MY173524A - Electro-deposited copper foil, method of manufacturing electro-deposited copper foil, and surface-treated copper foil manufactured by using electro-deposited copper foil - Google Patents

Electro-deposited copper foil, method of manufacturing electro-deposited copper foil, and surface-treated copper foil manufactured by using electro-deposited copper foil

Info

Publication number
MY173524A
MY173524A MYPI2015702490A MYPI2015702490A MY173524A MY 173524 A MY173524 A MY 173524A MY PI2015702490 A MYPI2015702490 A MY PI2015702490A MY PI2015702490 A MYPI2015702490 A MY PI2015702490A MY 173524 A MY173524 A MY 173524A
Authority
MY
Malaysia
Prior art keywords
copper foil
electro
deposited copper
deposited
manufacturing
Prior art date
Application number
MYPI2015702490A
Other languages
English (en)
Inventor
Sakiko Tomonaga
Koichi Miyake
Kazutaka Hozumi
Hiroaki Nakahara
Yasuhiro Shibata
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY173524A publication Critical patent/MY173524A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
MYPI2015702490A 2013-01-31 2014-01-30 Electro-deposited copper foil, method of manufacturing electro-deposited copper foil, and surface-treated copper foil manufactured by using electro-deposited copper foil MY173524A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013017620 2013-01-31
PCT/JP2014/052069 WO2014119656A1 (ja) 2013-01-31 2014-01-30 電解銅箔、その電解銅箔の製造方法及びその電解銅箔を用いて得られる表面処理銅箔

Publications (1)

Publication Number Publication Date
MY173524A true MY173524A (en) 2020-01-31

Family

ID=51262367

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2015702490A MY173524A (en) 2013-01-31 2014-01-30 Electro-deposited copper foil, method of manufacturing electro-deposited copper foil, and surface-treated copper foil manufactured by using electro-deposited copper foil
MYPI2019003304A MY174169A (en) 2013-01-31 2014-01-30 Electro-deposited copper foil and surface-treated copper foil manufactured by using the electro-deposited copper foil

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI2019003304A MY174169A (en) 2013-01-31 2014-01-30 Electro-deposited copper foil and surface-treated copper foil manufactured by using the electro-deposited copper foil

Country Status (7)

Country Link
JP (2) JP6373764B2 (zh)
KR (2) KR102227681B1 (zh)
CN (1) CN104955988B (zh)
MY (2) MY173524A (zh)
PH (1) PH12015501706A1 (zh)
TW (1) TWI518210B (zh)
WO (1) WO2014119656A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102122425B1 (ko) 2015-06-18 2020-06-12 케이씨에프테크놀로지스 주식회사 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지
KR101897474B1 (ko) * 2015-06-26 2018-09-12 케이씨에프테크놀로지스 주식회사 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지
JP6067910B1 (ja) * 2015-11-04 2017-01-25 古河電気工業株式会社 電解銅箔、その電解銅箔を用いたリチウムイオン二次電池
JP6440656B2 (ja) * 2016-07-12 2018-12-19 古河電気工業株式会社 電解銅箔
KR102646185B1 (ko) 2017-02-27 2024-03-08 에스케이넥실리스 주식회사 우수한 접착력을 갖는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
JP6757773B2 (ja) * 2018-09-26 2020-09-23 古河電気工業株式会社 電解銅箔
JP6827022B2 (ja) * 2018-10-03 2021-02-10 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
CN111455414A (zh) * 2020-03-09 2020-07-28 深圳市惟华电子科技有限公司 一种用于生产渐变式电解铜箔的添加剂
KR20220043617A (ko) * 2020-09-29 2022-04-05 에스케이넥실리스 주식회사 고강도 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지 및 그것의 제조방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001011685A (ja) * 1999-06-30 2001-01-16 Mitsui Mining & Smelting Co Ltd 電解銅箔およびその製造方法
KR100454270B1 (ko) * 2002-11-29 2004-10-26 엘지전선 주식회사 저조도 전해동박의 제조방법 및 전해동박
WO2004090197A1 (ja) * 2003-04-03 2004-10-21 Fukuda Metal Foil & Powder Co., Ltd. 低粗面電解銅箔及びその製造方法
JP4273309B2 (ja) 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
JP5255229B2 (ja) 2006-04-28 2013-08-07 三井金属鉱業株式会社 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法
CN101426959B (zh) * 2006-04-28 2010-11-17 三井金属矿业株式会社 电解铜箔、采用该电解铜箔的表面处理铜箔及采用该表面处理铜箔的覆铜层压板以及该电解铜箔的制造方法
JP2008285727A (ja) 2007-05-18 2008-11-27 Furukawa Circuit Foil Kk 高抗張力電解銅箔及びその製造方法
JP5588607B2 (ja) 2007-10-31 2014-09-10 三井金属鉱業株式会社 電解銅箔及びその電解銅箔の製造方法
CN102124148B (zh) * 2008-07-07 2013-11-06 古河电气工业株式会社 电沉积铜箔和覆铜层合板
JP5598700B2 (ja) 2010-02-25 2014-10-01 福田金属箔粉工業株式会社 電解銅箔及びその製造方法
CN102959135B (zh) * 2010-07-01 2016-03-09 三井金属矿业株式会社 电解铜箔以及其制造方法
CN103221584B (zh) * 2010-11-22 2016-01-06 三井金属矿业株式会社 表面处理铜箔
WO2012091060A1 (ja) 2010-12-27 2012-07-05 古河電気工業株式会社 リチウムイオン二次電池、その二次電池用電極、その二次電池の電極用電解銅箔
JP5771392B2 (ja) 2010-12-28 2015-08-26 日本電解株式会社 電解銅箔およびその製造方法
JP5379928B2 (ja) * 2011-06-30 2013-12-25 古河電気工業株式会社 電解銅箔、該電解銅箔の製造方法及び該電解銅箔を集電体とするリチウムイオン二次電池
KR102101046B1 (ko) * 2012-05-22 2020-04-14 미쓰이금속광업주식회사 구리박, 부극 집전체 및 비수계 2차 전지의 부극재

Also Published As

Publication number Publication date
KR102272695B1 (ko) 2021-07-05
CN104955988A (zh) 2015-09-30
TWI518210B (zh) 2016-01-21
MY174169A (en) 2020-03-12
JP6373764B2 (ja) 2018-08-15
KR20150114484A (ko) 2015-10-12
KR20190006075A (ko) 2019-01-16
TW201437435A (zh) 2014-10-01
JP6529646B2 (ja) 2019-06-12
JPWO2014119656A1 (ja) 2017-01-26
PH12015501706A1 (en) 2015-10-12
CN104955988B (zh) 2018-01-30
KR102227681B1 (ko) 2021-03-15
JP2018165411A (ja) 2018-10-25
WO2014119656A1 (ja) 2014-08-07

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