment 1 of this invention, (a) is a top view, (b) is an AA arrow directional view in (a), (c) is a BB arrow directional view in (a). Figure The figure which shows the manufacturing process of the carrier tape Same detail of manufacturing process of carrier tape FIG. 4 is a detailed view of the upper die of the mold base used in a part of the manufacturing process of the carrier tape, (a) is a view taken along the line BB in FIG. 3 (a), and (b) is (a). (A) is a diagram showing another modification, (d) is a diagram showing an AA arrow in (c), (e) is a diagram showing another modification, (f) Is the AA arrow view in (e). It is a figure of the embossed carrier packing body using a carrier tape, (a) is a top view, (b) is an AA arrow view in (a), (c) is a BB arrow in (a). View It is a figure which shows the manufacturing process of the embossed carrier package using a carrier tape, (a) is a top view, (b) is an AA arrow view in (a), (c) is in (a). BB arrow view It is a figure of the cover tape in Embodiment 2 of this invention, (a) is a top view, (b) is an AA arrow line view in (a). It is a figure of the embossed carrier packing body using a cover tape, (a) is a top view, (b) is an AA arrow line view in (a). It is a figure which shows the manufacturing process of the embossed carrier package using a cover tape, (a) is a top view, (b) is an AA arrow view in (a), (c) is in (a). BB arrow view It is a figure of the conventional embossed carrier package, (a) is a top view, (b) is an AA arrow view in (a), (c) is a BB arrow view in (a). It is a figure which shows the manufacturing process of an embossed carrier packing body similarly, (a) is a top view, (b) is an AA arrow line view in (a), (c) is a BB arrow line in (a). Figure It is a graph which shows the peeling strength of the cover tape of an embossed carrier package, (a) is the conventional embossed carrier package, (b) is the embossed carrier package of Embodiment 1, 2 of this invention.

Explanation of symbols

1 Carrier Tape 2 Storage Recess 3 Recess 4 Sprocket Hole 8 Mold Base (Common Mold)
12 Cover tape 13, 13a, 13b Adhesive part 14 Electronic component (product)
15 Iron (bonding device)
15a Press part 18 Partition part 21 Carrier tape 22 Embossed carrier packing body 26 Cover tape 26a Narrow part 26b Wide part (parts other than the narrow part)
27 Embossed carrier package F Gap between narrow portions of cover tape G Gap between recessed portions of carrier tape Wa Width of narrowed portion of cover tape and carrier tape Wb Wide width of cover tape and carrier tape Adhesive width

Claims (7)

A plurality of storage recesses for storing products are formed at predetermined intervals in the length direction, and the storage recesses are carrier tapes sealed with a cover tape,
A partition is formed between the storage recesses,
On the surface on both sides in the width direction of the storage recess, a recess that is shallower than the storage recess is formed,
A carrier tape characterized in that the dent portion overlaps an adhesive portion with the cover tape. It is a manufacturing method of the carrier tape according to claim 1,
A method for manufacturing a carrier tape, comprising simultaneously performing a step of punching and forming a sprocket hole for transportation on a carrier tape using a common mold and a step of forming a recess on the surface of the carrier tape. An embossed carrier package using the carrier tape according to claim 1,
The product is stored in the storage recess,
The cover tape is bonded to the surface of the carrier tape, and the storage recess is sealed with the cover tape.
An embossed carrier packaging body, wherein an adhesive portion between a carrier tape and a cover tape is formed along a length direction of the carrier tape and overlaps with a recessed portion. A method for manufacturing an embossed carrier package according to claim 3,
Manufacturing of an embossed carrier package comprising a step of pressing and bonding the cover tape to the surface of the carrier tape from the upper surface of the cover tape using an adhesive device after the product is stored in the storage recess of the carrier tape Method. A plurality of storage recesses for storing products are bonded to the surface of a carrier tape formed at a predetermined interval in the length direction to seal the storage recesses,
It has a narrow part with a narrow dimension in the width direction,
A plurality of narrow portions are formed in the length direction,
A cover tape characterized in that the distance between the narrow portions in the length direction is the same as the distance between the storage recesses of the carrier tape. An embossed carrier package using the cover tape and the carrier tape according to claim 5,
A partition is formed between the storage recesses of the carrier tape,
The product is stored in the storage recess of the carrier tape,
With each narrow portion of the cover tape disposed on each storage recess of the carrier tape, the cover tape is bonded to the surface of the carrier tape and each storage recess is sealed with the cover tape,
The adhesive part between the narrow part of the cover tape and the carrier tape is located on both sides of each storage recess of the carrier tape,
The part of the cover tape other than the narrow part of the cover tape and the carrier tape are located on both sides of each partition of the carrier tape,
An embossed carrier packaging body characterized in that the width of the adhesive portion between the narrow portion of the cover tape and the carrier tape is narrower than the width of the adhesive portion between the portion other than the narrow portion of the cover tape and the carrier tape. A method for manufacturing an embossed carrier package according to claim 6,
After storing the product in the storage recess of the carrier tape,
Place each narrow part of the cover tape on each storage recess of the carrier tape,
There is a step of pressing and adhering the cover tape to the surface of the carrier tape from the upper surface of the cover tape using the adhesive device so that the end portion in the width direction of the narrow portion of the cover tape is in contact with the pressing portion of the adhesive device. And
The manufacturing method of the embossed carrier package characterized by the above-mentioned. WHEREIN: The press part of an adhesion | attachment apparatus protrudes from the edge part in the width direction of the narrow part of a cover tape to the outer side of the width direction.

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