MY192601A - Tape for electronic device packaging - Google Patents

Tape for electronic device packaging

Info

Publication number
MY192601A
MY192601A MYPI2018701080A MYPI2018701080A MY192601A MY 192601 A MY192601 A MY 192601A MY PI2018701080 A MYPI2018701080 A MY PI2018701080A MY PI2018701080 A MYPI2018701080 A MY PI2018701080A MY 192601 A MY192601 A MY 192601A
Authority
MY
Malaysia
Prior art keywords
adhesive layer
tape
electronic device
pressure
sensitive adhesive
Prior art date
Application number
MYPI2018701080A
Other languages
English (en)
Inventor
Masami Aoyama
Kunihiko Ishiguro
Toru Sano
Jirou Sugiyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY192601A publication Critical patent/MY192601A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Dicing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Packages (AREA)
MYPI2018701080A 2016-03-31 2016-11-14 Tape for electronic device packaging MY192601A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016072255 2016-03-31
PCT/JP2016/083696 WO2017168820A1 (ja) 2016-03-31 2016-11-14 電子デバイスパッケージ用テープ

Publications (1)

Publication Number Publication Date
MY192601A true MY192601A (en) 2022-08-29

Family

ID=59963849

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018701080A MY192601A (en) 2016-03-31 2016-11-14 Tape for electronic device packaging

Country Status (7)

Country Link
JP (1) JP6775005B2 (zh)
KR (1) KR102056178B1 (zh)
CN (1) CN108076669B (zh)
MY (1) MY192601A (zh)
SG (1) SG11201802282VA (zh)
TW (1) TWI643930B (zh)
WO (1) WO2017168820A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI799557B (zh) * 2018-03-28 2023-04-21 日商琳得科股份有限公司 樹脂組合物、密封片及密封體
TWI713880B (zh) * 2018-08-17 2020-12-21 美屬薩摩亞商茂邦電子有限公司 具有六面式保護層之晶片封裝結構及其製造方法
JP7266826B2 (ja) * 2019-06-13 2023-05-01 エルジー・ケム・リミテッド 非導電性フィルムおよび半導体積層体の製造方法
JP2021161274A (ja) * 2020-03-31 2021-10-11 株式会社有沢製作所 粘着テープ
CN113352772B (zh) * 2020-06-24 2022-04-08 山东华菱电子股份有限公司 热敏打印头及其制造方法
WO2022024510A1 (ja) * 2020-07-30 2022-02-03 古河電気工業株式会社 接着剤用組成物及びフィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
CN113897163B (zh) * 2021-12-09 2022-03-11 武汉市三选科技有限公司 一种粘接剂、芯片键合膜及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599007B2 (ja) 1977-07-12 1984-02-28 パロマ工業株式会社 液体燃料の燃焼装置
JPS5487847A (en) 1977-12-26 1979-07-12 Nissin Electric Co Ltd Oil impregnated capacitor
JP2007235022A (ja) 2006-03-03 2007-09-13 Mitsui Chemicals Inc 接着フィルム
JP5286084B2 (ja) * 2006-07-19 2013-09-11 積水化学工業株式会社 ダイシング・ダイボンディングテープ及び半導体チップの製造方法
JP5503342B2 (ja) * 2010-03-10 2014-05-28 古河電気工業株式会社 ダイシング・ダイボンディングテープ
JP5528936B2 (ja) * 2010-07-28 2014-06-25 日東電工株式会社 フリップチップ型半導体裏面用フィルム
JP5419226B2 (ja) * 2010-07-29 2014-02-19 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP2013030500A (ja) * 2011-07-26 2013-02-07 Nitto Denko Corp 半導体装置製造用の接着シート、ダイシングフィルム一体型半導体装置製造用の接着シート、及び、半導体装置製造用の接着シートを有する半導体装置
KR20130075188A (ko) * 2011-12-27 2013-07-05 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 접착 필름
WO2013161864A1 (ja) * 2012-04-26 2013-10-31 新日鉄住金化学株式会社 フィルム状接着剤用組成物及びその製造方法、フィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
KR20170020344A (ko) * 2014-06-11 2017-02-22 닛뽄 가야쿠 가부시키가이샤 터치 패널용 자외선 경화형 수지 조성물, 그것을 사용한 첩합 방법 및 물품

Also Published As

Publication number Publication date
TWI643930B (zh) 2018-12-11
KR102056178B1 (ko) 2019-12-16
SG11201802282VA (en) 2018-04-27
KR20180067522A (ko) 2018-06-20
TW201739871A (zh) 2017-11-16
CN108076669A (zh) 2018-05-25
WO2017168820A1 (ja) 2017-10-05
CN108076669B (zh) 2021-01-15
JPWO2017168820A1 (ja) 2019-02-14
JP6775005B2 (ja) 2020-10-28

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