MY173863A - Resin sealing compression molding method and apparatus for semiconductor chips, and resin burr prevention tape - Google Patents
Resin sealing compression molding method and apparatus for semiconductor chips, and resin burr prevention tapeInfo
- Publication number
- MY173863A MY173863A MYPI2013000198A MYPI2013000198A MY173863A MY 173863 A MY173863 A MY 173863A MY PI2013000198 A MYPI2013000198 A MY PI2013000198A MY PI2013000198 A MYPI2013000198 A MY PI2013000198A MY 173863 A MY173863 A MY 173863A
- Authority
- MY
- Malaysia
- Prior art keywords
- resin
- lower die
- sealed
- cavity
- molding method
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 9
- 229920005989 resin Polymers 0.000 title abstract 9
- 230000002265 prevention Effects 0.000 title abstract 2
- 238000000748 compression moulding Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012020668A JP6087507B2 (ja) | 2012-02-02 | 2012-02-02 | 半導体チップの圧縮樹脂封止成形方法及び樹脂封止された半導体チップの生産方法 |
| JP2012020663A JP5723800B2 (ja) | 2012-02-02 | 2012-02-02 | 半導体チップの圧縮樹脂封止成形方法及び装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY173863A true MY173863A (en) | 2020-02-25 |
Family
ID=48927092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2013000198A MY173863A (en) | 2012-02-02 | 2013-01-18 | Resin sealing compression molding method and apparatus for semiconductor chips, and resin burr prevention tape |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101432423B1 (ko) |
| CN (1) | CN103247739B (ko) |
| MY (1) | MY173863A (ko) |
| TW (1) | TWI527273B (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102455987B1 (ko) * | 2014-07-22 | 2022-10-18 | 아피쿠 야마다 가부시키가이샤 | 성형 금형, 성형 장치, 성형품의 제조 방법 및 수지 몰드 방법 |
| JP6525580B2 (ja) * | 2014-12-24 | 2019-06-05 | Ｔｏｗａ株式会社 | 樹脂成形装置及び樹脂成形方法 |
| CN116504702B (zh) * | 2023-06-26 | 2023-09-05 | 山东联高智能科技有限公司 | 一种半导体元件加工设备 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4388654B2 (ja) * | 2000-02-01 | 2009-12-24 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
| JP2002151531A (ja) * | 2000-11-15 | 2002-05-24 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| JP5325933B2 (ja) * | 2004-08-26 | 2013-10-23 | アピックヤマダ株式会社 | 樹脂モールド金型 |
| JP4834407B2 (ja) * | 2006-01-17 | 2011-12-14 | アピックヤマダ株式会社 | 樹脂モールド方法および樹脂モールド装置 |
| JP2008041846A (ja) | 2006-08-04 | 2008-02-21 | Towa Corp | フリップチップの樹脂注入成形方法及び金型 |
| US7709853B2 (en) | 2007-02-12 | 2010-05-04 | Cree, Inc. | Packaged semiconductor light emitting devices having multiple optical elements |
| JP2008207450A (ja) * | 2007-02-27 | 2008-09-11 | Towa Corp | 発光素子の圧縮成形方法 |
-
2013
- 2013-01-04 TW TW102100216A patent/TWI527273B/zh active
- 2013-01-16 KR KR1020130004818A patent/KR101432423B1/ko active IP Right Grant
- 2013-01-18 MY MYPI2013000198A patent/MY173863A/en unknown
- 2013-01-22 CN CN201310022344.8A patent/CN103247739B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR101432423B1 (ko) | 2014-08-20 |
| KR20130089588A (ko) | 2013-08-12 |
| CN103247739A (zh) | 2013-08-14 |
| TW201334234A (zh) | 2013-08-16 |
| CN103247739B (zh) | 2015-12-09 |
| TWI527273B (zh) | 2016-03-21 |
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