TWI482725B - Modified sealing tape structure - Google Patents

Modified sealing tape structure Download PDF

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Publication number
TWI482725B
TWI482725B TW100115918A TW100115918A TWI482725B TW I482725 B TWI482725 B TW I482725B TW 100115918 A TW100115918 A TW 100115918A TW 100115918 A TW100115918 A TW 100115918A TW I482725 B TWI482725 B TW I482725B
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Taiwan
Prior art keywords
tape
belt
download
sealing tape
electronic component
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TW100115918A
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Chinese (zh)
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TW201245008A (en
Inventor
Hsun Chi Liu
Kun Jung Wu
Chien Hsin Tu
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Lextar Electronics Corp
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Priority to TW100115918A priority Critical patent/TWI482725B/en
Priority to CN201110131914.8A priority patent/CN102765550B/en
Publication of TW201245008A publication Critical patent/TW201245008A/en
Application granted granted Critical
Publication of TWI482725B publication Critical patent/TWI482725B/en

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Description

封合帶改良結構Sealed belt improved structure

本發明係於關於一種封合帶的改良結構,用於捲式與可撓式之包裝;具體而言,本發明係關於一種電子元件的封合帶,具有固定電子元件的功能。The present invention relates to an improved structure for a closure tape for use in roll and flexible packaging; in particular, the present invention relates to a closure tape for an electronic component having the function of securing electronic components.

目前多數表面黏著元件(surface-mount devices,SMD),所常採用之上載帶為光滑表面,並黏合具有複數個囊袋供容納電子元件之下載帶。具有複數個囊袋之下載帶與上載帶黏合後,共同形成可置放電子元件之封合帶。配合自動化機台在自動化組裝製程中,取用該電子元件時,將整個裝置封合結構置於剝離機構中,並以自動吸附端子從下載帶之囊袋內,取出電子元件以供進一步製程使用。At present, most surface-mount devices (SMD), which are commonly used as a smooth surface, are bonded to a download tape having a plurality of pockets for accommodating electronic components. The download tape having a plurality of pockets is bonded to the uploading tape to form a sealing tape for placing the electronic component. In conjunction with the automated machine in the automated assembly process, when the electronic component is taken, the entire device sealing structure is placed in the peeling mechanism, and the electronic component is taken out from the bag of the download tape by the automatic adsorption terminal for further process use. .

圖1A所示為一種自動剝帶裝置,可剝離上載帶30,並利用自動吸附端子從下載帶20之囊袋22內,取出電子元件,為目前實務上最常使用方式。Figure 1A shows an automatic stripping device that strips the carrier tape 30 and removes the electronic components from the bladder 22 of the download tape 20 using an automatic suction terminal, which is the most common use in practice.

圖1B所示為現行電子元件封合裝置的剖面結構示意圖。如圖1B所示,封合帶10包含上載帶30與下載帶20;上載帶30包含面對下載帶20之內表面32。下載帶20具有囊袋22,用以容納電子元件40。FIG. 1B is a schematic cross-sectional view showing the current electronic component sealing device. As shown in FIG. 1B, the closure strip 10 includes an upload tape 30 and a download tape 20; the upload tape 30 includes an inner surface 32 that faces the download tape 20. The download tape 20 has a pocket 22 for housing the electronic component 40.

如圖1B所示之上載帶30之內表面32為光滑的表面結構。在捲收包裝時,電子元件40在上載帶30與下載帶20形成的封閉空間中因封合帶10翻轉而上下移動,易造成電子元件40之元件表面42黏附於上載帶30。The inner surface 32 of the carrier tape 30 as shown in Figure 1B is a smooth surface structure. At the time of winding up the package, the electronic component 40 moves up and down in the closed space formed by the carrier tape 30 and the download tape 20 by the flipping of the sealing tape 10, and the component surface 42 of the electronic component 40 is likely to adhere to the carrier tape 30.

在實務應用上,由於封合帶10涉及黏合與剝離程序,因此當上載帶30自下載帶20分離時,若黏著力有偏低、偏大或不均勻現象,將產生各種不同的問題。例如:當黏性偏低時,易於儲送過程受外力衝擊而使下載帶20與上載帶30分離鬆脫,而造成電子元件40的散落;當黏性太高時,上載帶30於剝離程序中,易造成置放於囊袋22內的電子元件40之元件表面42黏著於上載帶30之內表面32,而影響製程操作及產能。In practical applications, since the sealing tape 10 involves a bonding and peeling process, when the carrier tape 30 is separated from the download tape 20, if the adhesive force is low, large, or uneven, various problems will occur. For example, when the viscosity is low, the easy storage process is impacted by an external force to separate the download tape 20 from the loading tape 30, causing the electronic component 40 to scatter; when the viscosity is too high, the loading tape 30 is in the peeling process. In this case, the component surface 42 of the electronic component 40 placed in the pouch 22 is likely to adhere to the inner surface 32 of the carrier tape 30, thereby affecting the process operation and productivity.

另外,當封合帶10翻轉而使電子元件40於封閉空間上下移動時,也會因為電子元件40之面積較大,導致黏著於上載帶30之內表面32之電子元件40不易剝離。In addition, when the sealing tape 10 is reversed to move the electronic component 40 up and down in the closed space, the electronic component 40 adhered to the inner surface 32 of the carrier tape 30 is not easily peeled off because of the large area of the electronic component 40.

本發明之一目的在於提供一種封合帶的改良結構,係以上載帶衍生之凸出構造為擋止部,提供固定電子元件的功能。SUMMARY OF THE INVENTION One object of the present invention is to provide an improved structure of a sealing tape which is provided with a protruding structure derived from an uploading tape as a stopper to provide a function of fixing electronic components.

本發明之另一目的在於以上載帶之擋止部與電子元件表面接觸,以減少上載帶內表面與電子元件表面的接觸面積,進而降低上載帶光滑表面部分與電子元件間的黏著力,減少設備上之負載並能有效率地進行操作。Another object of the present invention is to reduce the contact area between the inner surface of the carrier tape and the surface of the electronic component by the contact portion of the carrier tape, thereby reducing the adhesion between the smooth surface portion of the carrier tape and the electronic component, and reducing the adhesion. Load on the device and operate efficiently.

本發明之封合帶結構包含上載帶及下載帶;下載帶具有至少一囊袋部沿下載帶之長邊方向間隔排列,每一囊袋部用以容納一電子元件。連接面與上載帶黏合。凹陷部自連接面遠離上載帶方向而形成。上載帶具有朝向下載帶之內表面,其中上載帶具有擋止部形成於內表面上,擋止部凸出於內表面並凸向囊袋內。The sealing tape structure of the present invention comprises an uploading tape and a downloading tape; and the downloading tape has at least one pocket portion arranged along the longitudinal direction of the downloading tape, each pocket portion for accommodating an electronic component. The connecting surface is bonded to the loading belt. The depressed portion is formed from the connecting surface away from the direction of the loading belt. The loading belt has an inner surface facing the download belt, wherein the loading belt has a stop formed on the inner surface, the stop protruding from the inner surface and protruding into the pocket.

於一實施例,擋止部可形成為至少一凸肋結構,係沿下載帶之長邊方向分佈。此外,凸肋結構沿下載帶短邊方向之剖面形狀於接近囊袋部之部分可具有較小寬度。In one embodiment, the blocking portion may be formed as at least one rib structure distributed along the longitudinal direction of the download tape. Further, the rib structure may have a small width in a cross-sectional shape along the short side direction of the download tape at a portion close to the capsular portion.

於另一實施例,擋止部可形成為至少一凸塊結構,係沿長邊方向間隔排列並分別對應於下載帶之囊袋部。再者,凸塊結構具有朝向囊袋部之接觸面,接觸面上包含粗化結構。於各種實施例中,粗化結構之形狀可為複數個圓凸點、複數個圓凹點、複數個交錯壓紋、複數個直條紋、或自凸塊結構向內凹的圓孔結構。In another embodiment, the blocking portion may be formed as at least one bump structure, which are spaced apart along the longitudinal direction and respectively correspond to the pocket portion of the download tape. Furthermore, the bump structure has a contact surface facing the pocket portion, and the contact surface includes a roughened structure. In various embodiments, the shape of the roughened structure may be a plurality of circular bumps, a plurality of circular pits, a plurality of staggered embossings, a plurality of straight stripes, or a circular hole structure recessed inward from the bump structure.

凸肋結構沿該下載帶短邊方向之剖面形狀於接近該囊袋部之部分具有較小寬度。The cross-sectional shape of the rib structure along the short side direction of the download tape has a small width at a portion close to the pocket portion.

本發明係提供封合帶改良結構。在較佳的實施例中,此封合帶結構可用於發光二極體之表面黏著封合帶。亦可用於其他電子元件的封裝。The present invention provides a modified structure for a closure strip. In a preferred embodiment, the sealing strip structure can be used for a surface adhesive sealing strip of a light emitting diode. Can also be used for the packaging of other electronic components.

圖2及圖3分別為本發明上載帶300之底視圖以及包含上載帶300與下載帶200之封合帶100之短邊剖面圖。如圖3所示,下載帶200具有至少一囊袋部202沿下載帶200之長邊方向間隔排列,每一囊袋部202用以容納一電子元件400。如圖3所示,在下載帶200之囊袋部202具有相對之二側牆204。下載帶200於囊袋部202之兩側分別具有連接面208分別與上載帶300之內表面302連接。下載帶200並於相鄰囊袋部202間形成有凹陷部206自連接面208朝遠離上載帶300之方向退縮。亦即,凹陷部206形成於囊袋部202與連接面208間,並沿下載帶202之長邊方向分布。2 and 3 are respectively a bottom view of the uploading tape 300 of the present invention and a short side cross-sectional view of the sealing tape 100 including the loading tape 300 and the download tape 200. As shown in FIG. 3, the download tape 200 has at least one pocket portion 202 spaced along the longitudinal direction of the download tape 200, and each pocket portion 202 is for accommodating an electronic component 400. As shown in FIG. 3, the pocket portion 202 of the download belt 200 has opposing side walls 204. The download tape 200 has a connection surface 208 on each side of the bag portion 202 that is connected to the inner surface 302 of the upload tape 300, respectively. The tape 200 is downloaded and a recess 206 is formed between the adjacent pocket portions 202 from the connecting surface 208 in a direction away from the loading belt 300. That is, the depressed portion 206 is formed between the bladder portion 202 and the joint surface 208, and is distributed along the longitudinal direction of the download belt 202.

如圖2及圖3所示,上載帶300具有朝向下載帶200的內表面302,且上載帶300具有擋止部304形成於內表面302上,擋止部304係凸出於內表面302並凸向囊袋部202。如圖2所示,於此實施例,擋止部304係為兩長條狀之凸肋結構沿上載帶300之長邊方向連續分布,其中凸肋結構具有一個以上之凸點。請同時參考圖3之封合帶剖面圖。圖3所示為上載帶300與下載帶200沿短邊方向之剖面。上載帶300的材質通常為聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)所製成,且具有抗靜電性之聚酯薄膜載帶。上載帶300之內表面302係具有黏性,用以與下載帶200兩側之連接面208黏合。在此實施例中,擋止部304為凸肋結構,凸向下載帶200之囊袋部202。凸肋結構係以熱熔膠塗於內表面302,進而透過沖壓或滾壓成型的製程手法,使得一個以上之凸點形狀之凸肋結構(即擋止部304)形成於長邊方向且具有足夠的厚度。As shown in FIGS. 2 and 3, the loading belt 300 has an inner surface 302 facing the download belt 200, and the loading belt 300 has a stopper portion 304 formed on the inner surface 302, and the stopper portion 304 protrudes from the inner surface 302 and The convex portion 202 is convex. As shown in FIG. 2, in this embodiment, the blocking portion 304 is formed by two elongated rib structures continuously distributed along the longitudinal direction of the loading belt 300, wherein the rib structure has more than one bump. Please also refer to the sectional view of the sealing tape in Figure 3. Figure 3 shows a cross section of the upload tape 300 and the download tape 200 in the short side direction. The material of the carrier tape 300 is usually made of polyethylene terephthalate (PET) and has an antistatic polyester film carrier tape. The inner surface 302 of the loading tape 300 is viscous for bonding to the connecting faces 208 on both sides of the download tape 200. In this embodiment, the stop portion 304 is a rib structure that projects toward the pocket portion 202 of the download tape 200. The rib structure is coated with the hot melt adhesive on the inner surface 302, and further processed by stamping or rolling forming, so that more than one convex rib structure (ie, the stopper portion 304) is formed in the longitudinal direction and has Sufficient thickness.

如圖3所示,在下載帶200的連接面208與囊袋部202兩側間之凹陷部206係沿下載帶202之長邊方向分布,並自連接面208朝離開上載帶300之方向退縮。在此實施例中,其退縮高度較佳與上載帶300之凸肋結構(即擋止部304)的厚度相等,使凸肋結構在上載帶300與下載帶200黏合後能容納於凹陷部206中。在其他實施例,凸肋結構的厚度亦可略小於凹陷部206退縮之高度。如圖3所示,下載帶200之囊袋部202用以容納電子元件400,在囊袋部202四周具有側牆204。在此實施例中,形狀為凸肋結構之擋止部304係對應於下載帶200之凹陷部206設置。然而,在其他實施例中,擋止部304亦可設置於兩側牆204之間。As shown in FIG. 3, the recessed portion 206 between the connecting surface 208 of the download tape 200 and the both sides of the bag portion 202 is distributed along the longitudinal direction of the download tape 202, and is retracted from the connecting surface 208 toward the direction away from the loading tape 300. . In this embodiment, the retracting height is preferably equal to the thickness of the rib structure (ie, the stopper portion 304) of the loading belt 300, so that the rib structure can be accommodated in the recess portion 206 after the loading belt 300 is bonded to the downloading belt 200. in. In other embodiments, the thickness of the rib structure may also be slightly less than the height at which the recess 206 is retracted. As shown in FIG. 3, the pocket portion 202 of the download tape 200 is for receiving the electronic component 400 with a side wall 204 around the pocket portion 202. In this embodiment, the stopper portion 304 having a rib structure is disposed corresponding to the recess portion 206 of the download tape 200. However, in other embodiments, the blocking portion 304 may also be disposed between the side walls 204.

如圖3所示,黏合後之上載帶300與下載帶200之凹陷部206、側牆204及囊袋部202共同形成封閉空間。藉由上載帶300的凸肋結構(即擋止部304),可減少上載帶300之內表面302與下載帶200之接觸面積。亦即,藉由凸肋結構的凸點與電子元件400接觸,不僅可減少上載帶300內表面302與電子元件400的接觸面積,更能藉由凸點接觸電子元件400的表面而限制電子元件400的位移,進而達到固定電子元件400之功效。如此可避免封合帶100捲收翻轉時,產生電子元件400之表面黏附於上載帶300之平滑內表面(即無擋止部304之內表面部分)之問題。在製程中剝離上載帶300時,能降低上載帶300與電子元件400的殘留黏著力,方便吸附端子從下載帶200之囊袋部202取出電子元件400使用,而能減少設備上之負載並能有效率地進行操作。此外,擋止部304的設置具有穩固搬送電子元件400的效果,使搬送過程中避免電子元件400因振動受損。在其他實施例中,凸肋結構可因應電子元件400的尺寸而做不同的設計,例如,針對較小尺寸之電子元件400設計單一個長條狀之凸肋結構對應於下載帶200沿短邊剖面的中間位置,亦可達到上述功效。As shown in FIG. 3, the bonded carrier tape 300 and the recessed portion 206 of the download tape 200, the side wall 204, and the pocket portion 202 together form a closed space. By the rib structure (i.e., the stop portion 304) of the tape 300, the contact area of the inner surface 302 of the carrier tape 300 with the download tape 200 can be reduced. That is, by contacting the bumps of the rib structure with the electronic component 400, not only the contact area of the inner surface 302 of the carrier tape 300 with the electronic component 400 but also the surface of the electronic component 400 can be restricted by the bumps. The displacement of 400, in turn, achieves the efficacy of the fixed electronic component 400. This avoids the problem that the surface of the electronic component 400 adheres to the smooth inner surface of the carrier tape 300 (i.e., the inner surface portion of the non-stop portion 304) when the sealing tape 100 is retracted. When the carrier tape 300 is peeled off during the process, the residual adhesive force of the carrier tape 300 and the electronic component 400 can be reduced, and the adsorption terminal can be used to take out the electronic component 400 from the pocket portion 202 of the download tape 200, thereby reducing the load on the device and Operate efficiently. Further, the provision of the stopper portion 304 has an effect of stably conveying the electronic component 400, and prevents the electronic component 400 from being damaged by vibration during the conveyance. In other embodiments, the rib structure may be designed differently depending on the size of the electronic component 400. For example, designing a single elongated rib structure for the smaller size electronic component 400 corresponds to the download tape 200 along the short side. The above effect can also be achieved by the middle position of the section.

圖4A及圖4B為凸肋結構之擋止部304之變化實施例,其中凸肋結構沿上載帶300短邊方向之剖面可由不同形狀,以因應不同需求。舉例而言,相對於圖3中凸肋結構沿上載帶300短邊方向之剖面為圓弧形,如圖4A所示之實施例中,凸肋結構沿上載帶300短邊方向之剖面為三角形。另在圖4B所示之實施例中,凸肋結構之剖面形狀亦可為梯形。亦即,凸肋結構(即擋止部304)沿下載帶200短邊方向之剖面形狀於接近囊袋部202之部分可具有較小寬度,進一步減少與電子元件400的接觸面積。於此,凸肋結構的數目、形狀可因應電子元件400的尺寸而做不同的設計。4A and 4B show a modified embodiment of the rib portion 304 of the rib structure, wherein the rib structure may have different shapes along the short side direction of the loading belt 300 to meet different needs. For example, the rib structure in FIG. 3 has a circular arc shape along the short side direction of the loading belt 300. In the embodiment shown in FIG. 4A, the rib structure has a triangular shape along the short side direction of the loading belt 300. . In addition, in the embodiment shown in FIG. 4B, the cross-sectional shape of the rib structure may also be trapezoidal. That is, the rib structure (i.e., the stopper portion 304) may have a small width in a cross-sectional shape in the short-side direction of the download tape 200 at a portion close to the capsular portion 202, further reducing the contact area with the electronic component 400. Here, the number and shape of the rib structures may be differently designed according to the size of the electronic component 400.

在此需注意,擋止部304不限於上述的沿上載帶300長邊方向延伸的凸肋結構。圖5為上載帶300另一實施例之底視圖。如圖5所示,上載帶300的內表面302具有長條狀之凸塊結構做為擋止部304。凸塊結構係沿上載帶300之長邊方向間隔排列並分別對應於下載帶200之囊袋部202。於此實施例,凸塊結構為成對設置,成對之凸塊結構係凸向相同之囊袋部202。參考圖6之封合帶100的剖面圖。圖6所示為上載帶300與下載帶200沿長邊方向之剖面。上載帶300之內表面302上包含擋止部304,在此實施例中,擋止部304為成對的凸塊結構,凸向下載帶200之囊袋部202。凸塊結構具有一厚度,係透過沖壓或滾壓成型的製程手法形成。在此實施例中,上載帶300之凸塊結構的厚度較佳與下載帶200連接面208至電子元件400表面之高度差相等,使凸塊結構在上下載帶黏合後能頂住電子元件400的表面。藉此凸塊結構穩固電子元件400,同時以較小的接觸面積與電子元件400表面接觸。在其他實施例中,凸塊結構的厚度亦可略小於下載帶200連接面208至電子元件400表面之高度差。於此實施例,凸塊結構沿上載帶300之長邊方向的剖面形狀係為圓弧形。然而,於其他實施例中,凸塊結構沿上載帶300之長邊方向的剖面形狀亦可因應電子元件400的需求而有不同的設計,如三角形、梯形、或其他幾何形狀或不規則性狀。如圖6所示,凸塊結構之擋止部304係對應於下載帶200之囊袋部202設置,且成對之凸塊結構位置介於囊袋部202的兩側牆204之間。在其他實施例中,擋止部304亦可沿下載帶200長邊設置單一個長條狀之凸塊結構對應於囊袋部202的中間位置,如圖7所示。It should be noted here that the stopper portion 304 is not limited to the above-described rib structure extending in the longitudinal direction of the loading belt 300. FIG. 5 is a bottom view of another embodiment of the loading belt 300. As shown in FIG. 5, the inner surface 302 of the loading belt 300 has an elongated bump structure as a stopper 304. The bump structures are spaced apart along the longitudinal direction of the upload tape 300 and correspond to the pocket portions 202 of the download tape 200, respectively. In this embodiment, the bump structures are arranged in pairs, and the pair of bump structures are convex toward the same pocket portion 202. Referring to the cross-sectional view of the closure strip 100 of FIG. Figure 6 shows a section along the longitudinal direction of the upload tape 300 and the download tape 200. The inner surface 302 of the loading belt 300 includes a stop portion 304. In this embodiment, the blocking portion 304 is a pair of bump structures that protrude toward the pocket portion 202 of the download belt 200. The bump structure has a thickness formed by a stamping or roll forming process. In this embodiment, the thickness of the bump structure of the upload tape 300 is preferably equal to the height difference between the connection surface 208 of the download tape 200 and the surface of the electronic component 400, so that the bump structure can withstand the electronic component 400 after the upper download tape is bonded. s surface. Thereby, the bump structure stabilizes the electronic component 400 while being in contact with the surface of the electronic component 400 with a small contact area. In other embodiments, the thickness of the bump structure may also be slightly less than the height difference of the connection surface 208 of the download tape 200 to the surface of the electronic component 400. In this embodiment, the cross-sectional shape of the bump structure along the longitudinal direction of the uploading tape 300 is a circular arc shape. However, in other embodiments, the cross-sectional shape of the bump structure along the longitudinal direction of the carrier tape 300 may also have different designs depending on the requirements of the electronic component 400, such as a triangle, a trapezoid, or other geometric shapes or irregularities. As shown in FIG. 6, the stop portion 304 of the bump structure is disposed corresponding to the pocket portion 202 of the download tape 200, and the pair of bump structure positions are located between the side walls 204 of the pocket portion 202. In other embodiments, the stop portion 304 can also be disposed along the long side of the download tape 200 to form a single elongated bump structure corresponding to the intermediate position of the pocket portion 202, as shown in FIG.

圖7所示為上載帶300與下載帶200沿短邊方向之剖面。上載帶300之內表面302上包含擋止部304,在此實施例中,擋止部304為一個凸塊結構,凸向下載帶200之囊袋部202。如圖7之剖面圖所示,凹陷部206自下載帶200連接面208退縮之高度與上載帶300之凸塊結構的厚度相等,使凸塊結構在上載帶、下載帶黏合後能容納於囊袋部202中,並頂住電子元件400的表面。在其他實施例,凸塊結構的厚度亦可略小於凹陷部206退縮之高度。凸塊結構之擋止部304係對應於下載帶200之囊袋部202設置,且其長度介於囊袋部202的凹陷部206之間。Figure 7 shows a cross section of the upload tape 300 and the download tape 200 in the short side direction. The inner surface 302 of the loading belt 300 includes a stop portion 304. In this embodiment, the blocking portion 304 is a bump structure that protrudes toward the pocket portion 202 of the download belt 200. As shown in the cross-sectional view of FIG. 7, the height of the recessed portion 206 retracted from the connecting surface 208 of the download tape 200 is equal to the thickness of the bump structure of the loading tape 300, so that the bump structure can be accommodated in the capsule after the loading tape and the download tape are bonded. The pocket portion 202 is in contact with the surface of the electronic component 400. In other embodiments, the thickness of the bump structure may also be slightly less than the height at which the recess 206 is retracted. The stopper portion 304 of the bump structure is disposed corresponding to the pocket portion 202 of the download tape 200, and has a length between the recess portions 206 of the pocket portion 202.

如圖7所示,擋止部304(如凸塊結構)之接觸面306上具有粗化結構308。粗化結構308係利用一種滾壓或壓印的製程手法,將上載帶30進行表面加工處理,形成具粗化表面之上載帶300。藉此使得凸塊結構穩固電子元件400,並利用粗化結構以較小的接觸面積與電子元件400表面接觸,減少上載帶300與電子元件400表面黏附發生機會。於自動化設備剝離上載帶300時,降低上載帶300與電子元件400的黏著力,以提高製程良率,並更有效率地進行生產。As shown in FIG. 7, the contact surface 306 of the stop portion 304 (e.g., the bump structure) has a roughened structure 308 thereon. The roughened structure 308 is surface treated by a rolling or embossing process to form an overlay tape 300 having a roughened surface. Thereby, the bump structure is stabilized by the electronic component 400, and the roughened structure is brought into contact with the surface of the electronic component 400 with a small contact area, thereby reducing the chance of adhesion of the upload tape 300 to the surface of the electronic component 400. When the automated device peels off the loading tape 300, the adhesion between the loading tape 300 and the electronic component 400 is lowered to improve the process yield and to produce more efficiently.

圖8A所示為粗化結構308之實施例。在此實施例中,粗化結構308在接觸面306上形成複數個圓凸點排列。然而,在其他實施例中,粗化結構306亦可形成複數個圓凹點排列,或同時選用圓凸點及圓凹點形成不規則分佈。另在圖8B所示之實施例中,粗化結構306形成複數個交錯斜線壓紋。圖8C則為複數個直條壓紋結構。圖8D所示為凸塊結構之接觸面306朝離開下載帶200之方向製成內凹之圓孔;在其他實施例中,圓孔數目可隨電子元件400之尺寸調整。An embodiment of a roughened structure 308 is shown in FIG. 8A. In this embodiment, the roughened structure 308 forms a plurality of circular bump arrangements on the contact surface 306. However, in other embodiments, the roughened structure 306 may also form a plurality of circular pit arrays, or alternatively, the circular bumps and the circular pits may be used to form an irregular distribution. In addition, in the embodiment illustrated in Figure 8B, the roughened structure 306 forms a plurality of staggered diagonal embossments. Figure 8C shows a plurality of straight embossed structures. 8D shows a circular opening in which the contact surface 306 of the bump structure is recessed away from the download tape 200; in other embodiments, the number of circular holes can be adjusted to the size of the electronic component 400.

此外,上載帶300之擋止部304不限於上述沿上載帶300長邊方向延伸之凸肋結構或沿短邊方向延伸之凸塊結構,亦即,擋止部304可為分布於上載帶300對應於下載帶200之囊袋部202之內表面區域中的單一或複數離散凸塊。亦即,上載帶300沿長邊方向或短邊方向分布之擋止部304剖面形狀的頂點(即最接近下載帶200之部分),在沿上載帶300長邊方向及/或短邊方向之連線可為連續或不連續。舉例而言,擋止部304可為對應於電子元件400表面之部分側邊、中間、或角落等而設置的一個或複數個凸點形凸塊,且凸點的數目、分布位置可隨電子元件400之需求調整。In addition, the stopper portion 304 of the loading belt 300 is not limited to the above-described rib structure extending in the longitudinal direction of the loading belt 300 or the bump structure extending in the short side direction, that is, the stopper portion 304 may be distributed on the loading belt 300. Corresponding to a single or complex discrete bump in the inner surface region of the pocket portion 202 of the download strip 200. That is, the apex of the cross-sectional shape of the stopper portion 304 of the loading belt 300 distributed in the longitudinal direction or the short-side direction (ie, the portion closest to the download tape 200) is along the longitudinal direction and/or the short side direction of the loading belt 300. Connections can be continuous or discontinuous. For example, the blocking portion 304 may be one or a plurality of bump-shaped bumps disposed corresponding to a portion of the side, the middle, or the corner of the surface of the electronic component 400, and the number and distribution of the bumps may follow the electrons. The need for component 400 is adjusted.

本發明已由上述相關實施例加以描述,然而上述實施例僅為實施本發明之範例。必需指出的是,已揭露之實施例並未限制本發明之範圍。根據本發明之精神及原則所做之修改及均等設置均包含於所附申請專利範圍內。The present invention has been described by the above-described related embodiments, but the above embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments do not limit the scope of the invention. Modifications and equivalent arrangements made in accordance with the spirit and principles of the invention are included in the scope of the appended claims.

100...封合帶100. . . Sealing belt

200...下載帶200. . . Download tape

202...囊袋部202. . . Pocket part

204...側牆204. . . Side wall

206...凹陷部206. . . Depression

208...連接面208. . . Connection surface

300...上載帶300. . . Upload belt

302...內表面302. . . The inner surface

304...擋止部304. . . Stop

306...接觸面306. . . Contact surfaces

308...粗化結構308. . . Coarse structure

400...電子元件400. . . Electronic component

圖1A為傳統封合帶捲收之示意圖;Figure 1A is a schematic view of a conventional closure tape;

圖1B為傳統封合帶之剖面圖;Figure 1B is a cross-sectional view of a conventional sealing tape;

圖2為上載帶之底視圖;Figure 2 is a bottom view of the loading belt;

圖3為本發明封合帶實施例之短邊剖面圖;Figure 3 is a short side cross-sectional view showing an embodiment of the sealing tape of the present invention;

圖4A及圖4B為凸肋結構之不同實施例示意圖;4A and 4B are schematic views of different embodiments of a rib structure;

圖5為上載帶之另一實施例底視圖;Figure 5 is a bottom view of another embodiment of the loading belt;

圖6為本發明封合帶另一實施例之長邊剖面圖;Figure 6 is a long side cross-sectional view showing another embodiment of the sealing tape of the present invention;

圖7為封合帶具粗化結構之實施例示意圖;Figure 7 is a schematic view showing an embodiment of a sealing belt having a roughened structure;

圖8A至圖8D為粗化結構之不同實施例示意圖。8A-8D are schematic views of different embodiments of a roughened structure.

100...封合帶100. . . Sealing belt

200...下載帶200. . . Download tape

202...囊袋部202. . . Pocket part

204...側牆204. . . Side wall

206...凹陷部206. . . Depression

208...連接面208. . . Connection surface

300...上載帶300. . . Upload belt

302...內表面302. . . The inner surface

304...擋止部304. . . Stop

400...電子元件400. . . Electronic component

Claims (14)

一種封合帶,供裝載至少一電子元件,包括:一下載帶,具有至少一囊袋部沿該下載帶之長邊方向間隔排列,每一囊袋部用以容納一電子元件;以及一上載帶,具有朝向該下載帶之一內表面;其中,該上載帶具有一擋止部形成於該內表面上;該擋止部凸出於該內表面並凸向該囊袋部內,其中,該下載帶於囊袋部之兩側分別具有一連接面分別與該上載帶之該內表面連接;該下載帶並於相鄰囊袋部間形成有一凹陷部自該連接面朝遠離該上載帶之方向退縮,該擋止部係容納於該凹陷部中。 A sealing tape for loading at least one electronic component, comprising: a downloading tape having at least one pocket portion spaced along a longitudinal direction of the downloading tape, each pocket portion for accommodating an electronic component; and an uploading a belt having an inner surface facing the download belt; wherein the loading belt has a stop formed on the inner surface; the stop protrudes from the inner surface and protrudes into the pocket portion, wherein the belt Each of the two sides of the downloading belt portion has a connecting surface respectively connected to the inner surface of the loading belt; the downloading belt is formed with a recessed portion between the adjacent pocket portions from the connecting surface away from the carrying belt The direction is retracted, and the stopper is housed in the recess. 如請求項1所述之封合帶,其中該囊袋部具有相對之二側牆,該擋止部之位置係介於該二側牆之間。 The closure strip of claim 1, wherein the pocket portion has opposite side walls, the stop portion being located between the two side walls. 如請求項1所述之封合帶,其中該擋止部形成為至少一凸肋結構,該些凸肋結構係沿該下載帶之長邊方向分佈且該凸肋結構係容納於該凹陷部中。 The sealing tape of claim 1, wherein the blocking portion is formed as at least one rib structure, the rib structures are distributed along a longitudinal direction of the download tape, and the rib structure is received in the recessed portion in. 如請求項3所述之封合帶,其中該凸肋結構沿該下載帶短邊方向之剖面形狀於接近該囊袋部之部分具有較小寬度。 The sealing tape according to claim 3, wherein the rib structure has a small width in a cross-sectional shape along a short side direction of the downloading tape at a portion close to the capsular portion. 如請求項1所述之封合帶,其中該擋止部係形成為至少一凸塊結構,該至少一凸塊結構係沿長邊方向間隔排列並分別對應於該下載帶之該些囊袋部。 The sealing tape of claim 1, wherein the blocking portion is formed as at least one bump structure, and the at least one bump structure is spaced along the long side direction and respectively corresponding to the pockets of the download tape unit. 如請求項5所述之封合帶,其中該凸塊結構係成對設置,成對 之該凸塊結構係凸向相同之該囊袋部。 The sealing tape of claim 5, wherein the bump structures are arranged in pairs, in pairs The bump structure is convex toward the same pocket portion. 如請求項6所述之封合帶,其中該凸塊結構係形成為長條狀,並沿橫切該下載帶長邊之方向分佈。 The sealing tape of claim 6, wherein the bump structure is formed in an elongated shape and distributed in a direction transverse to a long side of the download tape. 如請求項5所述之封合帶,其中該凸塊結構具有朝向該囊袋部之一接觸面,該接觸面上包含一粗化結構。 The closure strip of claim 5, wherein the bump structure has a contact surface toward the pocket portion, the contact surface comprising a roughened structure. 如請求項8所述之封合帶,其中該粗化結構之形狀為複數個圓凸點。 The sealing tape of claim 8, wherein the roughened structure has a shape of a plurality of circular bumps. 如請求項8所述之封合帶,其中該粗化結構之形狀為複數個圓凹點。 The sealing tape of claim 8, wherein the roughened structure has a plurality of circular pits. 如請求項8所述之封合帶,其中該粗化結構之形狀為複數個交錯壓紋。 The closure tape of claim 8, wherein the roughened structure has a plurality of staggered embossments. 如請求項8所述之封合帶,其中該粗化結構之形狀為複數個直條紋。 The sealing tape of claim 8, wherein the roughened structure has a plurality of straight stripes. 如請求項8所述之封合帶,其中該粗化結構之形狀為一圓孔結構,該圓孔結構係自該凸塊結構向內凹。 The sealing tape of claim 8, wherein the roughened structure has a circular hole structure, and the circular hole structure is concave from the convex structure. 如請求項1所述之封合帶,其中該上載帶之內表面之該擋止部為複數個離散凸塊,該複數個離散凸塊係沿該上載帶之長邊或短邊方向分布,且凸向該下載帶之囊袋部內。 The sealing tape of claim 1, wherein the blocking portion of the inner surface of the loading belt is a plurality of discrete bumps, and the plurality of discrete bumps are distributed along a long side or a short side of the loading belt. And protruding into the pocket portion of the download tape.
TW100115918A 2011-05-06 2011-05-06 Modified sealing tape structure TWI482725B (en)

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TW100115918A TWI482725B (en) 2011-05-06 2011-05-06 Modified sealing tape structure
CN201110131914.8A CN102765550B (en) 2011-05-06 2011-05-20 Improved structure of sealing belt

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TW100115918A TWI482725B (en) 2011-05-06 2011-05-06 Modified sealing tape structure

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CN105966762A (en) * 2016-07-01 2016-09-28 深圳市信维通信股份有限公司 Packing carrier band
JP6751652B2 (en) * 2016-11-09 2020-09-09 信越ポリマー株式会社 Manufacturing method of carrier tape for electronic components
CN108357784B (en) * 2017-01-26 2020-03-03 华邦电子股份有限公司 Roll-to-roll packaging material
CN108231948B (en) * 2018-02-11 2024-03-01 安徽问天量子科技股份有限公司 Pumped gas sealing system of avalanche photodiode and operation method thereof
JP2019204933A (en) * 2018-05-25 2019-11-28 デクセリアルズ株式会社 Electronic component supply body and electronic component supply reel
TWI696867B (en) * 2019-03-22 2020-06-21 友達光電股份有限公司 Tape structure, display panel and display device utilized the tape structure

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