JPS5988855A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5988855A
JPS5988855A JP19759382A JP19759382A JPS5988855A JP S5988855 A JPS5988855 A JP S5988855A JP 19759382 A JP19759382 A JP 19759382A JP 19759382 A JP19759382 A JP 19759382A JP S5988855 A JPS5988855 A JP S5988855A
Authority
JP
Japan
Prior art keywords
lead frame
frames
lead
feed
feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19759382A
Other languages
Japanese (ja)
Inventor
Joichiro Kageyama
景山　條一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP19759382A priority Critical patent/JPS5988855A/en
Publication of JPS5988855A publication Critical patent/JPS5988855A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To contrive to smooth and secure feed by providing projections to a thickness direction at one end in the direction of feeding lead frames. CONSTITUTION:At the time of punch-processing the lead frame, the material itself is molded and thus swollen 5 is loop form in integrating manner. The height of the swelling 5 is selected to a hight sufficient to prevent the superposition of the frames 1 each other forward and backward when a plurality of the lead frames 1 are fed intermittently and successively. Even when there is feed mistake at the time of feeding by making a claw 4 catch pitch holes 3 of the lead frame 1, the forward and backward frames 1 are engaged with the projections 5 at the front end and the back end, and then can prevent superposition. Thereby, the breakdown, contamination, etc. of a circuit can be prevented.

Description

【発明の詳細な説明】 本発明はリードフレーム、特に、連続送り時にリードフ
レームどうしの夏なジ合い？防止できるリードフレーム
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to lead frames, in particular, to problems caused by summer misalignment between lead frames during continuous feeding. Regarding preventable lead frames.

一般に、半導体集積回路素子（ペレット）の取付は用の
リードフレームとしてはいわゆる多連リードフレームが
使用８ｎ５ている。その場合、リードフレームへのペレ
ットのに４ＲｍｆＤ、ＩＪ−ドア　レームの１Ｈ１１部
に設けたピッチ孔の中に送りＢ＆構の送ジ爪ｒ引っ掛け
て該送カ爪で間欠的に連ｆｔｆｔ送りしながら、連続的
作業として行なわれる。そして、リードフレームのマガ
ジンへの収納は、マガジンの形状が箱形で必るところか
ら、リードフレームの後端部分を送り爪で押し込む方式
ｔとっている。Generally, a so-called multiple lead frame is used as a lead frame for mounting semiconductor integrated circuit elements (pellets). In that case, hook the pellet into the pitch hole provided in the 1H11 section of the 4RmfD, IJ-door frame with the feed claw r of the feed B & mechanism, and feed the pellet intermittently in a continuous ftft manner with the feed claw. , carried out as a continuous operation. The lead frame is stored in the magazine by pushing the rear end of the lead frame in with a feed claw since the magazine is box-shaped.

ところが、送り機構のトラブルや送り爪の１Ａｌｕ不良
ケ生じたような場合、一部のリードフレームのみが送ら
れることが起こり、七の時には、マガジン内の前に残芒
ｎたり一ドフレームを取９除かないと、その後に送り込
１れｙｔリードフレームが干渉２生じ、前後のリードフ
レームどうしが重なり合う結果、折角リードフレームに
取り付けられたペレットや回路が破壊されたり、剥離し
たり、あるいに汚染ざｎるという不測の事態ｔひき起こ
丁ことがある。このような事態の回避策としては、従来
、リードフレーム送り作業の管理およびそれに用いる機
械の保全に努力することが行なわれているが、人手ン袈
し、しかも完全な対策とはなっていないのが実状である
。However, if there is a problem with the feed mechanism or a defective 1Alu in the feed claw, only a portion of the lead frame may be fed, and at the end of the day, there may be some lead frames left in front of the magazine. If 9 is not removed, interference 2 will occur between the lead frames that are fed in and the front and rear lead frames will overlap, resulting in the pellets and circuits attached to the lead frames being destroyed, peeling off, or Unforeseen circumstances such as contamination may occur. Conventionally, efforts have been made to manage the lead frame feeding work and maintain the machinery used to avoid such situations, but this requires a lot of human labor and is not a complete countermeasure. is the actual situation.

本発明の目的は、前記した問題点に鑑み、連続送ジされ
る際ＶＣ＠接するリードフレームどうしで電なり合いケ
起こ丁ことなく、確実かつ円滑なリードフレームの送り
ｒ行なうことのできるリードフレームを提供することに
ある。In view of the above-mentioned problems, an object of the present invention is to provide a lead frame that can reliably and smoothly feed a lead frame without causing electrical interference between lead frames that are in contact with VC during continuous feeding. Our goal is to provide the following.

以下、本発明ｒ図面に示す実施圀にしたがって詳細に説
明する。Hereinafter, the present invention will be explained in detail according to the embodiment shown in the drawings.

第１図は本発明によるリードフレームの一実施列會示し
、同図１８＋はその部分平面図、ｔｔｎは賛部の拡大正
面図、（Ｃ１はその拡大側面図である。FIG. 1 shows one embodiment of a lead frame according to the present invention, FIG. 18+ is a partial plan view thereof, ttn is an enlarged front view of the support part, and (C1 is an enlarged side view thereof).

この実施列のリードフレームはいわゆる多連リードフレ
ーム構造であり、このリードフレーム１の送り方向Ａに
対して中心側には、ペレット（図示せず）の取付領域で
あるタブ２が２個だけ図示さルている。The lead frame of this implementation row has a so-called multi-lead frame structure, and there are only two tabs 2 on the center side of the lead frame 1 in the feeding direction A, which are attachment areas for pellets (not shown). It is shown.

ｌｔ、リードフレーム１の側部ｉｃは、送り機構の送り
爪４（第２図）を引っ掛けるためのピッチ孔３が打ち抜
きにより形成でれている。A pitch hole 3 for hooking a feed claw 4 (FIG. 2) of a feed mechanism is formed by punching in the side IC of the lead frame 1.

さらに、本実施例のリードフレーム１の送シ方同前後端
の少なくとも一端の一側には、リードフレーム１の厚さ
方向に突上する突起５が、該リードフレーム１の材料自
体７第１図（ｂｌ　、ｌｃｌで示す如く一体的にループ
状に隆起させることにエリ、たとえばリードフレーム１
自体の打抜きと同時にトル葛れている。この突起５ｒｒ
ｉ複数枚のリードフレーム１ケ間欠的に連続送りする際
に、前後に相隣るリードフレーム１どうしが電な９合っ
てし１うことを防止するためのものである。そのため、
この突起５は前後のリードフレーム１どうしの重なり合
いケ確実に防止できるのに十分な高さく朶起量）會有す
るのがよい。Further, on at least one side of the front and rear ends of the lead frame 1 of this embodiment, there is a protrusion 5 projecting in the thickness direction of the lead frame 1. For example, lead frame 1 may be raised integrally in a loop shape as shown in the figure (bl, lcl).
At the same time as the punch itself is punched out, the torque is warped. This protrusion 5rr
This is to prevent adjacent lead frames 1 from colliding with each other when a plurality of lead frames are intermittently and continuously fed. Therefore,
It is preferable that the protrusion 5 has a sufficient height and height to reliably prevent the front and rear lead frames 1 from overlapping each other.

本実施Ｉ’ｌｌのリードフレーム１葡輸数枚連続送９す
る場合、第２図に示すような送ジ爪４ヶリードフレーム
１のピッチ孔３の中に引っ掛けて間欠的連続送りが行な
わｎる。その時、機械送りのトラブル等に起因する送り
ミスが発生したような場合でも、第２図の如く、リード
フレーム１の送り方向端部に１なり防止用の突起５が設
けらｎているので、前後のリードフレーム１どうしは前
端、後端が突起５に係合し、フレームどう（７の重なり
合い會防止することができる。したがって、リードフレ
ーム１のタブ２にペレット（図示せず）が堆ｐ付けられ
た後のフレーム送り時にも、フレームどうしの電なり合
いに起因する回路破壊、汚染、ベレット破壊、ペレット
の剥離等の不具合葡未然に防止できる。When transporting several pieces of lead frame 1 in this embodiment I'll continuously feed 9, intermittent continuous feeding is performed by hooking four feed claws into the pitch holes 3 of lead frame 1 as shown in FIG. Ru. At that time, even if a feed error occurs due to a mechanical feed trouble, etc., as shown in FIG. The front and rear ends of the front and rear lead frames 1 engage with the protrusion 5 to prevent the frames from overlapping each other. Therefore, pellets (not shown) are deposited on the tabs 2 of the lead frames 1. Even when the frames are fed after being attached, problems such as circuit breakage, contamination, pellet breakage, and pellet peeling caused by electrical connections between frames can be prevented.

ｌた、第２図の状態から明らかなように、本実施列では
、送り爪４が一部にしかない場合であっても、複数枚の
リードフレーム１が突起５により連続フレームの如きつ
ながり状態となり、最後部のリードフレーム１ｒ押丁だ
けで前部のリードフレーム１は１１１次円滑に自動送出
しが可能であり、フレームどうしの重なり合一によるト
ラブルは起こら々い。Furthermore, as is clear from the state shown in FIG. 2, in this embodiment row, even if the feed claws 4 are only partially provided, the plurality of lead frames 1 are connected by the projections 5 like a continuous frame. The lead frame 1 at the front can be automatically fed out smoothly in the 111th order only by holding the lead frame 1r at the rear end, and troubles caused by frames overlapping and coalescing do not occur.

第３図ｆａｌ〜（（＋１は本発明によるリードフレーム
の他の実施ＩＨｌ？Ｌ−示している。FIG. 3 shows another implementation of the lead frame according to the invention.

この実施列でニ、リードフレーム１の重なり防止用の突
起５ａは、リードフレーム１の送り方間ＡＫ対して少な
くとも−ｇ８部のコーナ一部分の上下両方向に一体的に
突出するフォーク状の側面形状を有している。In this implementation row, the overlapping prevention protrusion 5a of the lead frame 1 has a fork-like side surface shape that integrally projects in both the up and down directions of at least a part of the corner of the -g8 portion with respect to the feed direction AK of the lead frame 1. have.

本実施例においても、連続送りさｎるリードフレーム１
どうしは突起５ａの存在により豆いに電なり合うことが
なく、ペレットや１Ｉｌｌ！ｌ路の破壊、剥離あるいは
汚染等會生じることｔ防止できる。In this embodiment as well, the lead frame 1 is continuously fed.
Due to the presence of the protrusion 5a, they do not collide with each other, and pellets and 1Ill! It is possible to prevent damage, peeling, or contamination of the path.

なお、本発明に前記実施タリに限定δｎるものではなく
、たとえば突起５．５ａの形成位置やその形状、高ζ等
も他の変形列が容易に可能である。It should be noted that the present invention is not limited to the above-mentioned implementation pattern δn, and other variations in the formation position, shape, height ζ, etc. of the protrusions 5.5a, for example, are easily possible.

以上説明したように、本発明によｎば、リードフレーム
を連続送すする時に前後のリードフレームどうしが重な
シ合うことを防止できるので、リードフレームに増り付
けられたペレットや回路の破壊、剥離、汚染等ヶ防止す
ることができる。As explained above, according to the present invention, it is possible to prevent the front and rear lead frames from overlapping each other when the lead frames are continuously fed, so that the pellets attached to the lead frames and the circuits are destroyed. , peeling, contamination, etc. can be prevented.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明によるリードフレームの一実施ｌ＋Ｉｌ
を示し、同図体）はその部分平面図、ｌｂｌは４ａ部の
拡大部分正面図、（ｃｌは拡大部分側面図、第２図は第
１図の実施列におけるフレーム連続送り状態會示す正面
図、 第３図は本発明によるリードフレームの他の実施列を示
し、同図１ａｌはその部分平面図、１ｔｌｌは安部の拡
大部分正面図、（ｃｌは拡大部分１１Ｉ１１面図である
。 １・・・リードフレーム、３・・・ピンチ孔、４・・・
送多爪、５．５ａ・・・突起。FIG. 1 shows one implementation of a lead frame according to the invention l+Il
, the same figure) is a partial plan view thereof, lbl is an enlarged partial front view of section 4a, (cl is an enlarged partial side view, and FIG. 2 is a front view showing the frame continuous feeding state in the implementation row of FIG. 1, FIG. 3 shows another implementation row of the lead frame according to the present invention, in which FIG. 1al is a partial plan view thereof, 1tll is an enlarged front view of the lower part, and (cl is an enlarged front view of the enlarged portion 11I11. 1... Lead frame, 3...Pinch hole, 4...
Multi-feeding claw, 5.5a...protrusion.

Claims (1)

【特許請求の範囲】[Claims] ■、送り方向の少なくとも一端部に扉８方回への突起ケ
設けたことに％徴とするリードフレーム。(2) A lead frame characterized by the provision of protrusions in 8 directions of the door at least at one end in the feeding direction.
JP19759382A 1982-11-12 1982-11-12 Lead frame Pending JPS5988855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19759382A JPS5988855A (en) 1982-11-12 1982-11-12 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19759382A JPS5988855A (en) 1982-11-12 1982-11-12 Lead frame

Publications (1)

Publication Number Publication Date
JPS5988855A true JPS5988855A (en) 1984-05-22

Family

ID=16377061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19759382A Pending JPS5988855A (en) 1982-11-12 1982-11-12 Lead frame

Country Status (1)

Country Link
JP (1) JPS5988855A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6724070B2 (en) * 1997-12-18 2004-04-20 Texas Instruments Incorporated Fine pitch lead frame
JP2013149701A (en) * 2012-01-18 2013-08-01 Sumitomo Metal Mining Co Ltd Lead frame, and method of manufacturing semiconductor package using the same
JP2014056965A (en) * 2012-09-13 2014-03-27 Sumitomo Metal Mining Co Ltd Lead frame and manufacturing method of semiconductor package using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6724070B2 (en) * 1997-12-18 2004-04-20 Texas Instruments Incorporated Fine pitch lead frame
JP2013149701A (en) * 2012-01-18 2013-08-01 Sumitomo Metal Mining Co Ltd Lead frame, and method of manufacturing semiconductor package using the same
JP2014056965A (en) * 2012-09-13 2014-03-27 Sumitomo Metal Mining Co Ltd Lead frame and manufacturing method of semiconductor package using the same

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