JP6662705B2 - Package for chip parts - Google Patents

Description

  The present invention relates to a chip component package suitable for packing a large number of chip components.

  Conventionally, as an example of a means for mounting chip components such as a chip resistor and a chip capacitor on a mounting substrate, a large number of chip components are stored in a tape-shaped package formed of a base tape and a cover tape, In the mounting process, a technique is known in which the cover tape is peeled off while moving the base tape in one direction, and the chip components in the storage recess of the base tape are taken out by the suction nozzle and fast and accurately mounted on the mounting board I have.

  As shown in FIG. 4, this type of package for chip components is formed by continuously forming a large number of storage recesses 11 at predetermined intervals on a band-shaped base tape 10 made of a plastic material. After the chip component 12 is stored in the inside 11, a cover tape 13 is attached to the surface of the base tape 10 so that the chip component 12 does not protrude. In order to smoothly insert and remove the chip component 12 into and from the storage recess 11, the storage recess 11 is formed to be slightly larger than the chip component. In order to make it easy to take out the parts, the cross-sectional shape of the storage recess 11 is an inverted trapezoid in which the top surface (opening side) is wider than the bottom surface.

  The package configured as described above is conveyed to the manufacturing site in a state where it is wound on a reel. In the mounting machine at the manufacturing site, as shown in FIG. The cover tape 13 is peeled off while being transported in the direction, and the chip component 12 in the storage recess 11 from which the cover tape 13 has been peeled off is picked up and mounted on the mounting board by the suction nozzle 14 installed on the downstream side in the transport direction A. It has become. At this time, as shown in FIG. 6A, when the cover tape 13 is peeled off, the chip component 12 may jump out of the storage recess 11 due to charging of the cover tape 13 or the like. As shown in b), when the chip component 12 is picked up by the suction nozzle 14, the chip component 12 may jump out of the storage recess 11 due to the inertial force caused by the stoppage of the transfer of the base tape 10. In addition, there is a problem in that the removal of the chip component 12 by the suction nozzle 14 is hindered.

  Therefore, conventionally, as described in Patent Document 1, a base tape having a storage recess is formed of a chargeable material, and a cover tape covering the storage recess is formed of a non-chargeable material (conductive material). By doing so, there has been proposed a package for chip components that prevents the chip components from jumping out when the cover tape is peeled off by using static electricity. In the package configured as described above, the base tape is made of a chargeable material, so that the chip components are attached and fixed by electrostatic force in the storage recess of the base tape, and the cover tape is made of a non-chargeable material that is not charged. This prevents the chip components from adhering to the cover tape.

JP 2001-58690 A

  However, the external dimensions of chip components have become increasingly smaller in recent years. For example, in the case of ultra-small chip components such as 0402 size (0.4 mm × 0.2 mm) and 0201 (0.2 mm × 0.1 mm), Since the weight of the chip component is extremely light, even if a chip component package as described in Patent Document 1 is used, it is not possible to completely prevent the chip component from jumping out. In addition, since small chip components are particularly vulnerable to static electricity, there is also a problem in that when a chargeable material is used as in the conventional example described in Patent Document 1, the possibility of ESD damage (electrostatic breakdown) increases. appear.

  The present invention has been made in view of such circumstances of the related art, and an object of the present invention is to provide a chip component package that can stably take out chip components during mounting.

  In order to achieve the above object, the present invention provides a base tape in which a large number of storage recesses for storing chip components in a rectangular parallelepiped shape are continuously formed at predetermined intervals, and covers the storage recesses. A cover tape attached to the surface of the base tape, and peeling off the cover tape while transferring the base tape in one direction, whereby the chip component is taken out from the storage recess. In the package, the bottom surface of the storage recess is a mounting surface inclined forward and downward toward the transfer direction of the base tape, and the downstream side opposed along the transfer direction via the mounting surface. Among the first inner wall surface and the second inner wall surface on the upstream side, an intersection angle between the first inner wall surface and the mounting surface is set to be substantially a right angle, and an intersection between the second inner wall surface and the mounting surface is described above. Angle set to obtuse It is characterized in that.

  In the chip component packaging body configured as described above, the bottom surface of the storage recess is a mounting surface that is inclined forward and downward toward the base tape transfer direction. Since the first inner wall surface of the storage recess located on the downstream side is formed at a substantially right angle, when the cover tape is peeled off, the chip components in the storage recess hardly protrude toward the first inner wall surface, and In addition, since the position of the chip component in the storage recess after the cover tape is peeled off becomes constant, stable removal by the suction nozzle or the like can be performed.

  In the above configuration, the inclination angle of the mounting surface with respect to the surface of the base tape is preferably set to 1 ° to 10 °.

  ADVANTAGE OF THE INVENTION According to the package for chip components of this invention, removal of chip components at the time of mounting can be performed stably.

It is a top view of the package for chip parts concerning an example of an embodiment of the present invention. FIG. 2 is an enlarged sectional view taken along the line II-II of FIG. 1. FIG. 2 is an explanatory diagram showing a procedure for mounting a chip component using the package of FIG. 1. It is sectional drawing of the package for chip components which concerns on a prior art example. It is explanatory drawing which shows the mounting procedure of the chip component by the package which concerns on a prior art example. It is an explanatory view showing a problem of a package concerning a conventional example.

  An embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, a chip component package (hereinafter referred to as a package) according to an embodiment has a large number of storage recesses 1. The base tape 2 includes a base tape 2 formed continuously at a predetermined interval, and a cover tape 3 attached to the surface of the base tape 2 so as to cover the storage recess 1. Contains a rectangular chip component 4 formed of a chip resistor or the like.

  The base tape 2 is a belt-like body made of a plastic material such as polystyrene (PS), polyethylene terephthalate (PET), or polycarbonate (PC), and a number of feed holes 5 are formed on one side in the width direction of the base tape 2. It is formed at intervals. The storage recess 1 is formed to be slightly larger than the chip component 4 by embossing, and as shown in FIG. 2, when the transfer direction of the base tape 2 at the time of mounting the chip component 4 is indicated by an arrow A, the storage recess is formed. The bottom surface of the place 1 is a mounting surface 1a inclined forward and downward toward the transfer direction A. Here, the inclination angle θ of the mounting surface 1a with respect to the surface of the base tape 2 is set in the range of 1 ° to 10 ° (preferably 4 ° to 8 °), and in the case of the present embodiment, the inclination angle θ = 6 °. In addition, of the first inner wall surface 1b on the downstream side and the second inner wall surface 1c on the upstream side of the storage recess 1 opposed along the transfer direction A via the mounting surface 1a, the first inner wall surface 1b The intersection angle of the surface 1a is set to a substantially right angle, and the intersection angle of the second inner wall surface 1c and the mounting surface 1a is set to an obtuse angle larger than 90 °.

  The cover tape 3 is a long sheet made of a plastic material such as polyethylene (PE) or polyethylene terephthalate (PET). The cover tape 3 is adhered to the surface of the base tape 2 excluding the feed holes 5 by thermocompression. The chip component 4 stored in the storage recess 1 is covered with the cover tape 3.

  The package thus configured is conveyed to a manufacturing site in a state where it is wound on a reel, and the mounting machine at the manufacturing site, as shown in FIG. The cover tape 3 is peeled off while being transferred in the direction, and the chip component 4 in the storage recess 1 is picked up by the suction nozzle 6 installed on the downstream side in the transfer direction A and mounted on a mounting board (not shown). I have.

  Here, when the present inventors observed a phenomenon in which the chip component popped out, as shown in FIG. 6A, when the cover tape was peeled, the chip component began to float on the side of the base tape in the transfer direction A, and the recessed portion of the chip component was removed. As shown in FIG. 6B, even when the base tape is stopped for picking up, the chip component may start to float in the transfer direction A of the base tape and jump out of the storage recess. confirmed.

  Based on such knowledge, in the package according to the present embodiment, the bottom surface of the storage recess 1 is set to the mounting surface 1a inclined forward and downward in the transfer direction A, and the mounting surface 1a Since the first inner wall surface 1b of the storage recess 1 located on the downstream side in the transport direction A is formed at a substantially right angle, when the cover tape 3 is peeled off, the chip component 4 in the storage recess 1 is removed from the first inside wall. It can be made difficult to jump out by making it approach the wall surface 1b. Further, when the transfer of the base tape 2 is stopped during the pickup, the chip component 4 is more likely to move closer to the first inner wall surface 1b due to the inclination angle of the mounting surface 1a in addition to the inertial force. The suction position of the chip component 4 with respect to 6 becomes constant, so that stable removal can be performed.

  As described above, in the package according to the present embodiment, the bottom surface of the storage recess 1 formed in the base tape 2 is the mounting surface 1a inclined forward and downward in the transfer direction A. Since the first inner wall surface 1b of the storage recess 1 located on the downstream side in the transfer direction A with respect to the mounting surface 1a is formed at a substantially right angle, when the cover tape 3 is peeled off, the inside of the storage recess 1 is removed. Of the chip component 4 becomes difficult to protrude toward the first inner wall surface 1b, and the position of the chip component 4 in the storage recess 1 after the cover tape 3 is peeled becomes constant. It can be performed.

  When the inclination angle of the mounting surface 1a with respect to the surface of the base tape 2 is θ, if the inclination angle θ is less than 1 °, the chip component 4 in the storage recess 1 is moved toward the first inner wall surface 1b. If the function is not sufficiently exhibited and the inclination angle θ exceeds 10 °, the chip component 4 is greatly inclined with respect to the suction surface of the suction nozzle 6 and becomes difficult to be taken out. Therefore, in the case of the present embodiment, the inclination angle θ is It is set in the range of 1 ° to 10 °.

DESCRIPTION OF SYMBOLS 1 Storage recess 1a Mounting surface 1b 1st inner wall surface 1c 2nd inner wall surface 2 Base tape 3 Cover tape 4 Chip component 5 Feed hole 6 Suction nozzle

Claims (2)

A base tape in which a number of storage recesses for storing chip components in a rectangular parallelepiped shape are continuously formed at predetermined intervals, and a cover tape adhered to the surface of the base tape so as to cover the storage recesses By removing the cover tape while transferring the base tape in one direction, in the chip component packaging body from which the chip component is taken out from the storage recess,
The bottom surface of the storage recess is a mounting surface that is inclined forward and downward in the direction in which the base tape is transported, and the first inner wall surface on the downstream side that faces the transport direction via the mounting surface. Of the second inner wall surface on the upstream side, the intersection angle between the first inner wall surface and the placement surface is set to be substantially a right angle, and the intersection angle between the second inner wall surface and the placement surface is an obtuse angle. A package for chip parts, which is set.   2. The chip component package according to claim 1, wherein an inclination angle of the placement surface with respect to a surface of the base tape is set to 1 ° to 10 °.