JP2010073050A - Ic card and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an IC card wherein appearance defects and sticking are hardly generated. <P>SOLUTION: The IC card includes: an IC module; a card base material provided with a storage part for storing the IC module; and an adhesive applied between the storage part and the IC module. The adhesive is an adhesive sheet. At least a part of the adhesive sheet is arranged on the inside of an outer periphery of the IC module or the storage part further has a groove on a part of it. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a contact IC card having an IC chip capable of reading and writing data with an external device, and a method for manufacturing the contact IC card.

  The IC card is roughly composed of an IC module and a card substrate.

  The IC module is usually configured as follows.

  An external connection terminal that can be connected to an external device is provided on one surface of the substrate, and an IC mounting portion is provided on the other surface.

  The IC mounting part is connected to the external connection terminal from the IC mounting part side by making a through hole in the board below the external connection terminal so that the IC and the external connection terminal can be connected around the mounted IC. An IC mounted on the substrate, mounted on the substrate, a wiring member for electrically connecting the IC and the external connection terminal, and an IC mounting portion including the mounted IC and the wiring member And the coating resin covering the periphery of the connecting member so as to protect the connector from external pressure.

  The card base has a receiving portion that can store the IC module so that the surface of the external terminal of the IC module is substantially in a surface position with the surface of the card base and is finally exposed on the card surface. This accommodating part has a structure in which a part of the card base is seated in a concave shape corresponding to the shape of the IC mounting part to be accommodated and the substrate on which the card is mounted (see, for example, Patent Document 1).

  The IC module is housed in the concave portion of the card base and configured as an IC card.

  The IC module is housed in the housing portion by bonding with an adhesive.

  The adhesive is configured as an adhesive sheet, and has a structure having a substrate side adhesive that adheres to the IC module side on one side of the interlayer paper and a card base side adhesive that adheres to the card side on the opposite side. ing.

  The recess is slightly larger (for example, about 0.2 mm) than the outer dimension of the IC module. If the size of the recess is smaller than the IC module, the IC module cannot of course be stored, and the IC module protrudes from the surface of the IC card. On the other hand, if the concave portion is too large, it will be unsightly in appearance.

  Further, when the IC module is mounted in the concave portion of the card base, it is necessary to fix the IC module to the IC card with an adhesive attached to the IC module. For example, a thermosetting type is provided as the adhesive. The adhesive is applied between the IC mounting portion and the accommodating portion, where pressure and heat are applied to cure the adhesive, and the adhesive is crushed by the heat and pressure. At this time, for example, if the adhesive sheet and the IC module have the same size as the outer shape, the adhesive may protrude from the IC module outer shape to the card surface. For example, when the card base recess is about 0.2 mm larger than the outer dimension of the IC module, there is no particular problem if the above protrusion is 0.2 mm or less, but the IC module is actually straight with respect to the card base recess. Since it is difficult to mount, for example, it may be bent and mounted. In that case, the external clearance between the card base recess and the IC module is insufficient. As a result, the protruding adhesive loses the escape place and comes out on the card surface.

If the adhesive sticks out on the card surface, it not only looks unsightly, but if it is stored repeatedly, it will stick to the adjacent IC card and the IC card cannot be taken out one by one by the machine and an error may occur. It was. If an issue failure due to sticking occurs, for example, in an unmanned terminal issued by the operation of the last user, a maintenance call is required, and it takes time for the user to receive the IC card.
JP 2004-92539 A

  The present invention has been made in view of the above circumstances, and an object of the present invention is to obtain an IC card that hardly causes poor appearance or sticking.

The IC card of the present invention is
A substrate, an external connection terminal provided on one main surface of the substrate, an IC module having an IC mounting portion provided on the other main surface of the substrate, and the external connection terminal exposed on the surface. IC having a card base having a housing portion having a side wall and a bottom surface corresponding to the shape of the other main surface of the substrate and the IC mounting portion, and an adhesive applied to the IC mounting portion. A card,
The adhesive is an adhesive sheet, and at least a part of the adhesive sheet is disposed on the inner side of the outer periphery of the IC module, or the housing portion further has a groove. And

In the IC card manufacturing method of the present invention, an external connection terminal is provided on one main surface of the substrate, an IC mounting portion is provided on the other main surface of the substrate, and an IC module is formed. In order to accommodate the connection terminal so as to be exposed on the surface, a card substrate having an accommodating portion having a side wall and a bottom surface corresponding to the shape of the other main surface of the substrate and the IC mounting portion is prepared. A method of manufacturing an IC card that is used for adhesion by applying an adhesive between the housing part and the housing part,
As an adhesive, a card base including an adhesive sheet between the IC module and the accommodating part, at least a part of which is disposed inside the outer periphery of the IC module, or a part of which is further provided with a groove. It is characterized by using a material.

  According to the present invention, it is possible to obtain an IC card that is less likely to cause poor appearance and sticking by performing a design in which the adhesive does not easily protrude from the space between the IC module and the housing portion to the card surface.

  The present invention is roughly divided into the inventions according to the following four viewpoints.

  The invention which concerns on the 1st viewpoint and the 2nd viewpoint WHEREIN: The adhesive agent applied between the IC module, the card | curd base material provided with the accommodating part for accommodating an IC module, an accommodating part, and an IC module. An IC card is provided.

  The IC module used in the present invention includes an IC module substrate, an external connection terminal provided on one main surface of the substrate, and an IC mounting portion provided on the other main surface of the substrate.

  The card substrate used in the present invention includes a receiving portion having a side wall and a bottom surface corresponding to the shape of the other main surface of the substrate and the IC mounting portion in order to accommodate the external connection terminals so as to be exposed on the surface. .

  The invention according to the first aspect is characterized in that the adhesive used is an adhesive sheet, and at least a part of the adhesive sheet is disposed inside the outer periphery of the IC module.

  Moreover, the invention which concerns on a 2nd viewpoint is characterized by the card base material used further having a groove | channel in a part of the accommodating part.

  The invention according to the third aspect and the fourth aspect is a method for manufacturing the IC card according to the first aspect and the IC card according to the second aspect, respectively, on the main surface of the substrate. A step of forming an IC module by providing an IC mounting portion on the other main surface of the substrate by providing a connection terminal; and preparing a card substrate including a housing portion for housing the IC module, and the IC module and the housing portion. A step of applying an adhesive in between to provide for adhesion.

  The invention according to the third aspect is characterized in that the adhesive used is an adhesive sheet, and at least a part of the adhesive sheet is disposed inside the outer periphery of the IC module.

  Moreover, the invention which concerns on a 4th viewpoint is characterized by the card base material used further having a groove | channel in a part of the accommodating part.

  According to the first and third aspects of the invention, since at least a part of the adhesive sheet is disposed inside the outer periphery of the IC module, the adhesive sheet is not disposed between the IC module and the accommodating portion. Space is created. Even if the adhesive sheet is made of, for example, a thermosetting resin, and the pressure is applied in a state of being heated and melted for adhesion, the melted adhesive escapes into this space. It fits in the gap and does not protrude from the card surface. For this reason, if the invention which concerns on the 1st and 3rd viewpoint is used, the IC card which cannot produce an appearance defect and sticking easily can be obtained.

  According to the second and fourth aspects of the invention, the housing part further includes a groove in a part thereof, so that the IC module and the grooved housing part are not accommodated between the IC module and the grooved housing part. Even more space is created than between the parts. Even if the adhesive is made of, for example, a thermosetting resin, and the pressure is applied while being heated and melted for bonding, the melted adhesive escapes into this space, so that the IC module, the housing portion, and the housing are accommodated. It fits in the gap between the cards and is difficult to protrude from the card surface. For this reason, when the inventions according to the second and fourth aspects are used, it is possible to obtain an IC card that hardly causes poor appearance or sticking.

  Hereinafter, the present invention will be described in more detail with reference to the drawings.

  FIG. 1 is a front view showing an example of an IC card according to the present invention.

  As illustrated, the IC card 100 includes a card base 101 and an IC module 102 that is accommodated in a part of the surface of the card base 101 and includes the external connection terminals 1 exposed on the surface.

  2 and 3 are views showing a manufacturing process of an example of an IC module used in the present invention.

  As shown in the drawing, first, an IC module substrate 2 made of a material such as glass epoxy and having a through hole 8 is prepared. On one main surface of the substrate 2, the terminals 4 in the region where the through holes 8 are formed are provided with the external terminals 1 by applying gold plating or the like on the glass epoxy. Subsequently, mounting is performed by bonding a rectangular IC 3 with an adhesive 25 at a position facing the external connection terminal 1 on the other main surface of the substrate 2 on which the external connection terminal 1 is provided. Thereafter, the IC 3 and the external connection terminal 1 are electrically connected using a connecting member 5 such as, for example, and finally the IC 3 and the connecting member 5 are covered with a resin 6 such as an epoxy resin so as to protect the IC 3 and the connecting member 5 from external pressure. In this way, an IC module 102 in which the external connection terminal 1 is provided on one main surface of the IC module substrate 2 and the IC mounting portion 9 is provided on the other main surface is obtained. The other main surface side has a shape in which a rectangular collar portion 7 spreads around the resin portion of the rectangular and convex IC mounting portion 9.

  FIG. 4 shows a front view illustrating an example of a card base material used in the present invention.

  FIG. 5 shows a cross-sectional view taken along the line CC of FIG.

  As shown in the figure, the card base 101 has a substantially rectangular accommodating portion 10 that can accommodate the IC mounting portion 9 and the IC module substrate 2 on which the IC mounting portion 9 is mounted on a part of the surface thereof. The accommodating portion 10 has a shape in which the card base 101 is seated in a two-stage structure of a concave portion 10a corresponding to the collar portion 7 of the IC module substrate and a concave portion 10b corresponding to the resin portion. The recess 10a has a side wall 11a and a bottom surface 12a, and the recess 10b has a side wall 11b and a bottom surface 12b. 10 c represents the outer periphery of the accommodating part 10.

  A groove can be further provided in a part of the accommodating portion of the card substrate 101.

  In the inventions according to the first and third aspects, any of a card base material in which a groove is further provided in a part of the housing portion and a card base material in which a groove is not provided in the housing portion can be used.

  In the invention which concerns on the 2nd and 4th viewpoint, the card | curd base material which provided the groove | channel further in a part of accommodating part is used.

  FIG. 6 is a schematic cross-sectional view showing a state in which the IC module is housed in the card base accommodating portion.

  As shown in the drawing, the IC module 102 is fixedly received by an adhesive (not shown) in the receiving portion 10 having a shape of a card substrate 101 that is seated in a two-stage structure. A portion corresponding to the collar portion 7 of the IC module substrate is accommodated in the recess 10a, and a resin portion of the IC mounting portion 9 is accommodated in the recess 10b. The surface of the external terminal 1 of the IC module 102 is arranged so as to be substantially in a surface position with the surface of the card base 101.

  FIG. 7 shows a front view showing an example of a tape-like substrate used in the present invention.

  As shown in the figure, the IC module substrates 2 used in the present invention are regularly arranged at predetermined intervals on the tape-like substrate 21.

  In the manufacturing process of the substrate of the IC module, in order to increase the efficiency of production at the time of manufacture, the tape-shaped substrate 21 having a length of, for example, 50 m is used, and the substrate is rolled up for convenience of handling. Can be handled. The IC module 102 is completed by sequentially taking the IC card manufacturing process while pulling out from the end to the beginning.

  Further, external connection terminals 1 are provided on one main surface of each IC module substrate 2.

  FIG. 8 shows a diagram representing the opposite side of FIG.

  On the other main surface of the IC module substrate 2, a through hole 8 is provided on the surface opposite to the surface on which the external connection terminals 1 are provided. An IC mounting area 20 is provided in a portion corresponding to each IC module substrate 2.

  FIG. 9 shows an enlarged view of region D. FIG.

  As shown in the figure, by providing the through hole 8, the connection terminal 4 for connecting the external connection terminal to the IC is exposed.

  An IC module can be formed using this tape-shaped substrate 21.

  First, an adhesive 25 such as a thermosetting adhesive is applied to each IC mounting region 20.

  Next, the IC 3 is mounted in the IC mounting area 20.

  Thereafter, for example, by heating, the adhesive is cured and the IC 3 is fixed to the substrate.

  The connection member 5 connects the IC 3 to the connection terminal 4 provided on the substrate so as to be electrically connected.

  The IC 3 and the connecting member 5 are covered with a resin 6 and hardened.

  Thus, the IC-mounted tape 15 constituting a plurality of IC modules is completed on the tape-like substrate 21.

  FIG. 10 is a front view showing an IC-mounted tape.

  As shown in the figure, the IC 3 is mounted on the IC mounting area 20, and resin is molded on the surface thereof to form the IC mounting portion 9.

  Next, a process for mounting the IC module 102 on the card base 101 will be described.

  In FIG. 11, the figure showing an example of the manufacturing process of the IC card of this invention is shown.

  Adhesive sheet 30a is affixed to the resin 6 side of IC mounted tape 15.

  FIG. 12 is a cross-sectional view showing the configuration of the tape-like substrate used in the present invention.

  The adhesive sheet 30a has a four-layer configuration of substrate side adhesive 31-interlayer paper 32-card base material side adhesive 33-release paper 34, and is wound around the core 40 (not shown) from the substrate side adhesive 31 side. It is configured in a roll shape, and is configured in a roll shape as a strip-like adhesive sheet 30 that is much longer (for example, 50 m) like the tape-shaped substrate 21.

  Here, the adhesive sheet 30 wound around a core (not shown) has a substrate-side adhesive 31 attached to the first round of the core, making it difficult for the substrate-side adhesive 31 to peel off from the core. The substrate side adhesive 31 is affixed to the release paper 34, and the release paper 34 is made of, for example, silicon. The substrate side adhesive 31 is relatively easy to peel off.

  Therefore, the four-layer structure is pulled out by pulling out the adhesive sheet 30 from the end.

  The substrate-side adhesive 31 of the strip-shaped adhesive sheet 30 drawn out in this way is attached to the IC side of the IC-mounted tape 15.

  In FIG. 13, the front view showing an example of the strip | belt-shaped adhesive sheet used for this invention is shown.

  Moreover, the figure showing the adhesive sheet applied on FIG. 14 on the IC mounting part is shown.

  On the IC side of the IC-mounted tape 15, since the resin 6 part protrudes, it is configured as a belt-like adhesive sheet 30 having a cutout portion 35 in such a shape as to escape the resin 6 part. The strip-shaped adhesive sheet 30 is adhered to the resin 6 side of the IC mounted tape 15 with the agent 31.

  For example, a thermosetting adhesive is used for the substrate-side adhesive 31 and the card base-side adhesive 33 of the strip-shaped adhesive sheet 30.

  As described above, the belt-like adhesive sheet 30 arranged on the IC-mounted tape 15 is heated and integrated, but here it is temporarily fixed to the tape-like substrate 21 without applying sufficient heat. Integrated to the extent. That is, if sufficient heat is applied here, the card base side adhesive 33 side will also harden and it will become difficult to fix the card base side adhesive 33 side to the card base 101 in a later step. .

  Next, the release paper 34 is sequentially removed from the IC-mounted tape 15 having the plurality of IC modules 102, and the IC modules 102 are removed one by one to remove the outer shape, and the IC modules 102 with the adhesive sheet 30a are taken out.

  According to this method, after the strip-shaped adhesive sheet 30 is attached almost entirely to the flat surface portion 16 on the IC3 mounting side of the IC mounted tape 15, the outer shape is removed together with the IC mounted tape 15, so that the adhesive sheet 30a The outer shape and the contour shape of the outer periphery of the IC module 102 are substantially the same.

  A part of the outer shape of the adhesive sheet can be made smaller than the contour shape of the outer periphery of the IC module.

  Subsequently, the IC module 102 with the adhesive sheet 30 a is accommodated in the recess 10 of the card base 101.

  Thereafter, the IC module 102 accommodated in the recess 10 of the card base K is heated to fix the temporary adhesion of the substrate-side adhesive 31 and the flange 7 provided on the IC module 102 by permanent bonding, and further to the card. The IC card 100 is obtained by fixing the base material side adhesive 33 and the concave portion 10 of the card base material 101 by main bonding.

  In FIG. 15, the figure showing another example of the strip | belt-shaped adhesive sheet used for this invention is shown.

  FIG. 16 is a diagram illustrating an IC module including an adhesive sheet.

  FIG. 17 is a diagram illustrating a state in which the belt-shaped adhesive sheet is aligned and pasted onto the IC-mounted tape 15 constituting the plurality of IC modules.

  Note that FIG. 16 is a view in which the strip-shaped adhesive sheet shown in FIG.

  As shown in the drawing, after the adhesive sheet 301 is pasted and extracted into the shape of each IC module 102, at least one part of the outer shape of the adhesive sheet 301 is inside the outer shape 102a of the IC module I.

  For this purpose, a slit 302 is provided in the belt-like adhesive sheet 301. The slit 302 is provided in a pattern in which the outer shape of the adhesive sheet 301 is at least one inside. For example, the four corners of the outer shape of the IC module 102 and the vicinity thereof can be cut out. Alternatively, for example, it is possible to cut out the central part of the four sides of the outer shape of the IC module 102 and the vicinity thereof.

  A portion corresponding to the slit 302 is not a slit shape but a space 302 a when the outer shape is extracted according to the shape of the IC module 102.

  In the invention according to the first and third aspects, a part of the outer shape of the adhesive sheet is made smaller than the outer contour shape of the IC module. For this reason, the belt-like adhesive sheet shown in FIGS. 15 to 17 is used.

  In the inventions according to the second and fourth aspects, even if the outer shape of the adhesive sheet and the contour shape of the outer periphery of the IC module 102 are substantially the same, even if a part of the outer shape of the adhesive sheet is smaller than the contour shape of the outer periphery of the IC module. good. Therefore, any of the belt-like adhesive sheet shown in FIGS. 13 and 14 and the belt-like adhesive sheet shown in FIGS. 15 and 16 can be used.

  FIG. 18 is a diagram for explaining the effect of the IC card according to the present invention.

  When the IC module 102 is mounted obliquely when mounted in the recess 10 of the card base 101, even if the IC module 102 is mounted diagonally with respect to the recess 10 of the card base K, the IC module 102 Even if the outer shape 102a and the outer periphery 10C of the recess 10 of the card base K approach each other, there is a space in the space 302a, so that the adhesive sheet 30a does not protrude.

  FIG. 19 shows an enlarged view of a portion F of the adhesive sheet shown in FIG.

  Here, in the present embodiment, the joint portion 301a is disposed in the vicinity of the center of each side of the IC module 102, and the spaces 302a are disposed in four corners. However, the IC module I is horizontally and vertically disposed with respect to the outer periphery 10C of the recess 10. If the mounting is shifted, there is a possibility that the adhesive sheet 301a protrudes at the joint portion 301a. However, it is rare to be exactly horizontal and vertical, and in many cases it is slightly slanted. Therefore, this embodiment is effective.

Furthermore, it is desirable to provide the spaces 302a at and around the four corners for the above reasons.

  Also, for example, if the space 302a is set to only one location on the upper right, the IC module I is mounted on the card base 101 in advance with respect to the concave portion 10 on the design in advance with the target at the upper right where the space 302a is provided. Thus, the protrusion of the adhesive sheet 301a can be reduced.

  FIGS. 20 and 21 are diagrams each showing a modification of the card base accommodating portion used in the present invention.

  In FIG. 20, grooves 310 are provided in the four corners of the rectangle and in the vicinity thereof as part of the peripheral edge of the bottom surface 12 a.

  In FIG. 21, a groove 311 is provided in the vicinity of the center of each side of the rectangle as a part of the peripheral edge of the bottom surface 12a.

  According to the invention concerning the 1st and 3rd viewpoint, a part of external shape of the adhesive sheet used is made smaller than the outline shape of the outer periphery of an IC module. The card base containing portion used may or may not have a further groove.

  In the invention which concerns on the 2nd and 4th viewpoint, there exists a groove | channel further in the accommodating part of the card | curd base material used. Even if the outer shape of the adhesive sheet used and the contour shape of the outer periphery of the IC module 102 are substantially the same, a part of the outer shape of the adhesive sheet may be smaller than the contour shape of the outer periphery of the IC module.

  In the invention which concerns on the 1st thru | or 4th viewpoint, a part of external shape of the adhesive sheet used is made smaller than the outline shape of the outer periphery of an IC module. If a groove is further provided in the card base housing portion used, the adhesive sheet 301a can be used even when the mounting of the IC module I is not shown in the horizontal and vertical directions (not shown) with respect to the outer periphery 10C of the recess 10 shown in FIG. This protrusion can be absorbed by the groove provided, and the reliability can be further increased.

The front view showing an example of the IC card concerning the present invention The figure showing the cross section of the board | substrate for IC modules used for this invention The figure showing the cross section of the board | substrate for IC modules used for this invention The front view showing an example of the card base material used for the present invention CC sectional view of FIG. Schematic cross-sectional view showing the housing and IC module The front view showing an example of the tape-shaped board | substrate used for this invention The figure showing the surface on the opposite side of FIG. An enlarged view of region D Front view showing IC mounted tape Cross section showing IC mounted tape Sectional drawing showing an example of a structure of the tape-shaped board | substrate used for this invention The front view showing an example of the strip | belt-shaped adhesive sheet used for this invention The figure showing the adhesive sheet applied on the IC mounting part The figure showing another example of the strip | belt-shaped adhesive sheet used for this invention Illustration of punched out IC module with adhesive sheet The figure showing a mode that the strip | belt-shaped adhesive sheet and the IC mounting tape 15 were affixed The figure for demonstrating the effect of the IC card based on this invention The figure which shows the detail of the F section of the adhesive sheet shown in FIG. The figure showing an example of the accommodating part of the card base material used for this invention The figure showing another example of the accommodating part of the card base material used for this invention

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... External connection terminal, 2 ... IC module substrate, 3 ... IC, 7 ..., 9 ... IC mounting part, 10 ... Housing part, 21 ... Tape-like board | substrate, 30, 30a ... Adhesive sheet, 100 ... IC card, 101 ... Card base material, 102 ... IC module

Claims (8)

An IC module having a substrate, an external connection terminal provided on one main surface of the substrate, and an IC mounting portion provided on the other main surface of the substrate; and the IC module with the external connection terminal on the surface A card base including a housing portion having a side wall and a bottom surface corresponding to the shape of the other main surface of the substrate and the IC mounting portion, and the housing portion and the IC module; An IC card comprising an adhesive sheet applied between
At least a part of the adhesive sheet is disposed on the inner side of the outer periphery of the IC module.   2. The IC card according to claim 1, wherein the adhesive sheet has a shape obtained by cutting out at least a part of a contour shape of the outer periphery of the IC module. A substrate, an external connection terminal provided on one main surface of the substrate, an IC module having an IC mounting portion provided on the other main surface of the substrate, and the IC module exposed on the surface In order to accommodate the card substrate, a card base including a housing portion having a side wall and a bottom surface corresponding to the shape of the other main surface of the substrate and the IC mounting portion, and the housing portion and the IC module An IC card having an adhesive applied therebetween,
The IC card is characterized in that the housing portion further has a groove in a part thereof.   The IC card according to claim 3, wherein the groove is provided in a part of a peripheral portion of the housing portion.   An external connection terminal is provided on one main surface of the substrate, an IC mounting part is provided on the other main surface of the substrate to form an IC module, and the IC module is accommodated so that the external connection terminal is exposed on the surface. Therefore, a housing portion having a side wall and a bottom surface corresponding to the shape of the other main surface of the substrate and the IC mounting portion is prepared, and at least a part of the adhesive sheet is provided between the IC module and the housing portion. A method for manufacturing an IC card, wherein the IC card is disposed inside the outer periphery of the IC module and used for adhesion.   The method according to claim 5, wherein the adhesive sheet has a shape obtained by cutting out at least a part of a contour shape of an outer periphery of the IC module.   An external connection terminal is provided on one main surface of the substrate, an IC mounting part is provided on the other main surface of the substrate to form an IC module, and the IC module is accommodated so that the external connection terminal is exposed on the surface. Therefore, a card substrate having a side wall and a bottom surface corresponding to the shape of the other main surface of the substrate and the shape of the IC mounting portion, and a receiving portion having a groove in a part thereof is prepared, An IC card manufacturing method, wherein an adhesive is applied between an IC module and an accommodating portion for adhesion.   The method according to claim 7, wherein the groove is provided in a part of a peripheral edge of the housing portion.

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