MY194458A - Resin film forming film and resin film forming composite sheet - Google Patents

Resin film forming film and resin film forming composite sheet

Info

Publication number
MY194458A
MY194458A MYPI2019007673A MYPI2019007673A MY194458A MY 194458 A MY194458 A MY 194458A MY PI2019007673 A MYPI2019007673 A MY PI2019007673A MY PI2019007673 A MYPI2019007673 A MY PI2019007673A MY 194458 A MY194458 A MY 194458A
Authority
MY
Malaysia
Prior art keywords
film forming
resin film
test piece
forming film
composite sheet
Prior art date
Application number
MYPI2019007673A
Other languages
English (en)
Inventor
Keishi Fuse
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY194458A publication Critical patent/MY194458A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
MYPI2019007673A 2017-07-06 2018-05-11 Resin film forming film and resin film forming composite sheet MY194458A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017132980 2017-07-06
PCT/JP2018/018248 WO2019008898A1 (ja) 2017-07-06 2018-05-11 樹脂膜形成用フィルム及び樹脂膜形成用複合シート

Publications (1)

Publication Number Publication Date
MY194458A true MY194458A (en) 2022-11-30

Family

ID=64950807

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019007673A MY194458A (en) 2017-07-06 2018-05-11 Resin film forming film and resin film forming composite sheet

Country Status (8)

Country Link
JP (1) JP7044780B2 (zh)
KR (1) KR102507152B1 (zh)
CN (1) CN110831766B (zh)
MY (1) MY194458A (zh)
PH (1) PH12020500005A1 (zh)
SG (1) SG11201913224TA (zh)
TW (1) TWI743361B (zh)
WO (1) WO2019008898A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7471880B2 (ja) * 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート
JP7471879B2 (ja) * 2020-03-18 2024-04-22 リンテック株式会社 フィルム状接着剤及びダイシングダイボンディングシート
JP7387510B2 (ja) * 2020-03-26 2023-11-28 リンテック株式会社 保護膜形成フィルム、保護膜形成用複合シート、及び保護膜形成フィルム付きワークの搬送方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4331047B2 (ja) * 2004-04-28 2009-09-16 信越ポリマー株式会社 電子部品保持具の製造方法
JP4732472B2 (ja) 2007-03-01 2011-07-27 日東電工株式会社 熱硬化型ダイボンドフィルム
CN101836162B (zh) * 2007-10-25 2012-11-14 可隆工业株式会社 薄膜型转印材料
JP5390209B2 (ja) 2009-02-04 2014-01-15 日東電工株式会社 熱硬化型ダイボンドフィルム
JP4717156B1 (ja) 2010-11-01 2011-07-06 協和界面科学株式会社 剥離試験装置
WO2015046529A1 (ja) * 2013-09-30 2015-04-02 リンテック株式会社 樹脂膜形成用複合シート
WO2015105002A1 (ja) * 2014-01-08 2015-07-16 リンテック株式会社 保護膜形成用複合シート
WO2017010385A1 (ja) * 2015-07-10 2017-01-19 日東電工株式会社 太陽電池モジュール、太陽電池モジュールの製造方法および太陽電池セルの配線方法

Also Published As

Publication number Publication date
CN110831766B (zh) 2021-09-21
CN110831766A (zh) 2020-02-21
JPWO2019008898A1 (ja) 2020-05-21
TWI743361B (zh) 2021-10-21
JP7044780B2 (ja) 2022-03-30
KR20200026833A (ko) 2020-03-11
WO2019008898A1 (ja) 2019-01-10
TW201907491A (zh) 2019-02-16
PH12020500005A1 (en) 2021-01-11
KR102507152B1 (ko) 2023-03-07
SG11201913224TA (en) 2020-01-30

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