JPH02109830A - Device for molding carrier tape for installing electronic part - Google Patents

Abstract

PURPOSE:To reduce accumulated error with respect to arrangement pitch of a storing portion by a method wherein a material tape is continuously fed while being interposed between a heating drum and a molding drum and deformed by compressed air so that it is welded onto an inner surface of a molding cavity provided on the molding drum side. CONSTITUTION:A material tape 1 is fed while being in contact with a peripheral surface of a heating drum 31 and then fed along a peripheral surface of a molding drum 32. The heated and softened material tape 1 is interposed between the heating drum 31 and the molding drum 32. When one of exhaust ports 39 of compressed air faces a corresponding molding cavity 44 with the material tape 1 in-between, compressed air is exhausted from the compressed air exhaust port 39. A predetermined portion of the heated and softened material tape 1 is deformed so that it contacts tightly with an inner face of the molding cavity 44 to have a storage portion 12 molded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a molding device for a carrier tape for storing electronic components, and in particular, the present invention relates to a molding device for a carrier tape for storing electronic components, and in particular, a molding device in which the storage portion is formed by thermoforming a heat r+1 plastic resin sheet. The present invention relates to a molding device for carrier tape.

[Prior art and its problems] In order to facilitate the handling of small electronic components, such as chip-shaped electronic components, it has conventionally been possible to hold a plurality of electronic components on a carrier tape. It is being done. In such a carrier tape, storage portions for accommodating electronic components are formed at equal intervals in the longitudinal direction.

As one type of carrier tape for storing electronic components as described above, a material tape made of a thermoplastic resin sheet is used to form four parts (convex parts when viewed from the opposite side) by thermoforming, and these four parts are used as a storage part. There is something like that. Conventionally, methods for forming this type of carrier tape include drawing forming shown in FIGS. 7 and 8, and drawing forming shown in FIGS. 9 and 1.
Vacuum forming shown in Figure 0 and Figures 11 and 12
There were various methods of flat plate pressure forming shown in the figure.

In drawing forming, as shown in FIG. 7, the material tape 1 is
The feed device 2 intermittently feeds the paper in the direction indicated by the arrow. As a result, after passing through the preheating section 3, the material tape 1 is supplied to the press section 4 every predetermined length.

In the press section 4, while the feeding of the material tape 1 is stopped, the following operations proceed. First, the upper mold 5 and the lower mold 6 approach each other relatively with the material tape 1 in between. Accordingly, as shown in FIG.
The holding plate 8 held by the presser plate 8 clamps the material tape 1 between it and a die 9 provided in the lower die 6. In this state,
The material tape 1 is heated and softened. The upper die 5 is further lowered, whereby the punch 10 provided in the upper die 5 is pushed into the molding cavity 11 provided in the die 9.

As a result, the housing portion 12 is formed in the material tape 1. When such an operation is completed, the upper die 5 and the lower die 6 are relatively separated, and the material tape 1 is fed by the next predetermined length. Then, the above operation is repeated.

However, the drawing method shown in FIGS. 7 and 8 has the following problems. First, since the material tape 1 is fed intermittently, errors in the arrangement pitch of the housing portions 12 formed on the material tape 1 tend to accumulate. In addition, the shapes of the bunch 10 and the die 9, especially the molding cavity 11, the radius of the corner portion, the surface ↑It, the clearance between each other, etc. affect the molding of the storage portion 12. It is easy to remove and quality maintenance is difficult.

Next, in vacuum forming, as shown in FIG. 9, the material tape 1 is in contact with the circumferential surfaces of the two heating drums 13 and 14 and the forming drum 15, for example, as shown by the arrows in FIG. The heating drums 13 and 14 and the forming drum 15 are rotated in a predetermined direction, thereby being continuously fed. The molding drum 15 is provided with a plurality of molding cavities 16 that are open on its circumferential surface and distributed at equal intervals in the circumferential direction. Each molding cavity 16
As shown in an enlarged view in FIG. 10, a suction passage 17 is provided for applying a vacuum inside the molding cavity 16.

Therefore, the material tape 1 is heated by the heating drums 13 and 1.
When it comes into contact with the circumferential surface of the molding drum 15, it is heated and softened, and in that state it is placed on the circumferential surface of the forming drum 15. The material tape 1 is deformed by the vacuum applied to the molding cavity 16 through the suction passage 17 so as to come into close contact with the inner surface of the molding cavity 16, whereby the housing portion 12 is molded into the material tape 1. .

However, the vacuum forming method described above has the following problems. The design and machining of the molding cavity 16 and especially the suction channel 17 in the molding drum 15 is not easy. Furthermore, since the housing portion 12 is formed using vacuum force, it is necessary to increase the heating temperature applied to soften the material tape 1. Therefore, after the housing portion 12 is formed, the material tape 1 deforms significantly when it is cooled.

Additionally, the amount of power consumed by a heater (not shown) for performing such heating increases, resulting in a cost-storage knob.

Next, in flat plate pressure forming, the material tape 1 is intermittently fed by a feeding device 18 in the direction indicated by the arrow in FIG. As a result, the material tape 1 heated and softened in the heating section 19 is transferred to the forming section 2 for each predetermined length.
0. In the molding section 20, a flat plate 21 and a die 22 are arranged so as to sandwich the material tape 1 therebetween. The flat plate 21 is provided with a plurality of compressed air discharge ports 23 for discharging compressed air. On the other hand, the die 22 is provided with a plurality of molding cavities 24 corresponding to each of the compressed air discharge ports 23 described above.

While feeding of the material tape 1 by the feeding device 18 is stopped, the following operation proceeds. First, the deck 21 and the die 22 are brought relatively close to each other, and the material tape 1 is clamped between them, as shown in FIG. Next, compressed air is discharged from the compressed air discharge port 23. In response to this, a predetermined region of the material tape 1 is pressed against the inner surface of the molding cavity 24, thereby molding the storage portion 12.

When the molding of the housing portion 12 is completed, the flat plate 21 and the die 22 are relatively separated, and the material tape 1 is intermittently fed by the next predetermined length.

Such deck-type pressure forming allows molding at low temperatures with good reproducibility of the shape of the molded storage section 12,
There are advantages such as a shorter molding cycle, but the disadvantage is that errors in the arrangement pitch of the storage portions 12 tend to accumulate because the material tape 1 is fed intermittently, as in the case of drawing forming mentioned earlier. There is.

[Problems to be Solved by the Invention] Therefore, the present invention provides a carrier tape for storing electronic components that can reduce the accumulation of pitch errors in the storage portion while maintaining the above-mentioned advantages of flat plate pressure forming. The present invention aims to provide a molding device.

[Means for Solving the Problems] The present invention provides a carrier tape for storing electronic components, which is made of a thermoplastic resin sheet, in which storage portions for storing electronic components are formed at equal intervals of 6i in the longitudinal direction. It is intended for devices that mold material tapes, and to put it simply, while continuously feeding the material tape,
They decided to use pressure forming.

More specifically, the molding apparatus according to the present invention includes (a)
By rotating the material tape around its axis while contacting the material tape on the peripheral surface, the material tape is heated and softened and sent in the longitudinal direction, and a plurality of compressed air discharge ports opened on the peripheral surface are (b) heating drums arranged at equal intervals in a circumferential direction; A plurality of molding cavities are positioned so as to sandwich the material tape, and are open on the circumferential surface thereof and have a shape corresponding to the outer surface shape of the storage portion, corresponding to the pitch of the compressed air outlet. minutes with the pitch of
(c) from the compressed air outlet, when the compressed air outlet faces the corresponding molding cavity with the cable tape in between; It is characterized by the fact that compressed air is discharged.

[Function] In the molding apparatus according to the present invention, the heating drum and the molding drum each rotate continuously. The material tape is continuously fed from the heating drum to the forming drum while being sandwiched between the heating drum and the forming drum. When the material tape that has been heated and softened on the heating drum passes through the area sandwiched between the heating drum and the forming drum, the material tape is heated and softened on the forming drum side by compressed air discharged from the compressed air outlet provided on the heating drum side. It is deformed so as to fit tightly into the inner surface of the molding cavity provided in the molding cavity, thereby
A storage section is formed.

[Effects of the Invention] According to the present invention, the material tape is continuously fed, and the storage portions are sequentially formed while the material tape is being fed continuously, so that the storage portions are formed while the material tape is being fed intermittently. Compared to the case of molding, the cumulative error in the arrangement pitch of the storage parts can be reduced. In this specific carrier tape, the cumulative pitch error could be reduced to 0.1 mm or less for a tape length of 40 mm.

Furthermore, since continuous feeding and shaping are applied to the material tape as described above, the production speed of the carrier tape can be increased. - As an example, 1.5111/
It is possible to produce carrier tapes at speeds of minutes.

In addition, compared to the draw forming shown in FIGS. 7 and 8 or the vacuum forming shown in FIGS. It is superior in terms of type 111 compared to . Moreover, cloudiness does not occur in the molded product. Furthermore, compared to the vacuum forming shown in FIGS. 9 and 10, there is no need to increase the heating temperature of the material tape so much. Therefore, when the carrier tape is molded and then cooled, the deformation is not so large, and the amount of power consumed by the heater is not so large.

Embodiment] FIG. 1 is a schematic diagram showing an entire IC device according to an embodiment of the present invention.

Referring to FIG. 1, a rolled material tape 1 is pulled out in the direction indicated by the arrow, and is continuously fed and guided to various locations by various rollers and the like. Regarding the main elements that add 6t to this molding equipment, the material tape 1
To explain along this route, the material tape 1 is first fed while being in contact with the circumferential surface of the heating drum 31, and then fed along the circumferential surface of the forming drum 32. After that, the raw tape 1 is cut into a cutting die 33, a guide 34, and a slitter 35.
After that, the desired carrier tape is obtained. The fired material 54 formed after passing through the slitter 35 is received in a waste material receiving box 36.

The heating drum 31 and forming drum 32 are shown enlarged in FIG. Further, the portion where the heating drum 31 and the forming drum 32 abut against each other is shown further enlarged in FIG.

The heating drum 31 feeds the material tape 1 in its longitudinal direction by rotating around its axis in the direction shown by an arrow 38 while bringing the material tape 1 into contact with its peripheral surface 37. The heating drum 31 has a built-in heater 41a, whereby the material tape 1 is heated and softened.

The heating drum 31 is provided with a plurality of compressed air discharge ports 39 that are open on the circumferential surface 37 and distributed at equal intervals in the circumferential direction. Each compressed air outlet 39 is provided with a compressed air inlet 40 in communication with it.

As schematically shown in FIG. 2, another heater 41b may be provided opposite the circumferential surface 37 of the heating drum 31. Due to the presence of this heater 41b, the material tape 1 is heated from both sides simultaneously, so that the time for heating the material tape 1 can be shortened and the heating temperature can be kept low.

The forming drum 2 is rotated parallel to the axis of the heating drum 31 and in the opposite direction, that is, in the direction of the arrow 42Jj.

The circumferential surface 43 of the forming drum 32 is the same as the circumferential surface 3 of the heating drum 31.
7. ! : are positioned so as to sandwich the material tape 1 at 111. Further, the molding drum 32 is provided with a plurality of molding cavities 44 that open on its peripheral surface 43 so as to have a pitch corresponding to the distribution pitch of the three compressed air discharge ports described above. Each molding cavity 44
H indicates a shape corresponding to the outer surface shape of the storage portion to be formed in the carrier tape to be obtained. Further, an air escape hole 45 is provided in the inner bottom surface of each molding cavity 44, and this air escape hole 4c5 is guided by the side force of the molding drum 32.

The operations accomplished by heating drum 31 and forming drum 32 will now be described with reference to FIGS. 1-3.

The material tape 1 is heated and softened while being placed on the circumferential surface 37 of the heating drum 31. In addition, such heating conditions are applied to the material tape 1 by a temperature sensor and a temperature regulator (not shown) installed in the heating drum 31. This can be adjusted by changing the heating temperature, the rotational speed of the heating drum 31, and the heating time applied to the material tape 1. The raw tape 1 heated and softened in this way is, as clearly shown in FIG.
It is sandwiched between a heating drum 31 and a forming drum 32.

When the three compressed air outlets face the χ·l molding cavity 44 with the material tape 1 in between, compressed air is discharged from the compressed air outlet 39. Accordingly, a predetermined portion of the heat-softened material tape 1 is deformed so as to come into close contact with the inner surface of the molding cavity 44, thereby causing the storage portion 12 (FIGS. 1 and 4
6) are molded. Note that, as described above, the compressed air discharge port 39 and the corresponding molding cavity 44 are λ
・! Various well-known methods can be used to discharge compressed air from the three compressed air discharge ports when the heating drum 31 is oriented in the opposite direction. When this sensor detects a predetermined angle, compressed air is sent to a predetermined compressed air outlet 39 (jl
;You should just give it to them. In this way, by discharging compressed air from the compressed air discharge ports 39 only when three specific compressed air discharge ports face the corresponding molding cavities 44, it is possible to discharge compressed air from the compressed air discharge ports 39 only when three specific compressed air discharge ports face the corresponding molding cavities 44. 61' where no air leakage occurs from the compressed air outlet 39 and which is not yet facing the molding cavity 44;
Undesirable deformation of the material tape 1 due to compressed air is prevented in one region.

The material tape 1 in which the storage portion 12 is formed as described above is
A peripheral surface 43 of the forming drum 32 away from the heating drum 31
move on top. In order to smoothly peel off the material tape 1 from the heating drum 31, it is preferable that the peripheral surface 37 of the heating drum 31 be surface-treated.

Note that the molding cavity 44 corresponding to the compressed air outlet 39
It is desirable to be able to adjust the mutual positional relationship between the two. Therefore, in this embodiment, as shown in FIG. 2, the heating drum 31 is mounted on a Y-direction table 46, while the forming drum 32 is mounted on an Installed. The Y-direction table 46 can be adjusted in the Y direction by 2'J, and the X-direction table 47 can be adjusted in the X direction by i+J.

Therefore, if such a configuration is adopted, the specific compressed air outlet 39 and the corresponding molding cavity 44
The relative positional relationship between the heating drum 31 and the forming drum 32 can be adjusted in four directions, and the gap 48 between the heating drum 31 and the forming drum 32 (Fig. 3) can be adjusted.
It is possible to adjust the size of the image.

In this embodiment, for example, as shown in FIG.
Therefore, the material tape 1 that has passed through the forming drum 32 and completed the forming of the storage section 12 is as shown in FIGS. 4 to 6. The form is (4).

In particular, as shown on the left side of FIGS. 4 and 5 and in FIG.
Due to the presence of , a bulge 40 is formed. This bulge 4
It is preferable that 9 does not exist, so the cutting die 33
(FIG. 1), such a bulging portion 49 is removed. That is, the bulging portion 49 is cut out by the cutting die 33.
6rt area containing the water is removed by forming bottom water 50. The state in which such bottom water 50 is formed is the fourth state.
The right side of each figure and FIG.

The cutting die 43 simultaneously forms the bottom water 50 and the feed hole 51.
The formation is carried out by punching.

The material tape 1 is positioned in the cutting die 33 as described above by using the positioning hole 52 that receives the outer shape of the storage section 12.
This can be done by providing a hole on the side of the cutting die 33 and inserting the receiving portion 12 into the positioning hole 52.

Material tape 1 after forming bottom water 50 and feed holes 51
is supplied to the slitter 35 through the storage portion 12 while being positioned in the width direction by the guide 34. The slitter 35 cuts the carrier tape along a cutting line 53 as shown by a dashed line in FIG. 4 to obtain several carrier tapes of a predetermined width. These obtained carrier tapes are respectively wound onto reels (not shown). On the other hand, the waste material 5 generated when passing through the slitter 35
4, the pottery container is placed in the box 36.

Although the invention has been described above in connection with the illustrated embodiments, several modifications are possible within the scope of the invention.

For example, in FIG. 1, the elements after the cutting die 33 are not essential to the present invention.

For example, depending on the manner in which the air escape hole 45 provided in communication with the first molded cavity 44 is formed, the bulging portion 49 can be conveniently prevented from being formed. Also, the raw material (4) supplied to the heating drum 31 and the forming tram 2 is
If the width of the tape 1 is selected to be equal to the width of the desired carrier tape, the slitter 35 is not particularly required.

Furthermore, as long as the compressed air discharge ports 39 and the molding cavities 44 are provided with pitches corresponding to each other, the respective diameters of the heating drum 31 and the molding tram 32 may be different from each other. 39 and the number of mold cavities 44 may be different from each other.

[Brief explanation of the drawing]

FIG. 1 is a front view schematically showing the entire molding apparatus as an embodiment of the present invention. FIG. 2 shows a heating drum 31 and a forming drum 3 included in the forming apparatus shown in FIG.
FIG. 2 is an enlarged front view of FIG. FIG. 3 is a front view showing a further enlarged view of opposing portions of the heating drum 31 and forming tram 32 shown in FIG. FIG. 4 is an IL side view of the material tape 1 in the middle of being processed by the cutting die 33 shown in FIG. FIG. 5 is a sectional view taken along line V--■ in FIG. 4. Figure 6 shows the line Vl in Figure 4.
- It is a sectional view along Vl. FIG. 7 is a front view showing a conventional drawing device. FIG. 8 is an enlarged sectional view showing the main part of the press section 4 shown in FIG. 7. FIG. FIG. 9 is a front view showing a conventional vacuum forming apparatus. FIG. 10 is an enlarged sectional view showing the main part of the forming drum 15 shown in FIG. 9. FIG. FIG. 11 is a front view showing a conventional deck type pressure forming apparatus. FIG. 12 is an enlarged sectional view showing the main part of the molding section 20 shown in FIG. 11. FIG. In the figure, 1 is a material tape, 12 is a storage section, 31 is a heating drum, 32 is a forming drum, 37 is a circumferential surface of the heating drum 31, 39 is a compressed air outlet, 41a and 41b are heaters, and 43 is a forming drum 32 The peripheral surface 44 is a molding cavity. 9 to Figure 3 Figure 5 Figure 7 Figure 10

Claims (1)

[Claims of Claims] An apparatus for molding a carrier tape for storing electronic components from a material tape made of a thermoplastic resin sheet, in which storage parts for storing electronic components are distributed at equal intervals in the longitudinal direction. The material tape is heated and softened by rotating around its axis while contacting the material tape on its circumferential surface, and then fed in the longitudinal direction, and compressed into a plurality of openings on the circumferential surface. a heating drum having air discharge ports distributed at equal intervals in the circumferential direction; and a heating drum that is rotated parallel to the axis and in the opposite direction to the heating drum, and the peripheral surface of the heating drum is rotated between the peripheral surface of the heating drum and the heating drum. A plurality of molding cavities are positioned so as to sandwich the material tape, and are open on the circumferential surface thereof and have a shape corresponding to the outer surface shape of the storage portion, and have a pitch corresponding to a distribution pitch of the compressed air discharge ports. and a molding drum provided in a distributed manner, and compressed air is discharged from the compressed air discharge port when the compressed air discharge port faces the corresponding molding cavity with the material tape in between. A molding device for carrier tape for storing electronic components, characterized by: