JP5569912B2 - Lead frame and semiconductor package manufacturing method using the same - Google Patents

Description

  The present invention relates to a lead frame processed into a strip shape and a method of manufacturing a semiconductor package using the lead frame.

  In general, a lead frame is formed by forming a pad portion or a lead portion by pressing or etching a metal material having a thickness of 0.1 to 0.25 mm into a predetermined pattern, and a plurality of lead frames are about 200 mm long. Then, the strips are packed in a stacked state and conveyed to an assembly process for mounting semiconductor elements. Even a single sheet formed into a strip shape is called a lead frame.

  When these plural sheets are stacked, the stacked lead frames rub against each other, and a defect such as deformation or scratch may occur. Therefore, a slip sheet called dust-free paper or resin-made interleaving paper is sandwiched between lead frames to prevent problems.

  However, in the case of using the interleaf paper, there is a problem in that an interleaf paper that matches the product shape is required, which increases costs. In addition, it is necessary to insert an insertion sheet when manufacturing the lead frame, and to remove the insertion sheet when assembling the semiconductor package using the lead frame.

  Therefore, in Patent Documents 1 and 2, the lead frame is bent to form a protrusion so that a gap is formed when the lead frames are stacked so that the insertion sheet is not used. A method for preventing deformation and scratches of the lead frame is described.

  Patent Document 1 discloses a lead frame in which a punch is abutted against a lead frame outer frame portion to be recessed, and a hemispherical protrusion is formed on the opposite side. When the lead frames are stacked, an interval corresponding to the height of the projection is provided.

  Further, in the lead frame and the manufacturing method thereof described in Patent Document 2, a die and a punch are used for the lead frame, and the clearance between the punch and the die is made larger than in the case of normal punching. The interval when stacked is obtained by performing half-punching of about / 4 to 1/6.

JP-A-53-66170 JP-A-6-177309

  However, when a protrusion is formed on the lead frame so as not to use an interleaving sheet, the protrusion is released to a jig or the like in each process in advance so that the protrusion does not interfere in the assembly process of the semiconductor package. It was necessary to apply the processing for. If there is a process that cannot be processed even in one process, a method of forming a protrusion shape on the lead frame cannot be adopted.

  Therefore, the present invention has been made to solve the above-described problems. Even when lead frames are stacked, a gap is provided when the lead frames are stacked without using an interleaf, and a conventional semiconductor is provided. It is an object of the present invention to provide a lead frame and a method of manufacturing a semiconductor package using the lead frame, which do not require modification or new production of jigs and tools in the package assembly process.

In order to achieve the above object, the lead frame of the present invention has two rising portions formed on the outer frame portion of the lead frame having a strip shape by raising the bent frame from the outer frame portion, and A desired number of bending patterns are formed to form deformable deformable parts connected to the raised ends of the two raised parts , and at least one bend is formed in the deformable parts. A portion is formed .

Alternatively, in the lead frame of the present invention, two rising portions are formed on the outer frame portion of the lead frame having a strip shape by raising the bent frame from the outer frame portion, and the two rising portions A desired number of bending patterns for forming deformable deformable portions connected to the raised ends are formed, and the width of the deformable portions is narrower than the width of the bent portions. It is characterized by that.

In the present invention, it is preferable that the width of the deformed portion is narrower than the width of the bent portion .

In the present invention, it is preferable that the two raised portions are formed so that the raised tips face each other .

  In the present invention, the width of the bent portion is preferably 1.5 times or more the lead frame thickness, and the width of the deformed portion is preferably 0.8 to 1.2 times the lead frame thickness.

  Alternatively, the lead frame of the present invention is characterized in that the above lead frame is used and the bending pattern is bent so as to protrude to the side on which the semiconductor element is mounted.

  In the present invention, it is preferable that the bending pattern is formed so that a rising portion is formed by rising at the bent portion, and the deforming portion expands. It is more preferable to have a bending height equal to or greater than the thickness of the lead frame.

  In the present invention, it is preferable that the bent pattern is returned to a substantially flat shape by a pressing process.

  Alternatively, in the manufacturing method of the semiconductor package of the present invention, two rising portions formed by rising from the outer frame portion at the bent portion on the outer frame portion of the lead frame having a strip shape, and the bent portion Necessary number of bending patterns for forming a deformable deformable portion by connecting the tips of the two raised portions, which are narrower and raised at the bent portion, are necessary for the bending pattern. The bending pattern is bent to a certain height, and then the bent pattern is brought into contact with another lead frame and conveyed in a state where a plurality of lead frames are laminated, and then laminated in an arbitrary step. After taking out one lead frame from the state, the bent pattern is pushed back to make it substantially flat, and includes a step of feeding into the subsequent steps. To.

  According to the present invention, it is possible to provide a lead frame that can be stacked without using an interleaf after manufacturing the lead frame, and that does not require modification of jigs and tools in the assembly process of the semiconductor package. . In addition, by not using the interleaving paper, it is possible to reduce costs and improve productivity.

It is a top view which shows an example of the lead frame which has arrange | positioned the pattern for bending process of this invention in the outer frame part. It is the figure seen from the side surface of the state which laminated | stacked the lead frame of this invention. It is an enlarged plan view of the pattern for bending before bending. It is an enlarged plan view of the pattern for bending after crushing . It is an enlarged side view of the pattern for bending after bending. It is an expansion perspective view of the pattern for bending after bending. It is an enlarged plan view which shows the other example of the pattern for bending before a bending.

Hereinafter, modes for carrying out the present invention will be described.
In the lead frame of the present invention, the tip of the lead frame that is formed in a strip-like shape is raised from the outer frame portion at the bent portion, and the tip of another raised portion that is similarly raised. Two raised portions formed so as to face each other, and a deformed portion having a bent portion so that the width is narrower than that of the bent portion and connected to the raised ends of the two raised portions so as to be deformable A desired number of patterns for bending are formed.

  By forming this bending pattern on the outer frame portion of the lead frame having sufficient metal material, no warping or deformation occurs even when bending is performed at a wide bent portion. By setting the rising angle at the bent portion to 65 degrees or more and 85 degrees or less, the rising section secures a gap equal to or greater than the thickness of the insertion sheet without reducing the plate thickness. be able to. In addition, the narrow deformed part connecting the tips of the two raised parts is deformed so that the bent part opens the distance between the raised part tips widened by raising the raised part. It is possible to cope with this spread.

  The rising portion needs to have a strength capable of holding the shape rising against the force that the deformed portion expanding so that the bent portion is opened returns. Therefore, the width of the bent portion is 1.5 times or more of the lead frame thickness, and the width of the deformed portion is about 0.8 to 1.2 times the lead frame thickness. The deformed portion opens in the width direction instead of the thickness direction when the raised portion is raised with respect to the formed pattern. Therefore, a deformation | transformation part becomes difficult to deform | transform, when a width | variety is wide with respect to plate | board thickness, and when it is narrow, it will become easy to deform | transform. Therefore, in order to make the deformed portion easy to deform, the width is set to about 0.8 to 1.2 times the lead frame thickness, while the bent portion is made wider than 1.5 times the lead frame thickness, Ensuring the strength that can hold the shape of the deformed portion that has stood up against the force to return to the original.

  Further, the semiconductor package manufacturing method of the present invention has two rising portions formed by rising from the outer frame portion at the bent portion on the outer frame portion of the strip-shaped lead frame, and the width from the bent portion. Bending process that forms the desired number of bending patterns to form a deformable deformable part by connecting the tips of two raised parts that are raised at a narrow bent part, and forming the required height for the bending pattern Next, the bent pattern that is bent is brought into contact with another lead frame and conveyed in a state in which a plurality of lead frames are stacked, and then a single lead frame from the state in which it is stacked in an arbitrary process thereafter Then, the bent pattern is pushed back so as to be substantially flat, and the process is put into the subsequent process.

  At the time of bending, the bent portion is bent so that the rising portion is raised at the wide bent portion, and the deformed portion having the narrow width is formed by being deformed and widened so that the bent portion opens a wide distance. On the other hand, in the assembly process of the semiconductor package, by pushing back the bending pattern, the deformed and widened bent part is deformed in a narrowing direction, and the widened deformed part is restored to its original shape and bent. The bending pattern is returned to almost flat, and the strip-shaped lead frame is returned to the state before bending, so there is no need to modify the jig in the assembly process, and the conventional jig can be used as it is. It is.

  Note that the amount of gap between the bent pattern and the other lead frame is determined by contacting the bent pattern with the other adjacent lead frame. This gap amount depends on the angle and length of the rising portion. Determined. And in order to ensure a clearance gap reliably, it is preferable to have the bending height more than the thickness of a lead frame, for example. If the bending height is greater than or equal to the plate thickness, the stability of the bending dimension increases. That is, when the bending height is low, the amount of deformation of the deforming portion is small, that is, the opening at the bending portion is small, so that the bending height is not stable due to the influence of the springback.

  Moreover, in order to ensure bending height, it is preferable that a raising part is a bending part and a raising angle shall be 65 to 85 degree | times. As described above, when the rising angle is small, the amount of deformation of the deforming portion is small, and the bending height is not stable due to the influence of the spring back. Therefore, the rising angle is set to 65 degrees or more. On the other hand, in the assembly process of the semiconductor package, by pushing back the bending pattern, the deformed and widened bent portion is deformed in a narrowing direction, and the widened deformed portion returns to the original shape, and the rising portion The bent pattern is returned to its original shape, the bent pattern is returned to a flat shape, and the strip-shaped lead frame needs to be returned to the state before bending. In order to return to the shape by pushing down, the rising angle is set to 85 degrees or less.

Next, an embodiment of the lead frame of the present invention will be described with reference to the drawings.
FIG. 1 shows a strip-shaped lead frame 1. A bending pattern 3 as shown in FIG. 3 is formed on the outer frame portion 2 of the lead frame 1 in the upper and lower portions of FIG. In the example of FIG. 1, the bending pattern 3 is arranged at the same pitch as the wiring pattern pitch, but may be arranged intermittently. In the example of FIG. 1, the bending pattern 3 has a 90-degree difference in the vertical direction, but is not limited thereto.

Here, the bending pattern 3 formed in the present invention will be described in more detail with reference to FIGS. 3 and 4. The bending pattern 3 is provided on the outer frame portion 2 of the lead frame 1 having a strip shape. Then, the tip 5 of the rising portion 6 raised by raising from the outer frame portion 2 at the bent portion 4 is the tip 5 of the other raised portion 6 'raised similarly by the bent portion 4'. 'And two raised portions 6 and 6' formed so as to face each other, and the raised ends 5 of the two raised portions 6 and 6 'which are narrower than the bent portions 4 and 4'. , 5 'and a deformable portion 8 having a bent portion 7 that can be deformed so as to open. In the illustrated example, the bent portion 7 of the deformable portion 8 has a Z shape in plan view. However, if the deformable portion 8 can be deformed, the bendable portion 7 may be at least one or more. And if the bending part 7 can deform | transform so that it may close, the bending angle can be selected arbitrarily.

As a method for forming the bending pattern, the bending pattern 3 can be formed on the outer frame portion 2 at the same time when the pattern is formed by pressing or etching when the lead frame 1 is manufactured. For example, the bending pattern 3 is formed in the same manner as forming the internal leads and pads of the lead frame 1 by pressing or etching the band-shaped metal material. Then, a plating process is performed, and then, when cutting into a strip shape of about 200 mm, a bending process is performed so that the flat bending process pattern 3 is put out upward.

  In addition, there is a process method of manufacturing in the form of a ribbon or sheet after the above pattern formation. For example, in the case of a manufacturing process method in the form of a ribbon, the pad part (chip mounting part) is pushed down as the final process of manufacturing the lead frame. Although processing and cutting into a sheet shape are required, in this step, in addition to the press bending process of the pad portion, the bending process of the bending pattern 3 may be performed.

Next, a method for manufacturing a semiconductor package of the present invention using the lead frame 1 will be described.
In the method of manufacturing a semiconductor package according to the present invention, bending is performed to a height necessary for the bending pattern 3 of the lead frame 1. Basically, the bent portions 4 and 4 ′ are bent so that the bending pattern 3 protrudes on the side where the semiconductor element is mounted, and the rising portions 6 and 6 ′ are raised, and the rising portions 6 and 6 ′ are raised. 6 ′ has a bending height equal to or greater than the thickness of the lead frame 1. Basically, the rising angle A at the bent portions 4 and 4 ′ shown in FIG. 5 is 65 degrees or more and 85 degrees or less. When the raised portions 6 and 6 'are raised, the distance between the opposed tips 5.5' is widened, and the deformed portion 8 connected to the tips 5 and 5 'is deformed in the direction in which the bent portion 7 is widened. It becomes. Since the bent portions 4 and 4 'are wider than the deformable portion 8 and sufficiently strong, only the raised portions 6 and 6' are deformed, and the raised portions 6 and 6 'are raised. It will not be deformed.

Next, as shown in FIG. 2, the bent pattern 3 is conveyed so that a plurality of lead frames 1 are stacked so that the bent pattern 3 is in contact with another lead frame. And in any subsequent step, after removal one lead frame 1 from the laminated state, and approximate flat the bending pattern 3 was bent pushing back the state shown in FIG. 4, the subsequent step To be thrown in. As a method of pushing back almost flatly, for example, pushing back when clamping with a mold (resin-sealed) mold, it may be performed with a jig or other device in another process.

  Originally, the lead frame 1 is transported in the assembly process of the semiconductor package with the surface on which the semiconductor element is mounted as the front side (upper side), and therefore, as shown in FIG. In this case, bending is performed so that the bending pattern 3 faces upward. Then, the shape to be bent needs to be arranged after removing the place where it hits the equipment device or the conveying device in the assembly process of the semiconductor package. In other words, the outer frame portion of a normal lead frame is a flat outer frame portion that is simply formed with a positioning through-hole. Therefore, on the premise that the lead frame of the flat outer frame portion is handled on the equipment. Designed.

  Therefore, since the equipment will be shared even if the lead frame changes, the present invention does not affect the conveyance by bending upward, and the bent portion returns to its original position so that it can be fixed. It is designed to be a flat outer frame. In addition, when resin mold sealing is performed after entering the mold die, if the bent parts are forcibly returned so as to overlap, a plate thickness + α is partially generated, and there is a gap between the die and the lead frame. May occur and the resin may leak. Therefore, a pattern that returns to the original so as not to overlap is required, and the expanded deformed portion is pressed into the mold in the same plane and deformed again to become flat.

In general, the bending process is performed by reducing the thickness of an inclined portion (folded portion) to be bent and extending the thickness to ensure a distance by bending. However, in order to secure a gap where the lead frames can be stacked as in the present invention, the rising angle is bent at a steep angle, for example, an angle of 65 degrees or more and 85 degrees or less, and the overlapping lead frame is formed. Must be lifted. Therefore, in the above-mentioned general bending process, there is a possibility that the strength is reduced due to the decrease in the thickness of the oblique portion, and the fracture occurs. Therefore, the present invention does not reduce the plate thickness of the raised portions 6 and 6 'raised by bending so that the strength is not lowered, and the bent portion 7 of the deformable portion 8 is deformed so as to be closed and the distance is secured. To be.

  That is, by bending the bending pattern 3 shown in FIG. 3, the bending portion 7 of the deformation portion 8 is opened in the bending pattern 3 as shown in FIG. When 'is started up, the widening distance of the tips 5, 5' is secured. By this deformation, it is possible to perform bending with a rising angle A having a steep angle, for example, 65 degrees or more and 85 degrees or less without reducing the thickness of the rising portion.

  The bending pattern 3 is formed on the outer frame portion 2 of the lead frame 1, but it may have a shape obtained by rotating FIG. 3 by 90 degrees, as shown in FIG. It may be rotated 90 degrees on the upper and lower sides. That is, it can be lifted by overlapping the bending patterns in the same direction at the time of lamination. Also, as shown in FIG. Or it is set as arbitrary two of these, and the front-end | tip of two raising parts does not necessarily need to oppose.

  Then, after being put into the assembly process of the semiconductor package, it can be pushed down from the upper surface of FIG. 5 in a plane, and the bending pattern 3 returns to the flat state during the assembly process. In order to ensure that this push-down can be performed reliably, the rising portions 6 and 6 'are raised from the outer frame portion 2 of the lead frame 1 at the bent portion 4, and both the surfaces become the upper surface as shown in FIG. It is necessary to secure the deformed portion 8 connected to the distal ends 5 and 5 'of the rims, and the rising portions 6 and 6' must be bent portions 4 and 4 'so that the rising angle A is 85 degrees or less. .

  As a result, it is possible to provide an overlapping lead frame and a method for manufacturing the same, which do not require modification or new creation of jigs and tools in the package assembly process.

DESCRIPTION OF SYMBOLS 1 Lead frame 2 Outer frame part 3 Bending pattern 4, 4 'Bending part 5, 5' Tip part 6, 6 'Rising part 7 Bending part 8 Deformation part A Rising angle

Claims (9)

Two raised portions are formed by raising the outer frame portion of the lead frame having a strip shape from the outer frame portion at the bent portion and are connected to the tips of the raised portions of the two raised portions. And a desired number of bending patterns for forming deformable deformable portions are formed ,
The lead frame according to claim 1, wherein at least one bent portion is formed in the deformable portion . Two raised portions are formed by raising the outer frame portion of the lead frame having a strip shape from the outer frame portion at the bent portion and are connected to the tips of the raised portions of the two raised portions. And a desired number of bending patterns for forming deformable deformable portions are formed,
The lead frame according to claim 1, wherein a width of the deformed portion is narrower than a width of the bent portion . The lead frame according to claim 1 , wherein a width of the deformed portion is narrower than a width of the bent portion . The lead frame according to any one of claims 1 to 3, wherein the two raised portions are formed such that the raised tips face each other . The width of the bent portion is at least 1.5 times the lead frame thickness, claim 2 or 3 the width of the flexible portion may be equal to 0.8 to 1.2 times the lead frame thickness Lead frame as described in. The lead frame according to claim 1 , wherein the bending pattern is bent so as to protrude toward a side on which a semiconductor element is mounted.   7. The lead frame according to claim 6, wherein the bending pattern is formed in a rising portion by being raised at the bent portion, and is deformed in a direction in which the deformed portion is widened.   8. The lead frame according to claim 6, wherein the bent pattern for bending returns to a substantially flat shape by a pressing process.   In the method of manufacturing a semiconductor package, in the outer frame portion of the lead frame having a strip shape, two rising portions formed by rising from the outer frame portion at the bent portion, and the bent portion having a narrower width than the bent portion. Bending that forms the desired number of bending patterns to form the deformable deformable portion by connecting the two rising portions that are raised at the portion to form a deformable deformable portion. Next, the bent pattern that has been bent is brought into contact with another lead frame and transported in a state in which a plurality of lead frames are stacked, and then one lead from the state in which it is stacked in an arbitrary step after that. After the frame is taken out, the semiconductor package includes a step of pushing the bent pattern for bending back into a substantially flat shape and putting it into a subsequent step. The method of production.

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