JP2001097311A - Embossed tape manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an embossed tape manufacturing device which manufactures an embossed tape having narrow partitions between housing dents precisely and stably by employing a pitch transfer molding method using flat metallic molds. SOLUTION: For an embossed tape manufacturing device which is composed of each one pair of upper and lower heating plates and upper and lower molding metallic molds and holds a belt-like sheet at a distance of one pitch corresponding to the entire length of the molding metallic mold with the paired upper and lower heating plates and also forms housing dents with pressure applied by the molding metallic molds while the heated belt-like sheet is moved by pitch transfer, the heating plates and the molding metallic molds are combined diagonally so that both of the members can be easily brought close together without being in contact with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an embossed tape manufacturing apparatus. More specifically, the present invention relates to an embossed tape manufacturing apparatus capable of accurately and stably manufacturing an embossed tape having a narrow partition wall between storage recesses.

[0002]

2. Description of the Related Art An embossed tape used for storing various electronic parts such as semiconductors and precision equipment parts is called a carrier tape, and as shown in FIG. After the parts are stored in the storage recesses, the cover member 4 is sealed and used. A partition 5 is formed between two adjacent storage recesses. Such an embossed tape has been conventionally produced by thermoforming using a flat plate mold. FIG. 2 is a schematic view of an example of a conventional embossed tape manufacturing apparatus. In the embossed tape manufacturing apparatus, the belt-shaped sheet 6 is unwound from the unwinding roll 7,
The fixed chucks 8 and 9 and the movable chucks 10 and 11 perform pitch transfer with a length corresponding to the entire length of the mold as one pitch. The belt-shaped sheet is heated to a molding temperature by a pair of upper and lower hot plates 12, transferred to a mold 13 at a pitch, a storage recess is formed by thermoforming, a feed hole is punched in a punch die 14, and finally wound up. It is wound on a roll 15. FIG. 3 is an explanatory view showing a hot platen part and a mold part of the apparatus shown in FIG. 2. FIG. 3 (a) shows a state in which the mold is opened and a heated strip-shaped sheet is pitch-transferred into the mold. FIG. 3 (b) shows a state in which the mold is closed and the storage recess is formed by air pressure molding.

In recent years, as electronic components have become more highly integrated and miniaturized, embossed tapes have also become narrower, smaller pockets, and shorter pocket pitches. In the production of the embossed tape, it can be produced mainly by a wide-width and medium-width tape of 16 mm or more, and a pitch-transfer-type apparatus provided with a flat mold shown in FIG. However, 12
The embossed tape having a small width such as 8 mm or 8 mm has a tendency that the partition wall 5 between the adjacent recessed portions tends to be narrow. Particularly, the molding continuity of the narrow inter-rib pocket is impaired. That is, the rib 16 at the rear end of the mold is
If the thickness of the heat plate is reduced, the strength of the mold will be insufficient. When the mold is closed, or when the mold is cooled by the mold, the partition wall at the pitch may have poor molding or a trace of the joint may be formed, so that it is difficult to obtain a beautiful embossed tape. In addition, since the mold and the hot plate are moved up and down by different drive systems, there is a problem that a step and a displacement are apt to occur. For this purpose, embossed tapes having a narrow partition wall are manufactured by continuously forming storage recesses using a rotary cylindrical mold. In the cylindrical mold method, the belt-shaped sheet is heated to a molding temperature by hot air or a heating drum, and is continuously transferred to a cylindrical mold provided with a concave portion forming a storage concave portion on the outer peripheral portion, mainly by vacuum forming. This forms a storage recess. However, the cylindrical mold is more expensive than the flat mold because of its complicated structure, has a long delivery time, and is not suitable for high-mix low-volume production. Furthermore, in the case of vacuum forming, since the belt-shaped sheet needs to be heated to a high temperature, there is a problem that defects such as twisting are likely to occur. Under such circumstances, there has been a demand for a method and an apparatus capable of manufacturing an embossed tape having a narrow partition by a pitch transfer method using a flat plate mold.

[0004]

SUMMARY OF THE INVENTION According to the present invention, an embossed tape having a narrow partition wall between storage recesses can be formed by a pitch transfer method using a flat plate mold without forming defects at the pitch joint portions, thereby improving the molding continuity. It is an object of the present invention to provide an embossed tape manufacturing apparatus which can be manufactured accurately and stably.

[0005]

The present invention comprises a pair of upper and lower hot plates and a molding die, and a pair of upper and lower hot plates holds a band-shaped sheet by one pitch corresponding to the entire length of the molding die. An embossed tape manufacturing apparatus in which a heated plate and a forming mold are combined obliquely in a manufacturing apparatus of an embossed tape in which a heated recessed sheet is pitch-transferred and pressure is applied in a forming mold to form a storage recess. It is. As a preferred embodiment,
This is an embossed tape manufacturing apparatus in which the hot platen and the molding die are fixed to the same detachable unit via a heat insulating material, combined together outside the molding apparatus, and then attached to a molding machine. As a further preferred embodiment, the embossed tape manufacturing apparatus for applying pressure to the belt-shaped sheet by compressed air, wherein the mold is a concave mold having a shape corresponding to the storage recess,
The mold is a convex mold having a shape corresponding to the storage recess, the embossed tape manufacturing apparatus for applying pressure to the belt-shaped sheet by pressurized air, the mold is a concave mold having a shape corresponding to the storage recess, vacuum An apparatus for manufacturing the embossed tape for applying pressure to a belt-shaped sheet.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embossed tape according to the present invention is a strip-shaped tape in which storage recesses are formed at equal intervals in the longitudinal direction by thermoforming, and is used for storing various electronic parts such as semiconductors and precision mechanical parts. It can be used as a carrier tape or the like. The embossed tape manufacturing apparatus of the present invention comprises a pair of upper and lower hot plates and a molding die, and a pair of upper and lower hot plates converts a band-shaped sheet to the entire length of the forming die.
Combining a hot plate and a molding die in an oblique manner in an embossed tape manufacturing device that forms a storage recess by holding the pitch and transferring the heated band-like sheet at a pitch and applying pressure in the molding die By doing so, they can be easily approached without contacting each other. In the embossed tape manufacturing apparatus of the present invention, the hot platen and the molding die are fixed to the same removable unit via a heat insulating material, and are combined together outside the molding apparatus, and then attached to the molding machine. It is possible. FIG. 4 is a schematic view showing a positional relationship between a molding die and a hot plate in the present invention. In the state shown in FIG. 4A, the mold 13 is opened, the set of hot plates 12 is opened, and the belt-shaped sheet 6 moves. In the state shown in FIG. 4B, the mold 13 is closed, and the set of hot plates 12 is also closed to form and heat the belt-shaped sheet. In the shape having a taper on the lower platen side of the molding die and the mold side of the lower platen respectively,
I try to combine them. It is also possible to reinforce the mold by combining the molding mold and the hot plate in an oblique shape, for example, by giving a thickness to a portion of the molding mold below the rib bevels. The adjacent lower heating plate also has a beveled (wedge-shaped) shape, the mold and the heating plate are kept at a distance capable of insulating each other, and the top of the rib is kept as close as possible.

[0007]

According to the embossed tape manufacturing apparatus of the present invention, in thermoforming in which intermittent pitch transfer is performed using a flat plate mold, the partition walls between the storage recesses are narrow, particularly 1 mm or less or 0.5 mm or less. Even with a certain embossed tape, without forming defects at the joint between the pitches,
Stable molding can be easily and continuously performed in a wide range of molding conditions without requiring skilled adjustment. In addition, when the mold end rib is narrow, it is possible to manufacture the mold with a thickness below the bevel, and the strength of the mold is improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an embossed tape used for storing electronic components and the like.

FIG. 2 is a schematic view of an example of a conventional embossed tape manufacturing apparatus.

FIG. 3 is an explanatory view showing a hot platen part and a mold part of the apparatus of FIG. 2;

FIG. 4 is a schematic diagram showing a positional relationship between a mold and a hot plate in the present invention.

[Explanation of symbols]

 1. 1. Band-shaped sheet Storage recess 3. Sprocket holes 4. Cover material 5. Partition wall 6. 6. Strip-shaped sheet Unwinding roll 8. Fixed chuck 9. Fixed chuck 10. Moving chuck 11. Moving chuck 12. Hot plate 13. Mold 14. Punch die 15. Take-up roll 16. rib

Claims (2)

[Claims] 1. A pair of upper and lower hot plates and a molding die, and a pair of upper and lower hot plates form a belt-shaped sheet corresponding to the entire length of a forming die.
Combining a hot plate and a molding die in an oblique manner in an embossed tape manufacturing device that forms a storage recess by holding the pitch and transferring the heated band-like sheet at a pitch and applying pressure in the molding die An embossed tape manufacturing apparatus. 2. The embossed tape manufacturing apparatus according to claim 1, wherein the hot platen and the molding die are fixed to the same removable unit via a heat insulating material, and are combined integrally outside the molding device. , Embossed tape manufacturing equipment to be attached to molding machines.