TW201404692A - Carrier tape for receiving electronic component, method of manufacturing carrier tape for receiving electronic component, and package - Google Patents

Carrier tape for receiving electronic component, method of manufacturing carrier tape for receiving electronic component, and package Download PDF

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Publication number
TW201404692A
TW201404692A TW102110742A TW102110742A TW201404692A TW 201404692 A TW201404692 A TW 201404692A TW 102110742 A TW102110742 A TW 102110742A TW 102110742 A TW102110742 A TW 102110742A TW 201404692 A TW201404692 A TW 201404692A
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TW
Taiwan
Prior art keywords
electronic component
belt
shaped sheet
conveyor belt
strip
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TW102110742A
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Chinese (zh)
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TWI597225B (en
Inventor
Eiji Okochi
Kazuo Tajiri
Kenichi Nakagoshi
Toshio Sugiyama
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Sumitomo Bakelite Co
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Publication of TW201404692A publication Critical patent/TW201404692A/en
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Publication of TWI597225B publication Critical patent/TWI597225B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04Attaching a series of articles, e.g. small electrical components, to a continuous web
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001Combinations of extrusion moulding with other shaping operations
    • B29C48/0019Combinations of extrusion moulding with other shaping operations combined with shaping by flattening, folding or bending
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001Combinations of extrusion moulding with other shaping operations
    • B29C48/002Combinations of extrusion moulding with other shaping operations combined with surface shaping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • B29C48/08Flat, e.g. panels flexible, e.g. films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/12Articles with an irregular circumference when viewed in cross-section, e.g. window profiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/13Articles with a cross-section varying in the longitudinal direction, e.g. corrugated pipes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/30Extrusion nozzles or dies
    • B29C48/305Extrusion nozzles or dies having a wide opening, e.g. for forming sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00Packages comprising articles attached to cards, sheets or webs
    • B65D73/02Articles, e.g. small electrical components, attached to webs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/88Thermal treatment of the stream of extruded material, e.g. cooling
    • B29C48/911Cooling
    • B29C48/9135Cooling of flat articles, e.g. using specially adapted supporting means
    • B29C48/914Cooling of flat articles, e.g. using specially adapted supporting means cooling drums
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Containers And Plastic Fillers For Packaging (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

A carrier tape for receiving electronic component according to the present invention is a carrier tape made of a resin in which a belt-like sheet and a plurality of concave portions provided along a longitudinal direction of the belt-like sheet are provided. The plurality of concave portions are formed on a first surface of the belt-like sheet and a second surface of the belt-like sheet opposite to the first surface is substantially flat. Corner portions of the plurality of concave portions are rounded in a curvature radius of 0.2 mm or less. Further, the present invention provides a method of manufacturing the carrier tape for receiving electronic component, and a package.

Description

電子零件收納用運送帶,電子零件收納用運送帶之製造方法及包裝體 Transporting belt for electronic component storage, manufacturing method of electronic component storage conveyor belt, and package body

本發明係關於一種電子零件收納用運送帶、電子零件收納用運送帶之製造方法及包裝體。 The present invention relates to a conveyor belt for electronic component storage, a method of manufacturing an electronic component storage conveyor belt, and a package.

一般而言,作為收納電子零件(特別是晶片電阻、晶片LED、晶片電容器等非常小的晶片零件)等的包裝體,係使用以頂端覆蓋膠帶(以下僅稱為「覆蓋膠帶」)密封電子零件收納用運送帶(以下僅稱為「運送帶」)的包裝體。使用以下述方式形成的衝孔運送帶(例如,參照專利文獻1)作為運送帶:以沖孔加工貫通帶狀片材的一部分之後,於片材的底面貼附底部膠帶,以形成凹形的零件收納部(凹孔)。另外,使用以壓縮加工使帶狀片材的一部分形成凹孔的衝壓運送帶(例如,參照專利文獻2)。更使用以成形加工(壓力成形、真空轉筒成形、壓製成形等)於帶狀片材的一部分形成凹孔的壓花運送帶(例如,參照專利文獻3)。 In general, as a package for accommodating electronic components (especially wafer resistors, wafer LEDs, wafer chips, and other very small wafer components), electronic components are sealed with a top cover tape (hereinafter simply referred to as "cover tape"). A package for a storage belt (hereinafter simply referred to as a "conveyor belt"). A punching conveyance belt (for example, refer to Patent Document 1) formed as follows is used as a conveyance belt: after punching a part of the strip-shaped sheet, a bottom tape is attached to the bottom surface of the sheet to form a concave shape. Part storage part (recessed hole). In addition, a press conveyor belt in which a part of the strip-shaped sheet is formed into a concave hole by compression processing is used (for example, refer to Patent Document 2). Further, an embossed transport belt in which a concave hole is formed in a part of the strip-shaped sheet by a forming process (pressure forming, vacuum drum forming, press forming, or the like) is used (for example, refer to Patent Document 3).

【先前技術文獻】 [Previous Technical Literature] 【專利文獻】 [Patent Literature]

【專利文獻1】日本特開平10-218281號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 10-218281

【專利文獻2】日本特許3751414號公報 [Patent Document 2] Japanese Patent No. 3751214

【專利文獻3】日本特開2011-225257號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2011-225257

如圖6、圖7、圖8所示的該衝孔運送帶及該衝壓運送帶,主要使用紙製片材基材作為片材基材。該等紙製運送帶,在將電子零件供給至表面安裝機(surface mounting machine)時,會有下述問題:因為片材本身所產生的紙粉,導致電子零件之焊接的接合不良與電子零件吸附噴嘴堵塞。另外,因為凹孔內的起毛、吸濕而導致凹孔之尺寸變化,在安裝時,於剝離覆蓋膠帶時所發生的靜電之帶電等,造成電子零件吸附噴嘴容易發生拾取失誤的問題。 As shown in FIG. 6, FIG. 7, and FIG. 8, the punching conveyance belt and the press conveyance belt mainly use a paper sheet base material as a sheet base material. These paper conveyor belts have the following problems when supplying electronic parts to a surface mounting machine: due to the paper powder generated by the sheet itself, the welding of the electronic parts is poor and the electronic parts are defective. The adsorption nozzle is clogged. Further, the size of the recessed hole is changed by the raising and the moisture absorption in the recessed hole, and the charging of the static electricity generated when the covering tape is peeled off during mounting causes a problem that the electronic component suction nozzle is liable to pick up errors.

另外,該衝孔運送帶中,通常是根據收納之電子零件的高度,來改變片材的厚度(與凹孔深度相同)。因此,在將高度較小的電子零件收納於凹孔之情況下的衝孔運送帶,需要縮小片材的厚度。此時,在將電子零件收納至凹孔,以覆蓋膠帶密封凹孔的貼紮(taping,以下僅稱為「貼紮」)時,或是在安裝電子零件時,以鏈輪運送衝孔運送帶時,因為片材強度不足,而使衝孔運送帶的打孔變形,因此產生運送不良的情形。結果,引起貼紮時電子零件之收納穩定性低,及安裝時電子零件的拾取失誤的問題。更進一步,因為片材底面必須貼附底部膠帶,使得材料購買及加工費用增加,而導致高成本的問題。 Further, in the punching belt, the thickness of the sheet (the same depth as the recessed hole) is usually changed in accordance with the height of the electronic component to be housed. Therefore, in the punching conveyance belt in the case where the electronic component having a small height is accommodated in the recessed hole, it is necessary to reduce the thickness of the sheet. At this time, when the electronic component is housed in the recessed hole to cover the tape sealing recessed hole (taping, hereinafter referred to simply as "sticking"), or when the electronic component is mounted, the sprocket is transported by the punching hole. In the case of belting, since the punching of the punching conveyance belt is deformed due to insufficient sheet strength, a conveyance failure occurs. As a result, the storage stability of the electronic component at the time of sticking is caused, and the problem of picking up the electronic component at the time of mounting is caused. Further, since the bottom surface of the sheet must be attached with the bottom tape, the cost of material purchase and processing increases, resulting in a high cost problem.

另一方面,如圖9、圖10、圖11所示的該壓花運送帶(embossed carrier tape),在片材背面側具有突起狀的壓花。因此,在將該壓花運送帶與該衝孔運送帶及該衝壓運送帶併用的情況中,必須進行貼紮機(taping machine)及表面安裝機的改裝與零件更換,而需要大量的成本。另外,在將該壓花運送帶捲繞至捲筒並且輸送時,因為負載施加於片材的背面側之突起狀的壓花,而產生零件收納部之變形與該壓花運送帶的捲繞失敗,導致捲繞鬆弛的問題。更進一步,貼紮後,以使壓花運送帶的背面側與捲筒對向的方式,將壓花運送帶捲繞於捲筒時,被捲繞之壓花運送帶的片材的背面側之突起,於內側壓住被捲繞之壓花運送帶的凹孔部分的覆蓋膠帶,結果導致在覆蓋膠帶上留下刮痕,及電子零件破損的問題。 On the other hand, the embossed carrier tape shown in Figs. 9, 10, and 11 has a projecting embossing on the back side of the sheet. Therefore, in the case where the embossed conveyance belt is used in combination with the punching conveyance belt and the press conveyance belt, it is necessary to perform modification and replacement of the taping machine and the surface mounter, which requires a large amount of cost. Further, when the embossed transport belt is wound up to the reel and conveyed, the deformation of the component accommodating portion and the winding of the embossed transport belt are caused by the application of the load to the protruding embossing on the back side of the sheet. Failure, causing problems with winding slack. Further, after the affixing, the back side of the sheet of the embossed transport belt to be wound is wound when the embossed transport belt is wound around the reel so that the back side of the embossed transport belt faces the reel The protrusions press the cover tape on the inner side of the recessed portion of the wound embossed conveyor belt, resulting in scratches on the cover tape and breakage of the electronic components.

另外,該等運送帶之製造方法中,運送帶之片材的製造與運送帶之凹孔的加工皆為不同的步驟。意即,凹孔加工,通常係將具有既定厚度、寬度、長度之縫隙的帶狀片材置入凹孔加工裝置,並對片材的一部分進行沖孔加工、壓縮加工或是成形加工(壓力成形、真空轉筒成形、壓製成形等)。更進一步,該衝孔運送帶的製造,在凹孔的加工後,亦必須進行在片材的底面貼附底部膠帶的步驟。因此,必須預先準備具有需要的厚度、寬度、長度之縫隙的帶狀片材及底部膠帶。結果,使材料費用及加工費用等增加,而導致高成本的問題。 Further, in the method of manufacturing such a conveyor belt, the manufacture of the sheet of the conveyor belt and the processing of the recessed holes of the conveyor belt are different steps. That is, the processing of the recessed holes is usually performed by placing a strip-shaped sheet having a slit of a predetermined thickness, width, and length into the recessed hole processing device, and punching, compressing, or forming a part of the sheet (pressure Forming, vacuum drum forming, press forming, etc.). Furthermore, in the manufacture of the punching conveyance belt, after the processing of the recessed holes, the step of attaching the bottom tape to the bottom surface of the sheet must also be performed. Therefore, it is necessary to prepare a strip-shaped sheet having a desired thickness, width, and length of the slit and a bottom tape in advance. As a result, material costs and processing costs are increased, resulting in high cost problems.

為解決以往之問題點,本發明之目的在於提供一種電子零件收納用運送帶、其製造方法及包裝體,其封紮及表面安裝的穩定性提升,且能被潔淨地提供,並使生產性提升,而具有顯著優良的價格競爭力。 In order to solve the conventional problems, an object of the present invention is to provide a conveyor belt for electronic component storage, a method for manufacturing the same, and a package body, which have improved stability in sealing and surface mounting, can be cleanly provided, and are productive. Upgrade, with significant price competitiveness.

以下述(1)~(13)之本發明,達成上述之目的。 The above object is achieved by the present invention (1) to (13) below.

(1)一種電子零件收納用運送帶,係由樹脂所製成,具有帶狀片材,及沿該帶狀片材的長邊方向配置的複數凹部,其特徵為:該帶狀片材具有第1面,及在該第1面之相反側的第2面;該複數凹部,形成於該帶狀片材的該第1面;該帶狀片材中的該第2面大致平坦;該複數凹部的端部,以曲率半徑為0.2mm以下而彎曲。 (1) A conveyor belt for electronic component storage, which is made of a resin, has a belt-shaped sheet, and a plurality of concave portions arranged along a longitudinal direction of the belt-shaped sheet, wherein the belt-shaped sheet has a first surface and a second surface opposite to the first surface; the plurality of concave portions are formed on the first surface of the strip-shaped sheet; and the second surface of the strip-shaped sheet is substantially flat; The ends of the plurality of concave portions are curved with a radius of curvature of 0.2 mm or less.

(2)如(1)之電子零件收納用運送帶,其中,假定各該複數凹部之深度為A(mm)、該凹部之底部的該帶狀片材的厚度為B(mm)、該凹部以外之部分的該帶狀片材的厚度為C(mm)時,則大致滿足A+B=C。 (2) The transporting belt for electronic component storage according to (1), wherein the depth of each of the plurality of concave portions is A (mm), and the thickness of the strip-shaped sheet at the bottom of the concave portion is B (mm), the concave portion When the thickness of the strip-shaped sheet other than the portion is C (mm), it substantially satisfies A + B = C.

(3)如(1)或(2)之電子零件收納用運送帶,其中,假定各該複數凹部的深度為A(mm),該凹部底部之該帶狀片材的厚度為B(mm),該凹部以外之部分的該帶狀片材的厚度為C(mm)時,則滿足-0.1<C-(A+B)<0.1。 (3) The transporting belt for electronic component storage according to (1) or (2), wherein the depth of each of the plurality of concave portions is A (mm), and the thickness of the strip-shaped sheet at the bottom of the concave portion is B (mm) When the thickness of the strip-shaped sheet other than the concave portion is C (mm), -0.1 < C - (A + B) < 0.1 is satisfied.

(4)如(1)~(3)中任一項之電子零件收納用運送帶,其中,以使該第2面與芯材對向的方式,將該運送帶捲繞於該芯材,該芯材的直徑為5~300mm。 (4) The electronic component storage conveyor belt according to any one of (1) to (3), wherein the conveyor belt is wound around the core material so that the second surface faces the core material. The core material has a diameter of 5 to 300 mm.

(5)一種電子零件收納用運送帶之製造方法,係(1)~(4)中任一項之電子零件收納用運送帶之製造方法,其特徵為包含:製膜步驟,以擠製成形法製作該帶狀片材。 (5) The method of manufacturing the electronic component storage conveyance belt according to any one of (1) to (4), characterized in that the film forming step is performed by extrusion molding The strip sheet was produced by the method.

(6)如(5)之電子零件收納用運送帶之製造方法,其中更包含:成形步驟,在該製膜步驟後,於該帶狀片材的該第1面形成該複數凹部。 (6) The method of manufacturing the electronic component storage conveyance belt according to (5), further comprising: a molding step of forming the plurality of concave portions on the first surface of the strip-shaped sheet after the film forming step.

(7)如(6)之電子零件收納用運送帶之製造方法,其中,該成形步驟,係使用具有用以使該複數凹部成形之突起物的模具來進行。 (7) The method for producing a conveyor belt for storing an electronic component according to (6), wherein the molding step is performed using a mold having a projection for molding the plurality of recesses.

(8)如(7)之電子零件收納用運送帶之製造方法,其中,該成形步驟,係使用滾筒狀模具來進行,其外周面上形成1個以上的用以使該複數凹部成形的該突起物。 (8) The method of manufacturing the transporting belt for electronic component storage according to (7), wherein the forming step is performed by using a roll-shaped mold, and one or more outer peripheral surfaces are formed to form the plurality of concave portions. Protrusions.

(9)如(6)~(8)中任一項之電子零件收納用運送帶之製造方法,其中,該成形步驟,包含使該帶狀片材的該第2面平坦化的步驟。 The manufacturing method of the electronic component storage conveyance belt of any one of (6)- (8) which comprises the step of planarizing the 2nd surface of the strip-shaped sheet.

(10)如(9)之電子零件收納用運送帶之製造方法,其中,該成形步驟,係使用使該帶狀片材之該第2面平坦化的接觸滾筒來進行。 (10) The method of manufacturing a conveyor belt for storing an electronic component according to (9), wherein the molding step is performed using a contact roller that planarizes the second surface of the strip-shaped sheet.

(11)如(6)~(10)中任一項之電子零件收納用運送帶之製造方法,其中更包含:冷卻步驟,在該成形步驟後,使該帶狀片材冷卻。 (11) The method for producing an electronic component storage conveyance belt according to any one of (6) to (10), further comprising: a cooling step of cooling the strip-shaped sheet after the forming step.

(12)如(11)之電子零件收納用運送帶之製造方法,其中,該冷卻步驟,係使用冷卻滾筒來進行。 (12) The method of manufacturing the electronic component storage conveyance belt according to (11), wherein the cooling step is performed using a cooling drum.

(13)一種包裝體,其特徵為包含:(1)~(4)中任一項之電子零件收納用運送帶;及頂端覆蓋膠帶,在將電子零件收納於該複數凹部內的狀態下,密封該複數凹部的開口。 (13) A package comprising: the electronic component storage conveyance belt according to any one of (1) to (4); and a top cover tape in a state in which the electronic component is housed in the plurality of recesses; The opening of the plurality of recesses is sealed.

根據本發明,可提供一種電子零件收納用運送帶、其製造方法及包裝體,可提升封紮及表面安裝的穩定性,且可被潔淨地提供,並提升生產性,而具有顯著優良的價格競爭力。 According to the present invention, it is possible to provide a transport belt for electronic component storage, a method for manufacturing the same, and a package body, which can improve the stability of sealing and surface mounting, can be cleanly provided, and improve productivity, and has a remarkable excellent price. Competitiveness.

1‧‧‧運送帶 1‧‧‧Transportation belt

10‧‧‧片材 10‧‧‧Sheet

11‧‧‧打孔 11‧‧‧ Punch

12‧‧‧凹部 12‧‧‧ recess

13‧‧‧第2面 13‧‧‧2nd

14‧‧‧端部 14‧‧‧ End

15‧‧‧第1面 15‧‧‧ first side

18‧‧‧段差部 18‧‧‧Departure

20‧‧‧覆蓋膠帶 20‧‧‧ Cover tape

30‧‧‧底部膠帶 30‧‧‧Bottom tape

40‧‧‧電子零件 40‧‧‧Electronic parts

50‧‧‧衝孔運送帶 50‧‧‧punching conveyor belt

70‧‧‧壓花運送帶 70‧‧‧embossed conveyor belt

100‧‧‧T模具 100‧‧‧T mould

110‧‧‧接觸滾筒 110‧‧‧Contact roller

120‧‧‧冷卻滾筒 120‧‧‧Cooling roller

130‧‧‧後段冷卻滾筒 130‧‧‧ Rear cooling drum

140‧‧‧後段冷卻滾筒 140‧‧‧ Rear cooling drum

150‧‧‧溶融樹脂 150‧‧‧ molten resin

160‧‧‧片材基材 160‧‧‧Sheet substrate

161‧‧‧凹部 161‧‧‧ recess

162‧‧‧第2面 162‧‧‧2nd

170‧‧‧接觸滾筒 170‧‧‧Contact roller

180‧‧‧接觸滾筒 180‧‧‧Contact roller

200‧‧‧成形模具 200‧‧‧Forming mould

300‧‧‧平坦的無縫皮帶 300‧‧‧flat seamless belt

310‧‧‧形成模具的無縫皮帶 310‧‧‧ Seamless belt forming the mold

【圖1】圖1係本發明之運送帶的第1實施態樣的部分立體圖。 Fig. 1 is a partial perspective view showing a first embodiment of a conveyor belt according to the present invention.

【圖2】圖2係沿著圖1的線A-A的剖面圖。 Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1.

【圖3】圖3係沿著圖1的線B-B的剖面圖。 Fig. 3 is a cross-sectional view taken along line B-B of Fig. 1.

【圖4】圖4係例示本發明之製造方法的第1實施態樣之製程的立體圖。 Fig. 4 is a perspective view showing a process of a first embodiment of the manufacturing method of the present invention.

【圖5】圖5係從圖4的C方向所視的圖。 Fig. 5 is a view as seen from the direction C of Fig. 4;

【圖6】圖6係以往衝孔運送帶之一實施態樣的部分立體圖。 Fig. 6 is a partial perspective view showing an embodiment of a conventional punching conveyance belt.

【圖7】圖7係沿著圖6的線D-D的剖面圖。 Fig. 7 is a cross-sectional view taken along line D-D of Fig. 6.

【圖8】圖8係沿著圖6的線E-E的剖面圖。 Fig. 8 is a cross-sectional view taken along line E-E of Fig. 6.

【圖9】圖9係以往壓花運送帶之一實施態樣的部分立體圖。 Fig. 9 is a partial perspective view showing an embodiment of a conventional embossed conveyor belt.

【圖10】圖10係沿著圖9的線F-F的剖面圖。 Fig. 10 is a cross-sectional view taken along line F-F of Fig. 9.

【圖11】圖11係沿著圖9的線G-G的剖面圖。 Fig. 11 is a cross-sectional view taken along line G-G of Fig. 9.

【圖12】圖12係本發明之運送帶的第2實施態樣之部分立體圖。 Fig. 12 is a partial perspective view showing a second embodiment of the conveyor belt of the present invention.

【圖13】圖13係沿著圖12的線H-H的剖面圖。 Fig. 13 is a cross-sectional view taken along line H-H of Fig. 12.

【圖14】圖14係沿著圖12的線J-J的剖面圖。 Fig. 14 is a cross-sectional view taken along line J-J of Fig. 12.

【圖15】圖15係本發明之運送帶的第3實施態樣的部分立體圖。 Fig. 15 is a partial perspective view showing a third embodiment of the conveyor belt of the present invention.

【圖16】圖16係沿著圖15的線K-K的剖面圖。 Fig. 16 is a cross-sectional view taken along line K-K of Fig. 15.

【圖17】圖17係沿著圖15的線L-L的剖面圖。 Fig. 17 is a cross-sectional view taken along line L-L of Fig. 15.

【圖18】圖18係例示本發明之製造方法之第2實施態樣之製程的示意圖。 Fig. 18 is a schematic view showing a process of a second embodiment of the manufacturing method of the present invention.

【圖19】圖19係例示本發明之製造方法之第3實施態樣之製程的示意圖。 Fig. 19 is a schematic view showing a process of a third embodiment of the manufacturing method of the present invention.

【圖20】圖20係例示本發明之製造方法之第4實施態樣之製程的示意圖。 Fig. 20 is a schematic view showing a process of a fourth embodiment of the manufacturing method of the present invention.

【圖21】圖21係例示本發明之製造方法之第5實施態樣之製程的示意圖。 Fig. 21 is a schematic view showing a process of a fifth embodiment of the manufacturing method of the present invention.

【圖22】圖22係例示本發明之製造方法之第6實施態樣之製程的示意圖。 Fig. 22 is a schematic view showing a process of a sixth embodiment of the manufacturing method of the present invention.

【圖23】圖23係例示本發明之製造方法之第7實施態樣之製程的示意圖。 Fig. 23 is a schematic view showing a process of a seventh embodiment of the manufacturing method of the present invention.

【圖24】圖24係例示本發明之製造方法之第8實施態樣之製程的示意圖。 Fig. 24 is a schematic view showing a process of an eighth embodiment of the manufacturing method of the present invention.

【圖25】圖25係例示本發明之製造方法之第9實施態樣之製程的示意圖。 Fig. 25 is a schematic view showing a process of a ninth embodiment of the manufacturing method of the present invention.

【圖26】圖26係例示本發明之製造方法之第10實施態樣之製程的示意圖。 Fig. 26 is a schematic view showing a process of a tenth embodiment of the manufacturing method of the present invention.

【圖27】圖27係例示本發明之製造方法之第11實施態樣之製程的示意圖。 Fig. 27 is a schematic view showing a process of an eleventh embodiment of the manufacturing method of the present invention.

【圖28】圖28係例示本發明之製造方法之第12實施態樣之製程的示意圖。 Fig. 28 is a schematic view showing a process of a twelfth embodiment of the manufacturing method of the present invention.

【圖29】圖29係例示本發明之製造方法之第13實施態樣之製程的示意 圖。 Fig. 29 is a schematic view showing a process of a thirteenth embodiment of the manufacturing method of the present invention; Figure.

【圖30】圖30係本發明之運送帶的第4實施態樣之部分立體圖。 Fig. 30 is a partial perspective view showing a fourth embodiment of the conveyor belt of the present invention.

【圖31】圖31係沿著圖30的線A-A的剖面圖。 Fig. 31 is a cross-sectional view taken along line A-A of Fig. 30.

【圖32】圖32係沿著圖30的線B-B的剖面圖。 32] Fig. 32 is a cross-sectional view taken along line B-B of Fig. 30.

【圖33】圖33係本發明之運送帶的第4實施態樣之部分立體圖。 Fig. 33 is a partial perspective view showing a fourth embodiment of the conveyor belt of the present invention.

【圖34】圖34係沿著圖33的線E-E的剖面圖。 Fig. 34 is a cross-sectional view taken along line E-E of Fig. 33.

【圖35】圖35係沿著圖33的線H-H的剖面圖。 Fig. 35 is a cross-sectional view taken along line H-H of Fig. 33.

【圖36】圖36係圖33的運送帶的部分平面圖。 Figure 36 is a partial plan view of the conveyor belt of Figure 33.

【圖37】圖37係本發明之運送帶的第5實施態樣之部分平面圖。 Fig. 37 is a partial plan view showing a fifth embodiment of the conveyor belt of the present invention.

【圖38】圖38係本發明之運送帶的第6實施態樣之部分平面圖。 Fig. 38 is a partial plan view showing a sixth embodiment of the conveyor belt of the present invention.

本發明之電子零件收納用運送帶,係樹脂製電子零件收納用運送帶,具有帶狀片材,及沿該帶狀片材之長邊方向配置的複數凹部,其特徵為:該凹部形成於該帶狀片材的第1面,且該帶狀片材中與第1面為相反側的第2面大致平坦。 The electronic component storage conveyance belt of the present invention is a resin-made electronic component storage conveyance belt, and has a belt-shaped sheet and a plurality of concave portions arranged along the longitudinal direction of the belt-shaped sheet, wherein the concave portion is formed in the concave portion The first surface of the strip-shaped sheet is substantially flat on the second surface of the strip-shaped sheet opposite to the first surface.

換言之,電子零件收納用運送帶,具有在帶狀片材之第1面開放的有底凹部,相當於該凹部之底部及其外周部附近的帶狀片材之第2面,係以實質上無段差的面所構成。 In other words, the electronic component storage conveyor belt has a bottomed recessed portion that is open on the first surface of the strip-shaped sheet, and corresponds to the bottom surface of the recessed portion and the second surface of the strip-shaped sheet in the vicinity of the outer peripheral portion thereof. It consists of no faces.

本發明之電子零件收納用運送帶之製造方法,包含製膜步驟,係以擠製成形法來製作該電子零件收納用運送帶的片材。 In the method for producing an electronic component storage conveyor belt according to the present invention, a film forming step is employed, and a sheet of the electronic component storage conveyor belt is produced by a extrusion molding method.

本發明之包裝體,包含:該電子零件收納用運送帶;及頂端覆蓋膠帶,其在將電子零件收納於該凹部內的狀態下,密封該凹部之開口。 The package according to the present invention includes: the electronic component storage transport belt; and a distal end cover tape that seals the opening of the concave portion in a state in which the electronic component is housed in the concave portion.

以下,根據圖式所示之實施態樣,對本發明之電子零件收納用運送帶(以下亦僅稱為「運送帶」)進行詳細說明。 Hereinafter, the electronic component storage conveyor belt (hereinafter also referred to simply as "transport belt") of the present invention will be described in detail based on the embodiment shown in the drawings.

<第1實施態樣> <First embodiment>

首先,就本發明之運送帶的第1實施態樣進行說明。 First, a first embodiment of the conveyor belt of the present invention will be described.

(1)運送帶 (1) conveyor belt

圖1係本發明之運送帶及包裝體的第1實施態樣之部分立體圖。為了表示收納於運送帶之凹孔內的電子零件,將該任意的覆蓋膠帶的一部分移除。為了更清楚表示凹孔內部,於前端的凹孔省略電子零件。圖2係沿著圖1的線A-A的剖面圖,圖3係沿著圖1的線B-B的剖面圖。 Fig. 1 is a partial perspective view showing a first embodiment of a conveyor belt and a package of the present invention. In order to show the electronic components housed in the recessed holes of the conveyor belt, a part of any of the cover tapes is removed. In order to more clearly show the inside of the recessed hole, the recessed hole at the front end omits the electronic component. 2 is a cross-sectional view taken along line A-A of FIG. 1, and FIG. 3 is a cross-sectional view taken along line B-B of FIG.

本發明之電子零件收納用運送帶1,如圖1~3所示,係樹脂製電子零件收納用運送帶,具有帶狀片材10、沿帶狀片材10之長邊方向配置的複數凹部12,其特徵為:該複數凹部12,形成於該帶狀片材10的第1面,在該帶狀片材10中,與第1面為相反側的第2面13大致平坦。 As shown in FIGS. 1 to 3, the electronic component storage conveyance belt 1 of the present invention is a resin-made electronic component storage conveyance belt, and has a belt-shaped sheet 10 and a plurality of concave portions arranged along the longitudinal direction of the belt-shaped sheet 10. 12 is characterized in that the plurality of concave portions 12 are formed on the first surface of the strip-shaped sheet 10, and in the strip-shaped sheet 10, the second surface 13 on the opposite side to the first surface is substantially flat.

該電子零件收納用運送帶1,具有複數凹部12,係以沿著帶狀片材10之長邊方向配置成1列的方式設置。該等凹部12中,分別可收納電子零件40。另外,如圖所示,亦可等間隔地將打孔11設於帶狀片材10。 The electronic component storage conveyance belt 1 has a plurality of concave portions 12 and is provided in a line along the longitudinal direction of the belt-shaped sheet 10 . The electronic components 40 can be housed in the recesses 12, respectively. Further, as shown in the figure, the perforations 11 may be provided on the strip-shaped sheet 10 at equal intervals.

又,本實施態樣中,電子零件40,其整體形狀成長方體狀,且收納電子零件40的凹部12之形狀,亦以與此對應的方式成長方體狀。因此,凹部12的俯視形狀,雖成長方形,但亦可對應需要收納的電子零件40之形狀,形成如三角形、五角形、六角形之多角形狀,亦可形成圓形等形狀。 Further, in the present embodiment, the electronic component 40 has a rectangular shape as a whole, and the shape of the concave portion 12 in which the electronic component 40 is housed is also grown in a square shape corresponding thereto. Therefore, the shape of the recessed portion 12 in a plan view is a rectangular shape. However, the shape of the electronic component 40 to be accommodated may be formed into a polygonal shape such as a triangle, a pentagon or a hexagon, or may be formed into a circular shape or the like.

另外,凹部12的內周面,考慮到電子零件吸附噴嘴的拾取性等,亦可沿著運送帶1之厚度方向,形成凸條或是凹條。 Further, the inner peripheral surface of the concave portion 12 may be formed with a ridge or a concave strip along the thickness direction of the transport belt 1 in consideration of the pick-up property of the electronic component suction nozzle or the like.

更進一步,亦可在凹部12的底面設置段差。藉此,例如,在電子零件40的底面形成端子等的情況下,因為能防止該端子與凹部12的底面接觸,故在輸送運送帶1時,可確實防止端子等的破損。 Further, a step may be provided on the bottom surface of the recess 12. In this case, for example, when a terminal or the like is formed on the bottom surface of the electronic component 40, since the terminal can be prevented from coming into contact with the bottom surface of the recessed portion 12, damage to the terminal or the like can be surely prevented when the transport belt 1 is transported.

本發明之電子零件收納用運送帶1,係以樹脂所製成。藉由以樹脂製成,在將電子零件40供給至表面安裝機時,並不會從運送帶本體產生如紙粉的微粉,而可防止電子零件40之焊接的接合不良或電子零件吸附噴嘴堵塞的情形發生。另外,可防止因為凹部12內的起毛、吸濕所導致的凹部12之尺寸變化。更進一步,可防止在安裝電子零件40時,在將覆蓋膠帶20從運送帶1剝離時所產生的靜電之帶電,而可提升電子零件吸附噴嘴的拾取性。藉此,可潔淨地提供運送帶1,提升封紮及表面安裝的穩定性,並達成運送帶1之生產性的提升。 The electronic component storage conveyance belt 1 of the present invention is made of a resin. By being made of a resin, when the electronic component 40 is supplied to the surface mounter, fine powder such as paper powder is not generated from the transport belt main body, and welding failure of the electronic component 40 or clogging of the electronic component suction nozzle can be prevented. The situation happened. In addition, it is possible to prevent dimensional changes of the concave portion 12 due to fuzzing and moisture absorption in the concave portion 12. Further, it is possible to prevent the charging of static electricity generated when the cover tape 20 is detached from the transport belt 1 when the electronic component 40 is mounted, and the pickup property of the electronic component suction nozzle can be improved. Thereby, the conveyor belt 1 can be cleanly provided, the stability of the sealing and surface mounting can be improved, and the productivity of the conveyor belt 1 can be improved.

另外,藉由以樹脂製作運送帶1,使片材10的強度提升。藉此,即使是為了收納高度較低的電子零件40,而縮小片材10之厚度的情況,在封紮時及安裝時,於輸送運送帶1時,可防止運送帶1之打孔11變形,及運送帶1之斷裂等情況。藉此,可充分抑制運送帶1之運送不良,而能提升封紮時電子零件40的收納穩定性,及安裝時電子零件40的拾取性。結果,可達成封紮及表面安裝之穩定性的提升,及運送帶1之生產性的提升。 Further, the strength of the sheet 10 is improved by making the conveyor belt 1 from a resin. Thereby, even if the thickness of the sheet 10 is reduced in order to accommodate the electronic component 40 having a low height, the punching 11 of the transport belt 1 can be prevented from being deformed when the transport belt 1 is transported during sealing and at the time of mounting. , and the breakage of the conveyor belt 1 and the like. Thereby, the conveyance failure of the conveyance belt 1 can be sufficiently suppressed, and the storage stability of the electronic component 40 at the time of sealing and the pick-up property of the electronic component 40 at the time of mounting can be improved. As a result, the stability of the sealing and surface mounting can be improved, and the productivity of the conveyor belt 1 can be improved.

另外,凹部12形成於該片材10的第1面,該片材10中與第1面相反的第2面13大致平坦。意即,第2面13中,相當於凹部12之底部及其外周部附近的面,係以實質上無段差的面所構成。因此,運送帶1,可使用衝孔運送帶與衝壓運送帶用的封紮機及安裝機,而以與衝孔運送帶及衝壓運送帶相同的方式使用。藉此,不需要新的設備投資,而可提升價格競爭力。另外,在將該運送帶1捲繞於捲筒並輸送時,因為第2面13大致平坦,故可防止運送帶1之捲繞失敗或捲繞鬆弛。藉此,可防止凹部12的變形,及覆蓋膠帶20的損傷。 Further, the concave portion 12 is formed on the first surface of the sheet 10, and the second surface 13 of the sheet 10 opposite to the first surface is substantially flat. In other words, in the second surface 13, the surface corresponding to the bottom of the concave portion 12 and the vicinity of the outer peripheral portion thereof is constituted by a surface having substantially no step. Therefore, the conveyance belt 1 can be used in the same manner as the punching conveyance belt and the press conveyance belt by using a punching conveyor and a sealing machine for a press belt and a mounting machine. In this way, new equipment investment is not required, and price competitiveness can be improved. Further, when the conveyor belt 1 is wound around the drum and conveyed, since the second surface 13 is substantially flat, it is possible to prevent the winding of the conveyor belt 1 from being unsuccessful or loose. Thereby, deformation of the concave portion 12 and damage of the cover tape 20 can be prevented.

另外,藉由這種構造,可提供與更加薄型化之電子零件對應的運送帶1。意即:凹部12的深度,可根據包裝之電子零件40的大小來決定適當的深度。換言之,在將電子零件40收納在形成於運送帶1與覆蓋膠帶20之間的內部空間(凹部12)中時,為了保護電子零件40不受收納電子零件40的運送帶1在保管及輸送時的撞撃、污染等影響,宜以將凹部12設計成其高度具有些許間隙(例 如,0~0.3mm)。因此,由於現今電子零件的薄型化,在衝孔運送帶的情況,片材本身亦必須薄型化。因此,具有片材強度不足、片材斷裂等可能性。然而,運送帶1,即使配合包裝之電子零件40而使凹部12的深度變淺,因為不需要將片材10本身的厚度薄型化,故可在具有充分強度的狀態下,對應薄型化電子零件。 Further, with this configuration, the transport belt 1 corresponding to the thinner electronic component can be provided. That is, the depth of the recess 12 can be determined according to the size of the packaged electronic component 40. In other words, when the electronic component 40 is housed in the internal space (concave portion 12) formed between the transport belt 1 and the cover tape 20, in order to protect the electronic component 40 from the transport belt 1 in which the electronic component 40 is stored, it is stored and transported. The impact of the impact, pollution, etc., should be designed to have the recess 12 with a slight gap (eg For example, 0~0.3mm). Therefore, due to the thinning of electronic parts today, in the case of a punching belt, the sheet itself must be thinned. Therefore, there is a possibility that the sheet strength is insufficient, the sheet is broken, and the like. However, the transport belt 1 has a shallower depth of the concave portion 12 even when the electronic component 40 is packaged, and since the thickness of the sheet 10 itself is not required to be thinned, the thinned electronic component can be correspondingly provided with sufficient strength. .

另外,作為構成運送帶1的樹脂,雖並未特別限定,但可舉例如:聚苯乙烯、聚乙烯、聚丙烯、聚酯(聚乙烯對苯二甲酸酯等)、聚碳酸酯、聚氯乙烯、聚醯胺、聚縮醛之各種樹脂(各種熱可塑性樹脂),亦可併用2種以上的該等樹脂。另外,因應於需求,亦可在該等樹脂中,摻合碳黑(carbon black)、石墨、碳纖維等導電性填充物。藉此,賦予運送帶1導電性,而可防止帶電。因此,更可防止靜電引起的電子零件40破壞。另外,因應於需求,亦可將發泡劑或潤滑劑等各種添加劑添加至該樹脂中。更進一步,亦可在運送帶1的表面,形成以矽系樹脂、氟系樹脂等所構成的剝離劑層,或具有導電性的被覆膜等。藉此,可將捲繞於捲筒的運送帶1平順地捲出。另外,亦可使運送帶1之片材10的層構造,為滿足該等要件之單層或是多層。 In addition, the resin constituting the conveyor belt 1 is not particularly limited, and examples thereof include polystyrene, polyethylene, polypropylene, polyester (polyethylene terephthalate, etc.), polycarbonate, and poly Various resins (all kinds of thermoplastic resins) of vinyl chloride, polyamine, and polyacetal may be used in combination of two or more kinds of these resins. Further, in order to meet the demand, a conductive filler such as carbon black, graphite or carbon fiber may be blended in the resins. Thereby, the conveyor belt 1 is imparted with conductivity, and charging can be prevented. Therefore, it is possible to prevent the destruction of the electronic component 40 caused by static electricity. Further, various additives such as a foaming agent or a lubricant may be added to the resin in accordance with the demand. Further, a release agent layer made of a lanthanoid resin, a fluorine resin or the like, or a conductive coating film or the like may be formed on the surface of the conveyor belt 1. Thereby, the conveyor belt 1 wound around the reel can be smoothly wound out. Further, the layer structure of the sheet 10 of the transport belt 1 may be a single layer or a plurality of layers satisfying the requirements.

另外,假定凹部12之深度為A(mm),於凹部12之底部的帶狀片材10的厚度(以下稱「凹部12底部的厚度」)為B(mm),於該凹部以外之部分的帶狀片材10的厚度為C(mm)時,宜大致滿足A+B=C。滿足A+B=C的情況,更宜為例如滿足-0.1<C-(A+B)<0.1,又更宜為滿足-0.05<C-(A+B)<0.05。藉由滿足該式,可使第2面13更為平坦,並可在將運送帶1捲繞於捲筒以保管時,或輸送運送帶1時,防止運送帶1的捲繞失敗或捲繞鬆弛。 Further, it is assumed that the depth of the concave portion 12 is A (mm), and the thickness of the strip-shaped sheet 10 at the bottom of the concave portion 12 (hereinafter referred to as "thickness at the bottom of the concave portion 12") is B (mm), and the portion other than the concave portion When the thickness of the strip-shaped sheet 10 is C (mm), it is preferable to substantially satisfy A + B = C. In the case where A+B=C is satisfied, it is more preferable to satisfy, for example, -0.1<C-(A+B)<0.1, and more preferably -0.05<C-(A+B)<0.05. By satisfying this formula, the second surface 13 can be made flatter, and when the transport belt 1 is wound around the reel for storage or when the transport belt 1 is transported, the winding failure or winding of the transport belt 1 is prevented. relaxation.

另外,凹部12的深度A,可由所包裝之電子零件40的高度決定。假定電子零件40之高度為Z(mm)時,宜滿足0≦A-Z≦0.3,更宜滿足0.05≦A-Z≦0.15。藉由使A-Z的值在該較佳範圍內,可提升封紮時電子零件40的收納穩定性及安裝時電子零件40的拾取性,可防止因為運送帶1之保管及輸送時的撞撃、污染等所導致的電子零件40的破損。另外,於該凹部以外之部分的帶狀片材10的厚度C,大致與運送帶1之片材10的厚度相同。此處, C的厚度宜為0.1mm以上1.0mm以下,更宜為0.2mm以上0.5mm以下。藉由使厚度C在該較佳的範圍內,使運送帶1的生產性提升。另外,可防止運送帶1之打孔11變形,及運送帶1斷裂等情況。 In addition, the depth A of the recess 12 can be determined by the height of the packaged electronic component 40. Assuming that the height of the electronic component 40 is Z (mm), it is preferable to satisfy 0≦A-Z≦0.3, and it is preferable to satisfy 0.05≦A-Z≦0.15. By setting the value of AZ within the preferred range, the storage stability of the electronic component 40 at the time of sealing and the pick-up property of the electronic component 40 at the time of mounting can be improved, and collisions during storage and transportation of the transport belt 1 can be prevented. Damage to the electronic component 40 caused by contamination or the like. Further, the thickness C of the strip-shaped sheet 10 at a portion other than the concave portion is substantially the same as the thickness of the sheet 10 of the transport belt 1. Here, The thickness of C is preferably 0.1 mm or more and 1.0 mm or less, more preferably 0.2 mm or more and 0.5 mm or less. By making the thickness C within the preferred range, the productivity of the conveyor belt 1 is improved. Further, it is possible to prevent the perforation 11 of the transport belt 1 from being deformed, and the transport belt 1 from being broken.

另外,凹部12的尺寸,係以所包裝之電子零件40的尺寸決定。在運送帶1俯視時,假定凹部12之開口的短邊為D(mm),長邊為E(mm),且D≦E,電子零件40的短邊為X(mm),長邊為Y(mm),且X≦Y時,則滿足0<D-X≦0.3,0<E-Y≦0.3為較佳;0.05≦D-X≦0.15,0.05≦E-Y≦0.15為更佳。藉由使D-X及E-Y在該較佳範圍,可提升封紮時電子零件40之收納穩定性及安裝時電子零件40的拾取性,並防止因為運送帶1之保管及輸送時的撞撃、污染等,所導致的電子零件40的破損。 In addition, the size of the recess 12 is determined by the size of the electronic component 40 to be packaged. When the conveyor belt 1 is viewed from above, it is assumed that the short side of the opening of the recess 12 is D (mm), the long side is E (mm), and D ≦ E, the short side of the electronic component 40 is X (mm), and the long side is Y. (mm), and when X ≦ Y, it satisfies 0 < DX ≦ 0.3, 0 < EY ≦ 0.3 is preferable; 0.05 ≦ DX ≦ 0.15, 0.05 ≦ EY ≦ 0.15 is more preferable. By making DX and EY in this preferred range, the storage stability of the electronic component 40 at the time of sealing and the pick-up property of the electronic component 40 at the time of mounting can be improved, and the collision and contamination during storage and transportation of the transport belt 1 can be prevented. Etc., the resulting damage to the electronic component 40.

另外,有時會有使第2面13在捲筒(芯材)側捲繞運送帶1的狀態,保管、輸送運送帶1的情形。此時所使用的捲筒,其直徑宜為5~300mm左右,更宜為30~250mm左右。又,亦可使第1面在捲筒側以捲繞運送帶1。 In addition, the second surface 13 may be wound around the reel (core material) side, and the transport belt 1 may be stored and transported. The diameter of the reel used at this time should be about 5 to 300 mm, more preferably about 30 to 250 mm. Further, the first surface may be wound around the reel 1 on the side of the reel.

此處,收納於凹部12的電子零件40,如圖2所示,在從剖面觀察下為長方形時,在電子零件40俯視圖的尺寸,若以前述之Y(mm)×X(mm)表示,通常為0.6mm×0.5mm、0.6mm×0.3mm、0.4mm×0.2mm。此外,一般係認為將來會使用尺寸為0.3mm×0.15mm、0.2mm×0.1mm的電子零件40。因此,將Y(mm)為0.2~0.6mm左右,X(mm)為0.1~0.5mm左右的電子零件40收納於凹部12。 Here, as shown in FIG. 2, the electronic component 40 accommodated in the recessed part 12 has a rectangular shape when viewed from a cross section, and the size of the electronic component 40 in a plan view is expressed by Y (mm) × X (mm). It is usually 0.6 mm × 0.5 mm, 0.6 mm × 0.3 mm, and 0.4 mm × 0.2 mm. Further, it is generally considered that an electronic component 40 having a size of 0.3 mm × 0.15 mm and 0.2 mm × 0.1 mm will be used in the future. Therefore, the electronic component 40 in which Y (mm) is about 0.2 to 0.6 mm and X (mm) is about 0.1 to 0.5 mm is accommodated in the recessed portion 12.

另外,如此之電子零件40的高度Z(mm),通常設定為0.1~0.35mm左右。 Further, the height Z (mm) of the electronic component 40 is usually set to about 0.1 to 0.35 mm.

另外,假定運送帶1所捲繞的捲筒之直徑φ為F(mm),在運送帶1捲繞於捲筒時,運送帶1會變成彎曲的態樣。此時,因為係使運送帶1捲繞至捲筒,故與未將運送帶1捲繞的狀態比較,凹部12的深度A有所變化。因此,本案發明人檢討的結果,假設凹部12的開口部側,意即覆蓋膠帶20側為平坦的話,凹部12之深度A的變化量G(mm)可以下式(1)表示。此情況下,變化量G(mm)係使凹部12的深度A縮小,故凹部12的實質深度係為A-G(mm)。 Further, it is assumed that the diameter φ of the reel wound by the transport belt 1 is F (mm), and when the transport belt 1 is wound around the reel, the transport belt 1 becomes curved. At this time, since the conveyance belt 1 is wound around the reel, the depth A of the concave portion 12 is changed as compared with the state in which the conveyance belt 1 is not wound. Therefore, as a result of the review by the inventor of the present invention, the opening amount side of the recessed portion 12, that is, the side of the cover tape 20 is flat, the amount of change G (mm) of the depth A of the recessed portion 12 can be expressed by the following formula (1). In this case, the amount of change G (mm) reduces the depth A of the recess 12, so the substantial depth of the recess 12 is A-G (mm).

另一方面,在運送帶1捲繞至捲筒時,假設凹部12的底部側為平坦的話,凹部12之深度A的變化量H(mm)可以下式(2)表示。此情況中,變化量H(mm)係使凹部12之深度A增加,故凹部12之實質深度係為A+H(mm)。 On the other hand, when the conveyance belt 1 is wound to the reel, assuming that the bottom side of the recessed portion 12 is flat, the amount of change H (mm) of the depth A of the recessed portion 12 can be expressed by the following formula (2). In this case, the amount of change H (mm) increases the depth A of the recess 12, so the substantial depth of the recess 12 is A + H (mm).

於是,在將上述尺寸的電子零件40收納於凹部12內的狀態,將運送帶1捲繞於直徑為5~300mm的捲筒時,若使用上述式(1)及式(2)求算變化量G及變化量H的話,則變化量G及變化量H分別在2.0×10-5~1.33×10-2mm及2.0×10-5~1.46×10-2mm的範圍內。 Then, when the electronic component 40 of the above-described size is housed in the recessed portion 12, when the transport belt 1 is wound around a reel having a diameter of 5 to 300 mm, the above equations (1) and (2) are used to calculate the change. In the case of the amount G and the amount of change H, the amount of change G and the amount of change H are in the range of 2.0 × 10 -5 to 1.33 × 10 -2 mm and 2.0 × 10 -5 to 1.46 × 10 -2 mm, respectively.

又,以下述情況為代表,求算該變化量G及變化量H:凹部12的俯視大小與電子零件40的俯視大小相比,其長及寬皆分別多出0.05mm,而凹部12之底部的厚度為0.1mm,凹部12之深度與電子零件40之高度的差(A-Z)為0.15mm。 Further, the amount of change G and the amount of change H are represented by the following cases: the size of the recessed portion 12 is larger than the size of the top surface of the electronic component 40 by 0.05 mm, and the bottom of the recessed portion 12 The thickness is 0.1 mm, and the difference (AZ) between the depth of the recess 12 and the height of the electronic component 40 is 0.15 mm.

因此如上所述,藉由將凹部12之深度與電子零件40之高度的差(A-Z)設定為較佳範圍的0.05≦A-Z≦0.15左右,與高度差(A-Z)相比,變化量G及變化量H皆是較小的值。因此,即使將運送帶1捲繞於如上述直徑的捲筒,亦可確實地抑制或防止電子零件40刺破覆蓋膠帶20,或於覆蓋膠帶20產生捲繞皺褶等情況。更進一步,由於運送帶1相對於捲筒的捲繞更加牢固,故可確實地防止運送帶1的捲繞失敗或捲繞鬆弛。 Therefore, as described above, by setting the difference (AZ) between the depth of the concave portion 12 and the height of the electronic component 40 to about 0.05 ≦ AZ ≦ 0.15 in the preferred range, the amount of change G and the change are compared with the height difference (AZ). The amount H is a small value. Therefore, even if the transport belt 1 is wound around the reel having the above diameter, it is possible to surely suppress or prevent the electronic component 40 from piercing the cover tape 20 or to cause wrinkles or the like on the cover tape 20. Further, since the winding of the transport belt 1 with respect to the reel is more secure, it is possible to surely prevent the winding failure or the winding slack of the transport belt 1.

另外,該凹部12之內側的端部14,宜以曲率半徑0.2mm以下而彎曲,更 宜以曲率半徑0.1mm以下而彎曲。因為凹部12係如此的構造,故即使在包裝薄型電子零件40的情況下,亦可使與凹部12之底面垂直的側壁面之平面部分變大。藉此,可防止凹部的側壁面從底部至端部擴大,故可提升電子零件40的收納穩定性。 Further, the inner end portion 14 of the recessed portion 12 is preferably curved with a curvature radius of 0.2 mm or less. It is preferable to bend with a radius of curvature of 0.1 mm or less. Since the concave portion 12 has such a configuration, even in the case of packaging the thin electronic component 40, the planar portion of the side wall surface perpendicular to the bottom surface of the concave portion 12 can be made large. Thereby, the side wall surface of the recessed portion can be prevented from being enlarged from the bottom portion to the end portion, so that the storage stability of the electronic component 40 can be improved.

(2)運送帶之製造方法 (2) Manufacturing method of the conveyor belt

接著,就本發明之運送帶的製造方法的第1實施態樣進行說明。 Next, a first embodiment of a method of manufacturing a conveyor belt according to the present invention will be described.

圖4係本發明之運送帶之製造方法的製程的第1實施態樣的立體圖。圖5係從圖4的C方向觀察的圖,係本發明之運送帶之製造方法之製程的一實施態樣。 Fig. 4 is a perspective view showing a first embodiment of the process of the method for producing a conveyor belt according to the present invention. Fig. 5 is a view as seen from the direction C of Fig. 4, which is an embodiment of the process of the method of manufacturing the conveyor belt of the present invention.

本發明之運送帶1之製造方法,並未特別限定。宜包含例如製膜步驟,從T模具100以擠製成形法擠出溶融樹脂150,以製作構成運送帶1的片材基材160。藉由這種擠製成形法的製膜步驟,可使運送帶1之片材10的厚度穩定。 The method for producing the conveyor belt 1 of the present invention is not particularly limited. It is preferable to include, for example, a film forming step of extruding the molten resin 150 from the T die 100 by extrusion molding to fabricate the sheet substrate 160 constituting the transport belt 1. The thickness of the sheet 10 of the transport belt 1 can be stabilized by the film forming step of the extrusion molding method.

該運送帶1之製造方法,宜包含成形步驟,係在該製膜步驟後,使凹部161成形於片材基材160的第1面。藉由這種步驟,使片材基材160成形,而製造本發明之運送帶1。 The manufacturing method of the conveyor belt 1 preferably includes a forming step of forming the concave portion 161 on the first surface of the sheet base material 160 after the film forming step. By this step, the sheet substrate 160 is shaped to manufacture the carrier tape 1 of the present invention.

該成形步驟並未特別限定,一般宜使用表面具有突起的模具來進行,例如使用如成形模具200般之滾筒狀模具較佳。藉由使用這種模具,可有效率地製造本發明之運送帶1,並可提升運送帶1的生產性。該滾筒狀模具並未特別限定,一般可安裝於例如冷卻滾筒120。 The forming step is not particularly limited, and it is generally preferable to use a mold having a projection on the surface, and for example, a roll-shaped mold such as a forming mold 200 is preferable. By using such a mold, the conveyor belt 1 of the present invention can be efficiently manufactured, and the productivity of the conveyor belt 1 can be improved. The drum-shaped mold is not particularly limited, and can be generally mounted to, for example, the cooling drum 120.

該成形步驟中,亦可使打孔11與片材基材160一併形成。藉由形成打孔11,可適當地使用本發明之運送帶1。另外,該打孔11,亦可在後述的冷卻步驟之後形成。此情況中,可以沖孔模具形成打孔11。 In the forming step, the punching holes 11 may be formed together with the sheet base material 160. The transport belt 1 of the present invention can be suitably used by forming the punched holes 11. Further, the punching hole 11 may be formed after a cooling step to be described later. In this case, the punching mold 11 can be formed by punching the mold.

該運送帶1之製造方法,宜包含:使片材基材160的第2面162平坦化的 步驟。藉由包含這種步驟,可更有效率地製造本發明的運送帶1。像這種步驟並未特別限定,一般宜在成形步驟的同時及/或成形步驟之後進行。例如,如圖5所示,運送帶1之製造方法可包含:在使用成形模具200進行成形步驟的同時,以接觸滾筒110及冷卻滾筒120使片材基材160平坦化的步驟。藉由這種步驟,可妥善而高效率地製造本發明的運送帶1。 The manufacturing method of the conveyor belt 1 preferably includes flattening the second surface 162 of the sheet substrate 160. step. By including such a step, the transport belt 1 of the present invention can be manufactured more efficiently. Such a step is not particularly limited and is generally carried out at the same time as the forming step and/or after the forming step. For example, as shown in FIG. 5, the manufacturing method of the conveyance belt 1 may include the step of planarizing the sheet base material 160 by the contact roller 110 and the cooling drum 120 while performing the forming step using the molding die 200. By this step, the conveyor belt 1 of the present invention can be manufactured efficiently and efficiently.

該運送帶1之製造方法,宜包含:使片材基材160冷卻的冷卻步驟。冷卻步驟,因為係與成形步驟同時及/或在成形步驟之後進行,故可防止成形的片材基材160,因為成形後的餘熱而變形。像這種冷卻步驟並未特別限定,一般可以例如圖5所示之冷卻滾筒120進行。另外,為了更充分地使片材基材160冷卻,可使用複數冷卻滾筒。冷卻步驟,例如可以圖5所示的後段冷卻滾筒130及140進行。藉由使用冷卻滾筒進行冷卻步驟,可更提升本發明之運送帶1的生產性。 The method of manufacturing the conveyor belt 1 preferably includes a cooling step of cooling the sheet substrate 160. The cooling step, because it is carried out simultaneously with the forming step and/or after the forming step, prevents the formed sheet substrate 160 from being deformed by the residual heat after forming. Such a cooling step is not particularly limited, and can be generally performed, for example, by the cooling drum 120 shown in FIG. Further, in order to more sufficiently cool the sheet substrate 160, a plurality of cooling rolls can be used. The cooling step can be performed, for example, by the rear stage cooling rolls 130 and 140 shown in FIG. The productivity of the conveyor belt 1 of the present invention can be further improved by performing a cooling step using a cooling drum.

(3)包裝體 (3) Package

接著,就本發明之包裝體的第1實施態樣進行說明。 Next, a first embodiment of the package of the present invention will be described.

本發明之包裝體,包含:本發明之電子零件收納用運送帶1;及頂端覆蓋膠帶20,在將電子零件40收納於該凹部12內的狀態,密封該凹部12的開口。 The package of the present invention includes the electronic component storage conveyance belt 1 of the present invention, and a distal end cover tape 20 that seals the opening of the concave portion 12 in a state in which the electronic component 40 is housed in the concave portion 12.

本發明之包裝體並未特別限定,一般如圖1所示,係具有:本發明之運送帶1;及覆蓋膠帶20的包裝體,該覆蓋膠帶20,在電子零件40收納於運送帶1之凹部12的狀態密封凹部12的開口。 The package of the present invention is not particularly limited, and as shown in FIG. 1, it generally includes the carrier tape 1 of the present invention and a package body covering the tape 20, and the cover tape 20 is housed in the conveyor belt 1 in the electronic component 40. The state of the recess 12 seals the opening of the recess 12.

運送帶1與覆蓋膠帶20,係以熱密封(heat seal)的方式連接。熱密封,係使用封口機(sealing machine),沿著覆蓋膠帶20之長邊的各端緣進行。又,亦可以黏著劑代替熱密封,使運送帶1與覆蓋膠帶20連接。 The conveyor belt 1 and the cover tape 20 are connected by a heat seal. The heat sealing is carried out along the respective edges of the long sides of the cover tape 20 using a sealing machine. Further, the adhesive tape may be connected to the cover tape 20 instead of the heat seal.

在這種包裝體中,藉由將覆蓋膠帶20往包裝體的長邊方向拉,將覆蓋膠帶20從運送帶1剝離,而能夠取出電子零件40。 In such a package, the cover tape 20 is peeled from the transport belt 1 by pulling the cover tape 20 in the longitudinal direction of the package, and the electronic component 40 can be taken out.

<第2實施態樣> <Second embodiment>

接著,就本發明之運送帶的第2實施態樣進行說明。圖12係本發明之運送帶及包裝體的第2實施態樣之部分立體圖。為了表示收納於運送帶之凹孔內的電子零件,故部分地移除該覆蓋膠帶。為了更清楚地表示凹孔內部,故從前端的凹孔省略電子零件。圖13係沿著圖12的線H-H的剖面圖,圖14係沿著圖12的線J-J的剖面圖。 Next, a second embodiment of the conveyor belt of the present invention will be described. Fig. 12 is a partial perspective view showing a second embodiment of the conveyor belt and the package of the present invention. In order to indicate the electronic components housed in the recessed holes of the conveyor belt, the cover tape is partially removed. In order to more clearly show the inside of the recessed hole, the electronic component is omitted from the recessed hole at the front end. 13 is a cross-sectional view taken along line H-H of FIG. 12, and FIG. 14 is a cross-sectional view taken along line J-J of FIG.

本發明之運送帶1,係樹脂製電子零件收納用運送帶,具有:帶狀片材10;及沿著帶狀片材10的長邊方向配置的複數凹部12。該凹部12,形成於該片材10的第1面,該片材10中與第1面相反的第2面13大致平坦。然而,亦可如同第2實施態樣,第2面為稍微凹陷的態樣。 The transport belt 1 of the present invention is a resin-made electronic component storage transport belt, and includes a belt-shaped sheet 10 and a plurality of concave portions 12 arranged along the longitudinal direction of the strip-shaped sheet 10. The concave portion 12 is formed on the first surface of the sheet 10, and the second surface 13 of the sheet 10 opposite to the first surface is substantially flat. However, as in the second embodiment, the second surface may be slightly recessed.

<第3實施態樣> <Third embodiment>

接著,就本發明之運送帶的第3實施態樣進行說明。圖15係本發明之運送帶及包裝體的第3實施態樣的部分立體圖。為了表示收納於運送帶之凹孔內的電子零件,故部分地移除該覆蓋膠帶。為了更清楚地表示凹孔內部,故從前端的凹孔省略電子零件。圖16係沿著圖15的線K-K的剖面圖,圖17係沿著圖15的線L-L的剖面圖。 Next, a third embodiment of the conveyor belt of the present invention will be described. Fig. 15 is a partial perspective view showing a third embodiment of the conveyor belt and the package of the present invention. In order to indicate the electronic components housed in the recessed holes of the conveyor belt, the cover tape is partially removed. In order to more clearly show the inside of the recessed hole, the electronic component is omitted from the recessed hole at the front end. 16 is a cross-sectional view taken along line K-K of FIG. 15, and FIG. 17 is a cross-sectional view taken along line L-L of FIG.

本發明之運送帶1,係樹脂製的電子零件收納用運送帶,具有:帶狀片材10;及沿著帶狀片材10的長邊方向配置的複數凹部12。該凹部12,形成於該片材10的第1面,該片材10中與第1面相反的第2面13大致平坦。然而,如第3實施態樣,第2面亦可為稍微膨脹的態樣。 The conveyor belt 1 of the present invention is a resin-made electronic component storage conveyor belt, and includes a belt-shaped sheet 10 and a plurality of concave portions 12 arranged along the longitudinal direction of the belt-shaped sheet 10. The concave portion 12 is formed on the first surface of the sheet 10, and the second surface 13 of the sheet 10 opposite to the first surface is substantially flat. However, as in the third embodiment, the second surface may be a slightly expanded state.

<第4實施態樣> <Fourth embodiment>

接著,就本發明之運送帶的第4實施態樣,以與第1實施態樣不同的點為中心進行說明,而關於相同的事項,省略其說明。圖30係本發明之運送帶及包裝體的第4實施態樣的部分立體圖。為了表示收納於運送帶之凹孔內的電子零件,故部分地移除該覆蓋膠帶。為了更清楚地表示凹孔內部,故從前端的凹 孔省略電子零件。圖31係沿著圖30的線A-A的剖面圖,圖32係沿著圖30的線B-B的剖面圖。 Next, the fourth embodiment of the transport belt according to the present invention will be described focusing on differences from the first embodiment, and the description of the same matters will be omitted. Figure 30 is a partial perspective view showing a fourth embodiment of the conveyor belt and the package of the present invention. In order to indicate the electronic components housed in the recessed holes of the conveyor belt, the cover tape is partially removed. In order to more clearly represent the inside of the recess, the recess from the front end Holes omit electronic parts. 31 is a cross-sectional view taken along line A-A of FIG. 30, and FIG. 32 is a cross-sectional view taken along line B-B of FIG.

另外,圖33係本發明之運送帶的第4實施態樣的部分立體圖。圖34係沿著圖33的線E-E的剖面圖。圖35係沿著圖33的線H-H的剖面圖。圖36係圖33之運送帶的部分俯視圖。 Fig. 33 is a partial perspective view showing a fourth embodiment of the conveyor belt of the present invention. Figure 34 is a cross-sectional view taken along line E-E of Figure 33. Figure 35 is a cross-sectional view taken along line H-H of Figure 33. Figure 36 is a partial plan view of the conveyor belt of Figure 33.

如圖30~圖32所示,本實施態樣之運送帶1,係樹脂製的電子零件收納用運送帶,包含:帶狀片材10;及沿著帶狀片材10的長邊方向配置的複數凹部12。該凹部12,形成於該片材10的第1面15,該片材10中與第1面15相反側的第2面13大致平坦。 As shown in FIG. 30 to FIG. 32, the transport belt 1 of the present embodiment is a resin-made electronic component storage transport belt, and includes a belt-shaped sheet 10; and is disposed along the longitudinal direction of the strip-shaped sheet 10. The plurality of recesses 12. The concave portion 12 is formed on the first surface 15 of the sheet 10, and the second surface 13 on the side opposite to the first surface 15 of the sheet 10 is substantially flat.

如圖33~圖35所示,運送帶1中,於第1面15之複數凹部12彼此間的區域(以下稱為「第1區域」)更具有段差部18。意即,第1區域,如圖30及圖33,與第1區域以外的區域(以下稱為「第2區域」)相比,係稍微下沉的態樣。藉由這種構成,運送帶1製造時,於第1區域之帶狀片材10的表面並未比於第2區域中的帶狀片材10的表面突出。因此,在將運送帶1捲繞於捲筒時,可使覆蓋膠帶20與運送帶1不產生刮痕,而電子零件40亦不會破損。 As shown in FIGS. 33 to 35, in the transport belt 1, a region between the plurality of concave portions 12 of the first surface 15 (hereinafter referred to as "first region") has a step portion 18. In other words, the first region, as shown in FIGS. 30 and 33, is slightly sunk compared to a region other than the first region (hereinafter referred to as "second region"). According to this configuration, when the transport belt 1 is manufactured, the surface of the strip-shaped sheet 10 in the first region does not protrude beyond the surface of the strip-shaped sheet 10 in the second region. Therefore, when the transport belt 1 is wound around the reel, the cover tape 20 and the transport belt 1 can be prevented from being scratched, and the electronic component 40 is not damaged.

段差部18的底部,與第2區域之帶狀片材10的表面之間的高低差,宜為0.05mm以下,更宜為0.03mm以下。因為這種高低差極小,故可使第1面15為約略平坦的態樣。因此,即使將運送帶1捲繞於捲筒,亦不會使覆蓋膠帶20及運送帶1產生刮痕,且電子零件40亦無破損的情況。另外,這種高低差,在運送帶1製造時,會在第1區域中提供了間隙,使得第1區域之帶狀片材10的表面不會比第2區域之帶狀片材10的表面突出。在將運送帶1捲繞至捲筒時,因為運送帶1的彎曲及該間隙,使第2區域及覆蓋膠帶20更加密合。因此,可在運送帶1捲繞至捲筒時,提升凹部12的密閉性。 The height difference between the bottom of the step portion 18 and the surface of the strip-shaped sheet 10 of the second region is preferably 0.05 mm or less, more preferably 0.03 mm or less. Since this height difference is extremely small, the first surface 15 can be made to be approximately flat. Therefore, even if the transport belt 1 is wound around the reel, the cover tape 20 and the transport belt 1 are not scratched, and the electronic component 40 is not damaged. Further, such a height difference provides a gap in the first region when the transport belt 1 is manufactured, so that the surface of the strip-shaped sheet 10 of the first region is not more than the surface of the strip-shaped sheet 10 of the second region. protruding. When the conveyor belt 1 is wound up to the reel, the second region and the cover tape 20 are more encrypted due to the bending of the conveyor belt 1 and the gap. Therefore, the airtightness of the recessed portion 12 can be improved when the transport belt 1 is wound up to the reel.

運送帶1中,段差部18於俯視的大小,係由凹部12彼此之間的間隔決定。本實施態樣中,段差部18,如圖36所示,係以既定的大小形成。然而,亦可 與凹部12彼此之間的間隔相依,段差部18的大小,亦可如圖37所示,設定為大於圖36之段差部18的大小(第5實施態樣)。另外,段差部18的大小,亦可如圖38所示,設定為小於圖36之段差部18的大小(第6實施態樣)。 In the transport belt 1, the size of the step portion 18 in plan view is determined by the interval between the recesses 12. In the present embodiment, the step portion 18 is formed to have a predetermined size as shown in FIG. However, it can also The size of the step portion 18 depends on the interval between the concave portions 12, and may be larger than the size of the step portion 18 of Fig. 36 as shown in Fig. 37 (the fifth embodiment). Further, the size of the step portion 18 may be set smaller than the size of the step portion 18 of Fig. 36 as shown in Fig. 38 (the sixth embodiment).

<其他實施態樣> <Other implementations>

接著,就本發明之運送帶之製造方法的其他實施態樣進行說明。本發明之運送帶之製造方法,並不限於第1實施態樣,亦可不包含如圖18所示的第2實施態樣之後段冷卻滾筒130、140,亦可如圖19的第3實施態樣,僅包含一個後段冷卻滾筒130。另外,本發明的運送帶之製造方法,如圖20所示的第4實施態樣,亦可將後段冷卻滾筒130設置於滾筒狀模具200之下。 Next, another embodiment of the method of manufacturing the conveyor belt of the present invention will be described. The method for manufacturing the transport belt of the present invention is not limited to the first embodiment, and may not include the second stage cooling drums 130 and 140 as shown in FIG. 18, or may be the third embodiment of FIG. As such, only one rear stage cooling drum 130 is included. Further, in the method of manufacturing the transport belt of the present invention, as in the fourth embodiment shown in FIG. 20, the rear stage cooling drum 130 may be provided below the drum-shaped mold 200.

另外,本發明的運送帶之製造方法,亦可如圖21所示的第5實施態樣,可在以接觸滾筒110與冷卻滾筒120一度使第2面162平坦化之後,在後段冷卻滾筒130以成形模具200進行凹部161的成形。另外,本發明的運送帶之製造方法,亦可如圖22所示的第6實施態樣,在接觸滾筒110側使用成形模具200,以進行凹部161的成形。更進一步,本發明的運送帶之製造方法,亦可如圖23~圖26所示的第7~10實施態樣,藉由包含兩個接觸滾筒110、170,更提昇第2面162之平坦性。 Further, in the method of manufacturing the transport belt of the present invention, as in the fifth embodiment shown in FIG. 21, after the second surface 162 is once planarized by the contact roller 110 and the cooling drum 120, the drum 130 is cooled in the rear stage. The forming of the concave portion 161 is performed by the molding die 200. Further, in the method of manufacturing the transport belt of the present invention, as in the sixth embodiment shown in Fig. 22, the molding die 200 may be used on the side of the contact roller 110 to form the concave portion 161. Further, in the method of manufacturing the transport belt of the present invention, as shown in the seventh to tenth embodiments shown in FIGS. 23 to 26, the flat surface of the second surface 162 can be further raised by including the two contact rollers 110 and 170. Sex.

另外,本發明的運送帶之製造方法,亦可如圖27所示的第11實施態樣,在接觸滾筒170使用平坦的無縫皮帶(seamless belt)300,以更提昇第2面162的平坦性。另外,本發明的運送帶之製造方法,亦可如圖28所示的第12實施態樣,在接觸滾筒110、170使用形成模具的無縫皮帶310,以進行凹部161的成形。 Further, in the method of manufacturing the transport belt of the present invention, as in the eleventh embodiment shown in Fig. 27, a flat seamless belt 300 may be used in the contact roller 170 to further improve the flatness of the second surface 162. Sex. Further, in the method of manufacturing the transport belt of the present invention, as in the twelfth embodiment shown in Fig. 28, the seamless belt 310 forming the mold may be used for the contact rollers 110 and 170 to form the concave portion 161.

更進一步,本發明的運送帶之製造方法,亦可如圖29所示的第13實施態樣,於接觸滾筒110、170、180使用平坦的無縫皮帶300,並於冷卻滾筒120、130使用形成模具的無縫皮帶310,以同時進行凹部161之成形及第2面162的平坦化。另外,該等接觸滾筒110、170、180及冷卻滾筒120,並非僅以90度或180度的位置,與鄰接的接觸滾筒及冷卻滾筒等相對地配置,係可為可動 式,以各種角度與鄰接之接觸滾筒及冷卻滾筒相對地配置。 Further, in the method of manufacturing the transport belt of the present invention, as in the thirteenth embodiment shown in Fig. 29, a flat seamless belt 300 may be used for the contact rollers 110, 170, 180, and the cooling drums 120, 130 may be used. The seamless belt 310 forming the mold simultaneously forms the concave portion 161 and planarizes the second surface 162. Further, the contact rollers 110, 170, and 180 and the cooling drum 120 are not disposed at a position of 90 degrees or 180 degrees, but are arranged to face the adjacent contact roller, the cooling roller, or the like, and are movable. The configuration is disposed opposite to the adjacent contact roller and the cooling roller at various angles.

如上所述,雖以幾個實施態樣對本發明進行說明,但本發明並非係限定於該等實施態樣者。 As described above, the present invention has been described in terms of several embodiments, but the present invention is not limited to the embodiments.

1‧‧‧運送帶 1‧‧‧Transportation belt

10‧‧‧片材 10‧‧‧Sheet

11‧‧‧打孔 11‧‧‧ Punch

12‧‧‧凹部 12‧‧‧ recess

14‧‧‧端部 14‧‧‧ End

20‧‧‧覆蓋膠帶 20‧‧‧ Cover tape

40‧‧‧電子零件 40‧‧‧Electronic parts

Claims (13)

一種電子零件收納用運送帶,係由樹脂所製成,具有帶狀片材,及沿該帶狀片材的長邊方向配置的複數凹部,其特徵為:該帶狀片材,具有第1面及與該第1面相反側的第2面;該複數凹部,形成於該帶狀片材的該第1面;該帶狀片材的該第2面大致平坦;該複數凹部的端部,以曲率半徑為0.2mm以下而彎曲。 A conveyor belt for electronic component storage, which is made of a resin, has a belt-shaped sheet, and a plurality of concave portions arranged along the longitudinal direction of the belt-shaped sheet, wherein the belt-shaped sheet has the first a surface and a second surface opposite to the first surface; the plurality of recesses being formed on the first surface of the strip-shaped sheet; the second surface of the strip-shaped sheet being substantially flat; and the end of the plurality of recesses Bending with a radius of curvature of 0.2 mm or less. 如申請專利範圍第1項之電子零件收納用運送帶,其中,假定各該複數凹部之深度為A(mm),該凹部之底部的該帶狀片材的厚度為B(mm),該凹部以外之部分的該帶狀片材的厚度為C(mm)時,則大致滿足A+B=C。 The conveyor belt for electronic component storage according to the first aspect of the invention, wherein the depth of each of the plurality of recesses is A (mm), and the thickness of the strip-shaped sheet at the bottom of the recess is B (mm), the recess When the thickness of the strip-shaped sheet other than the portion is C (mm), it substantially satisfies A + B = C. 如申請專利範圍第1或2項之電子零件收納用運送帶,其中,假定各該複數凹部的深度為A(mm),該凹部底部之該帶狀片材的厚度為B(mm),該凹部以外之部分的該帶狀片材的厚度為C(mm)時,則滿足-0.1<C-(A+B)<0.1。 The conveyor belt for electronic component storage according to claim 1 or 2, wherein the depth of each of the plurality of recesses is A (mm), and the thickness of the strip-shaped sheet at the bottom of the recess is B (mm). When the thickness of the strip-shaped sheet other than the concave portion is C (mm), -0.1 < C - (A + B) < 0.1 is satisfied. 如申請專利範圍第1或2項之電子零件收納用運送帶,其中,以使該第2面與芯材對向的方式,將該運送帶捲繞於該芯材,該芯材的直徑為5~300mm。 The conveyor belt for electronic component storage according to the first or second aspect of the invention, wherein the conveyor belt is wound around the core material so that the second surface faces the core material, and the diameter of the core material is 5~300mm. 一種電子零件收納用運送帶之製造方法,係申請專利範圍第1~4中任一項之電子零件收納用運送帶的製造方法,其特徵為:該製造方法,包含製膜步驟,係以擠製成形法製作該帶狀片材。 A method of manufacturing an electronic component storage conveyor belt according to any one of claims 1 to 4, wherein the manufacturing method includes a film forming step The strip-shaped sheet was produced by a molding method. 如申請專利範圍第5項之電子零件收納用運送帶之製造方法,其中更包含:成形步驟,係在該製膜步驟之後,於該帶狀片材的該第1面形成該複數凹部。 The method for producing an electronic component storage conveyance belt according to claim 5, further comprising: a molding step of forming the plurality of concave portions on the first surface of the strip-shaped sheet after the film forming step. 如申請專利範圍第6項之電子零件收納用運送帶之製造方法,其中,該成形步驟,係使用具有用以使該複數凹部成形之突起物的模具來進行。 The method of manufacturing a conveyor belt for storing an electronic component according to the sixth aspect of the invention, wherein the molding step is performed by using a mold having a projection for molding the plurality of recesses. 如申請專利範圍第7項之電子零件收納用運送帶之製造方法,其中,該成形步驟,係使用滾筒狀模具來進行,其外周面上形成1個以上的用以使該複數凹部成形的該突起物。 The manufacturing method of the electronic component storage conveyance belt of the seventh aspect of the invention, wherein the molding step is performed using a roll-shaped mold, and one or more of the outer peripheral surfaces are formed to form the plurality of concave portions. Protrusions. 如申請專利範圍第6~8項中任一項之電子零件收納用運送帶之製造方法,其中,該成形步驟,包含使該帶狀片材的該第2面平坦化的步驟。 The method for producing an electronic component storage conveyance belt according to any one of claims 6 to 8, wherein the molding step includes a step of flattening the second surface of the strip-shaped sheet. 如申請專利範圍第9項之電子零件收納用運送帶之製造方法,其中,該成形步驟,係以使該帶狀片材之該第2面平坦化的接觸滾筒來進行。 The manufacturing method of the electronic component storage conveyance belt of the ninth aspect of the invention, wherein the molding step is performed by a contact roller that planarizes the second surface of the strip-shaped sheet. 如申請專利範圍第6~10項中任一項之電子零件收納用運送帶之製造方法,其中更包含:冷卻步驟,在該成形步驟後使該帶狀片材冷卻。 The method for producing an electronic component storage conveyor belt according to any one of claims 6 to 10, further comprising a cooling step of cooling the strip-shaped sheet after the forming step. 如申請專利範圍第11項之電子零件收納用運送帶之製造方法,其中,該冷卻步驟,係使用冷卻滾筒來進行。 The method of manufacturing an electronic component storage conveyor belt according to the eleventh aspect of the invention, wherein the cooling step is performed using a cooling drum. 一種包裝體,其特徵為包含:申請專利範圍第1~4項中任一項之電子零件收納用運送帶;及頂端覆蓋膠帶,在將電子零件收納於該複數凹部內的狀態下,密封該複數凹部的開口。 A package comprising: the electronic component storage transport belt according to any one of claims 1 to 4; and a top cover tape, wherein the electronic component is housed in the plurality of recesses, and the sealed The opening of the plurality of recesses.
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