MY190233A - Pressure-sensitive adhesive tape - Google Patents

Pressure-sensitive adhesive tape

Info

Publication number
MY190233A
MY190233A MYPI2021003938A MYPI2021003938A MY190233A MY 190233 A MY190233 A MY 190233A MY PI2021003938 A MYPI2021003938 A MY PI2021003938A MY PI2021003938 A MYPI2021003938 A MY PI2021003938A MY 190233 A MY190233 A MY 190233A
Authority
MY
Malaysia
Prior art keywords
adhesive tape
pressure
sensitive adhesive
foam substrate
block
Prior art date
Application number
MYPI2021003938A
Other languages
English (en)
Inventor
Akifumi Horio
Makoto Fukuyama
Tatsuya Nishigaki
Satoshi Doi
Yasushi ISHIDO
Hina Yasuda
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of MY190233A publication Critical patent/MY190233A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2353/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Organic Insulating Materials (AREA)
MYPI2021003938A 2019-04-24 2020-04-23 Pressure-sensitive adhesive tape MY190233A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019082813 2019-04-24
PCT/JP2020/017519 WO2020218430A1 (ja) 2019-04-24 2020-04-23 粘着テープ

Publications (1)

Publication Number Publication Date
MY190233A true MY190233A (en) 2022-04-06

Family

ID=72942794

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021003938A MY190233A (en) 2019-04-24 2020-04-23 Pressure-sensitive adhesive tape

Country Status (6)

Country Link
JP (2) JP6966650B2 (enrdf_load_stackoverflow)
KR (2) KR102425598B1 (enrdf_load_stackoverflow)
CN (1) CN113302250B (enrdf_load_stackoverflow)
MY (1) MY190233A (enrdf_load_stackoverflow)
TW (1) TWI833947B (enrdf_load_stackoverflow)
WO (1) WO2020218430A1 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022092201A1 (enrdf_load_stackoverflow) * 2020-10-28 2022-05-05
CN115803404B (zh) * 2020-10-28 2025-03-25 积水化学工业株式会社 粘合带
WO2022092199A1 (ja) * 2020-10-28 2022-05-05 積水化学工業株式会社 粘着テープ
JPWO2022244756A1 (enrdf_load_stackoverflow) * 2021-05-17 2022-11-24
KR20220165381A (ko) * 2021-06-08 2022-12-15 엘지디스플레이 주식회사 표시 모듈 및 이를 포함하는 표시 장치
WO2023074764A1 (ja) * 2021-10-28 2023-05-04 株式会社イノアックコーポレーション 発泡シート及びそれを用いた電子・電気機器
WO2023139826A1 (ja) * 2022-01-18 2023-07-27 日東電工株式会社 発泡部材

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060173124A1 (en) * 2005-02-01 2006-08-03 National Starch And Chemical Investment Holding Corporation Solution pressure sensitive adhesives based on acrylic block copolymers
JP5142218B2 (ja) * 2006-05-26 2013-02-13 電気化学工業株式会社 テ−プ基材及び粘着テープ
JP2009242541A (ja) 2008-03-31 2009-10-22 Sekisui Chem Co Ltd 衝撃吸収テープ
JP5249625B2 (ja) 2008-04-15 2013-07-31 積水化学工業株式会社 表示装置前板用粘着シート
WO2013154137A1 (ja) * 2012-04-13 2013-10-17 Dic株式会社 粘着テープ
DE102013209827A1 (de) * 2012-06-21 2013-12-24 Tesa Se Hitzebeständiges Klebeband
JP6557470B2 (ja) * 2013-09-20 2019-08-07 積水化学工業株式会社 携帯電子機器用両面粘着テープ
JP6367599B2 (ja) * 2013-11-22 2018-08-01 日東電工株式会社 両面粘着シート
JP6314341B2 (ja) * 2014-06-26 2018-04-25 Dic株式会社 両面粘着テープ及び物品
KR20170052525A (ko) * 2014-09-02 2017-05-12 세키스이가가쿠 고교가부시키가이샤 휴대 전자 기기용 양면 점착 테이프
CN107109148B (zh) * 2014-11-11 2021-06-22 株式会社寺冈制作所 具有发泡树脂基材的粘着带及其制造方法
JPWO2017131082A1 (ja) * 2016-01-26 2018-11-15 積水化学工業株式会社 両面粘着テープ
EP3336153B1 (en) * 2016-12-19 2020-11-25 3M Innovative Properties Company Rubber-based multilayer pressure-sensitive adhesive assembly having low voc characteristics
KR102168746B1 (ko) * 2017-03-13 2020-10-22 주식회사 엘지화학 폼 필름, 이의 제조방법 및 이를 포함하는 폼 점착 테이프
JP7460315B2 (ja) * 2017-03-31 2024-04-02 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
JP6878098B2 (ja) * 2017-03-31 2021-05-26 積水化学工業株式会社 発泡体シート及び粘着テープ
KR101989614B1 (ko) * 2017-09-27 2019-09-30 주식회사 애니원 고온/고습 환경에서 내구성이 개선된 충격 흡수 점착 테이프 및 그 제조 방법
WO2020059791A1 (ja) 2018-09-21 2020-03-26 積水化学工業株式会社 両面粘着テープ

Also Published As

Publication number Publication date
JPWO2020218430A1 (ja) 2021-09-13
TW202104490A (zh) 2021-02-01
KR102425598B1 (ko) 2022-07-27
CN113302250B (zh) 2023-02-17
CN113302250A (zh) 2021-08-24
KR20220103829A (ko) 2022-07-22
JP6966650B2 (ja) 2021-11-17
JP2021191877A (ja) 2021-12-16
WO2020218430A1 (ja) 2020-10-29
JP7547298B2 (ja) 2024-09-09
KR102559150B1 (ko) 2023-07-24
KR20210079375A (ko) 2021-06-29
TWI833947B (zh) 2024-03-01

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