MY168645A - Plating bath for electroless deposition of nickel layers - Google Patents
Plating bath for electroless deposition of nickel layersInfo
- Publication number
- MY168645A MY168645A MYPI2014703240A MYPI2014703240A MY168645A MY 168645 A MY168645 A MY 168645A MY PI2014703240 A MYPI2014703240 A MY PI2014703240A MY PI2014703240 A MYPI2014703240 A MY PI2014703240A MY 168645 A MY168645 A MY 168645A
- Authority
- MY
- Malaysia
- Prior art keywords
- plating bath
- electroless deposition
- nickel layers
- nickel
- deposition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
- H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
- H10W20/037—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics the barrier, adhesion or liner layers being on top of a main fill metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20120170693 EP2671969A1 (en) | 2012-06-04 | 2012-06-04 | Plating bath for electroless deposition of nickel layers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY168645A true MY168645A (en) | 2018-11-27 |
Family
ID=48626419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2014703240A MY168645A (en) | 2012-06-04 | 2013-05-31 | Plating bath for electroless deposition of nickel layers |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9175399B2 (https=) |
| EP (2) | EP2671969A1 (https=) |
| JP (1) | JP6161691B2 (https=) |
| KR (1) | KR101930585B1 (https=) |
| CN (1) | CN104321463B (https=) |
| BR (1) | BR112014028715B1 (https=) |
| CA (1) | CA2875317C (https=) |
| ES (1) | ES2688547T3 (https=) |
| MY (1) | MY168645A (https=) |
| TW (1) | TWI560316B (https=) |
| WO (1) | WO2013182489A2 (https=) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103952687B (zh) * | 2014-05-05 | 2017-02-15 | 广东东硕科技有限公司 | 印制线路板化学镀镍的防止渗镀方法 |
| US11685999B2 (en) * | 2014-06-02 | 2023-06-27 | Macdermid Acumen, Inc. | Aqueous electroless nickel plating bath and method of using the same |
| US9708693B2 (en) | 2014-06-03 | 2017-07-18 | Macdermid Acumen, Inc. | High phosphorus electroless nickel |
| JP6352079B2 (ja) * | 2014-07-03 | 2018-07-04 | 奥野製薬工業株式会社 | 無電解めっき液、めっき皮膜、めっき品及びめっき皮膜の形成方法 |
| EP3026143A1 (en) * | 2014-11-26 | 2016-06-01 | ATOTECH Deutschland GmbH | Plating bath and method for electroless deposition of nickel layers |
| ES2639300T3 (es) | 2014-12-16 | 2017-10-26 | Atotech Deutschland Gmbh | Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas |
| PH12017501562B1 (en) | 2015-03-20 | 2024-02-14 | Atotech Deutschland Gmbh | Activation method for silicon substrates |
| WO2017004424A1 (en) * | 2015-06-30 | 2017-01-05 | Enthone Inc. | Cobalt filling of interconnects in microelectronics |
| TWI707061B (zh) * | 2015-11-27 | 2020-10-11 | 德商德國艾托特克公司 | 鈀之電鍍浴組合物及無電電鍍方法 |
| CN105624656B (zh) * | 2015-12-30 | 2018-05-01 | 大连大学 | 一种化学镀Ni-P/Ni-Mo-P-PTFE复合结构镀层及其制备方法 |
| EP3190208B1 (en) * | 2016-01-06 | 2018-09-12 | ATOTECH Deutschland GmbH | Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys |
| JP6926120B2 (ja) | 2016-05-04 | 2021-08-25 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ | 基板表面の活性化を含む基板表面に金属または金属合金を析出させるための方法 |
| US10577692B2 (en) * | 2017-01-05 | 2020-03-03 | International Business Machines Corporation | Pretreatment of iron-based substrates for electroless plating |
| CN107313034A (zh) * | 2017-06-27 | 2017-11-03 | 佛山科学技术学院 | 一种高磷化学镀镍钴锰磷合金溶液及其制备方法 |
| CN107475699A (zh) * | 2017-08-28 | 2017-12-15 | 中石化炼化工程（集团）股份有限公司 | 气液分配器的防腐涂层、制备方法及其应用 |
| EP3456870A1 (en) * | 2017-09-13 | 2019-03-20 | ATOTECH Deutschland GmbH | A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy |
| KR102036329B1 (ko) * | 2017-09-20 | 2019-10-25 | 한국기계연구원 | 무전해 도금액, 무전해 도금 방법 및 이를 이용하여 형성된 도금층 |
| KR102036334B1 (ko) * | 2017-09-20 | 2019-10-25 | 한국기계연구원 | 무전해 도금액 및 무전해 도금 방법 |
| KR101932963B1 (ko) * | 2018-02-20 | 2018-12-27 | 한국기계연구원 | 촉매-프리 무전해도금용 조성물 및 이를 이용한 무전해도금 방법 |
| CA3092257C (en) * | 2018-02-26 | 2023-01-24 | Graphene Leaders Canada (Glc) Inc. | Electroless plating of objects with carbon-based material |
| CN108607586B (zh) * | 2018-04-28 | 2021-02-05 | 重庆长安汽车股份有限公司 | 一种镍磷化物、其制备方法及电解水制氢的方法 |
| CN112996933B (zh) * | 2018-11-06 | 2023-08-08 | 德国艾托特克公司 | 无电镍镀敷溶液 |
| KR102250500B1 (ko) * | 2019-03-18 | 2021-05-12 | (주)엠에스씨 | 자동차 lds 전장 부품용 무전해 중성-중온 니켈도금액 |
| CN110079794A (zh) * | 2019-05-08 | 2019-08-02 | 深圳市长裕环保有限公司 | 一种纳米易焊高硬耐磨防腐装饰合金催化液及其制备方法 |
| DE102019112883B4 (de) * | 2019-05-16 | 2024-05-16 | Pac Tech - Packaging Technologies Gmbh | Beschichtungsbad zur stromlosen Beschichtung eines Substrats |
| US20230178430A1 (en) * | 2020-05-08 | 2023-06-08 | Lam Research Corporation | Electroplating cobalt, nickel, and alloys thereof |
| LT6899B (lt) * | 2020-08-27 | 2022-04-11 | Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras | Vario paviršiaus cheminio nikeliavimo būdas, nenaudojant aktyvavimo paladžiu |
| US11505867B1 (en) | 2021-06-14 | 2022-11-22 | Consolidated Nuclear Security, LLC | Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore |
| US20230103643A1 (en) * | 2021-10-04 | 2023-04-06 | Applied Materials, Inc. | ADVANCED BARRIER NICKEL OXIDE (BNiO) COATING DEVELOPMENT FOR THE PROCESS CHAMBER COMPONENTS |
| US12522923B2 (en) | 2022-03-11 | 2026-01-13 | Applied Materials, Inc. | Advanced barrier nickel oxide (BNiO) coating development for process chamber components via ozone treatment |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2658841A (en) | 1950-11-08 | 1953-11-10 | Gen Am Transport | Process of chemical nickel plating and bath therefor |
| US2658842A (en) | 1951-01-04 | 1953-11-10 | Gen Am Transport | Process of chemical nickel plating and bath therefor |
| US2762723A (en) | 1953-06-03 | 1956-09-11 | Gen American Transporation Cor | Processes of chemical nickel plating and baths therefor |
| US2847327A (en) | 1954-10-25 | 1958-08-12 | Gen Am Transport | Processes of chemical nickel plating and baths therefor |
| US2935425A (en) | 1954-12-29 | 1960-05-03 | Gen Am Transport | Chemical nickel plating processes and baths therefor |
| US2841602A (en) * | 1955-10-04 | 1958-07-01 | Udylite Res Corp | Alkynoxy acids |
| US3338726A (en) | 1958-10-01 | 1967-08-29 | Du Pont | Chemical reduction plating process and bath |
| US3457089A (en) * | 1967-04-07 | 1969-07-22 | Shipley Co | Electroless copperplating |
| US3597266A (en) | 1968-09-23 | 1971-08-03 | Enthone | Electroless nickel plating |
| US3915716A (en) | 1969-04-17 | 1975-10-28 | Schering Ag | Chemical nickel plating bath |
| US3649308A (en) * | 1970-05-21 | 1972-03-14 | Shipley Co | Stabilized electroless plating solutions |
| JPS504327B1 (https=) * | 1970-06-03 | 1975-02-18 | ||
| DE2028950B2 (de) | 1970-06-12 | 1976-05-13 | Shipley Co., Inc., Newton, Mass. (V.SLA.) | Waessrige loesung zum stromlosen abschneiden von nickel, kobalt oder legierungen davon |
| GB1315212A (en) * | 1970-07-31 | 1973-05-02 | Shipley Co | Electroless nickel and or cobalt plating solutions |
| US3953654A (en) | 1973-08-13 | 1976-04-27 | Rca Corporation | Temperature-stable non-magnetic alloy |
| US4016051A (en) * | 1975-05-02 | 1977-04-05 | Starlite Chemicals, Inc. | Additives for bright plating nickel, cobalt and nickel-cobalt alloys |
| US4435254A (en) * | 1978-11-01 | 1984-03-06 | M&T Chemicals Inc. | Bright nickel electroplating |
| US4466233A (en) | 1982-09-30 | 1984-08-21 | Thesman Industries, Inc. | Mower drive assembly |
| US4467067A (en) | 1982-12-27 | 1984-08-21 | Shipley Company | Electroless nickel plating |
| US4600609A (en) * | 1985-05-03 | 1986-07-15 | Macdermid, Incorporated | Method and composition for electroless nickel deposition |
| US4699811A (en) * | 1986-09-16 | 1987-10-13 | Macdermid, Incorporated | Chromium mask for electroless nickel or copper plating |
| US4780342A (en) | 1987-07-20 | 1988-10-25 | General Electric Company | Electroless nickel plating composition and method for its preparation and use |
| JP3115095B2 (ja) * | 1992-04-20 | 2000-12-04 | ディップソール株式会社 | 無電解メッキ液及びそれを使用するメッキ方法 |
| DE10327374B4 (de) * | 2003-06-18 | 2006-07-06 | Raschig Gmbh | Verwendung von propansulfonierten und 2-Hydroxy-propansulfonierten Alkylaminaloxylaten als Hilfsmittel zur elektrolytischen Abscheidung von metallischen Schichten und galvanische Bäder enthaltend diese |
| US7223299B2 (en) | 2003-09-02 | 2007-05-29 | Atotech Deutschland Gmbh | Composition and process for improving the adhesion of a siccative organic coating compositions to metal substrates |
| JP2005126734A (ja) * | 2003-10-21 | 2005-05-19 | C Uyemura & Co Ltd | 無電解ニッケルめっき浴及びそれを用いためっき方法 |
| WO2005078163A1 (en) * | 2004-02-05 | 2005-08-25 | Taskem, Inc. | Ternary and quaternary alloys to replace chromium |
| WO2007002070A2 (en) * | 2005-06-20 | 2007-01-04 | Pavco, Inc. | Zinc-nickel alloy electroplating system |
| JP5158320B2 (ja) * | 2007-03-30 | 2013-03-06 | 上村工業株式会社 | 無電解ニッケルめっき方法、リンクチェーン及びその製造方法 |
| CN102272356A (zh) * | 2008-11-07 | 2011-12-07 | 克斯塔里克公司 | 电沉积液、系统及方法 |
| EP2639335B1 (en) * | 2012-03-14 | 2015-09-16 | Atotech Deutschland GmbH | Alkaline plating bath for electroless deposition of cobalt alloys |
-
2012
- 2012-06-04 EP EP20120170693 patent/EP2671969A1/en not_active Withdrawn
-
2013
- 2013-05-31 WO PCT/EP2013/061280 patent/WO2013182489A2/en not_active Ceased
- 2013-05-31 MY MYPI2014703240A patent/MY168645A/en unknown
- 2013-05-31 KR KR1020147033024A patent/KR101930585B1/ko active Active
- 2013-05-31 EP EP13728988.0A patent/EP2855732B1/en active Active
- 2013-05-31 CN CN201380026312.3A patent/CN104321463B/zh active Active
- 2013-05-31 US US14/398,195 patent/US9175399B2/en active Active
- 2013-05-31 ES ES13728988.0T patent/ES2688547T3/es active Active
- 2013-05-31 BR BR112014028715-5A patent/BR112014028715B1/pt not_active IP Right Cessation
- 2013-05-31 JP JP2015515485A patent/JP6161691B2/ja active Active
- 2013-05-31 CA CA2875317A patent/CA2875317C/en active Active
- 2013-06-04 TW TW102119832A patent/TWI560316B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US20150110965A1 (en) | 2015-04-23 |
| JP2015524024A (ja) | 2015-08-20 |
| EP2855732A2 (en) | 2015-04-08 |
| CN104321463B (zh) | 2016-12-28 |
| KR20150024317A (ko) | 2015-03-06 |
| BR112014028715A2 (pt) | 2017-06-27 |
| CA2875317A1 (en) | 2013-12-12 |
| BR112014028715B1 (pt) | 2022-01-25 |
| EP2855732B1 (en) | 2018-07-18 |
| CA2875317C (en) | 2020-03-31 |
| WO2013182489A3 (en) | 2014-07-17 |
| JP6161691B2 (ja) | 2017-07-12 |
| KR101930585B1 (ko) | 2018-12-18 |
| ES2688547T3 (es) | 2018-11-05 |
| TWI560316B (en) | 2016-12-01 |
| TW201406992A (zh) | 2014-02-16 |
| WO2013182489A2 (en) | 2013-12-12 |
| CN104321463A (zh) | 2015-01-28 |
| EP2671969A1 (en) | 2013-12-11 |
| US9175399B2 (en) | 2015-11-03 |
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