MY161535A - Curable epoxy resin composition - Google Patents
Curable epoxy resin compositionInfo
- Publication number
- MY161535A MY161535A MYPI2013001561A MYPI2013001561A MY161535A MY 161535 A MY161535 A MY 161535A MY PI2013001561 A MYPI2013001561 A MY PI2013001561A MY PI2013001561 A MYPI2013001561 A MY PI2013001561A MY 161535 A MY161535 A MY 161535A
- Authority
- MY
- Malaysia
- Prior art keywords
- resin composition
- epoxy resin
- curable epoxy
- alicyclic
- compound
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 abstract 1
- -1 ISOCYANURATE COMPOUND Chemical class 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 229920001225 polyester resin Polymers 0.000 abstract 1
- 239000004645 polyester resin Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/26—Di-epoxy compounds heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011002457 | 2011-01-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY161535A true MY161535A (en) | 2017-04-28 |
Family
ID=46457451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2013001561A MY161535A (en) | 2011-01-07 | 2011-12-21 | Curable epoxy resin composition |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5852014B2 (ko) |
KR (1) | KR101832537B1 (ko) |
CN (1) | CN103154072B (ko) |
MY (1) | MY161535A (ko) |
TW (1) | TWI512034B (ko) |
WO (1) | WO2012093591A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103649216A (zh) * | 2011-09-06 | 2014-03-19 | 株式会社大赛璐 | 光半导体密封用树脂组合物和使用其的光半导体装置 |
WO2014038446A1 (ja) * | 2012-09-07 | 2014-03-13 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物及びその硬化物、並びに光半導体装置 |
JP6185703B2 (ja) * | 2012-10-19 | 2017-08-23 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物及びその硬化物、並びに光半導体装置 |
JP6059538B2 (ja) * | 2013-01-09 | 2017-01-11 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
WO2014109317A1 (ja) * | 2013-01-09 | 2014-07-17 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
JP2017125212A (ja) * | 2017-04-10 | 2017-07-20 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物及びその硬化物、並びに光半導体装置 |
WO2019187988A1 (ja) | 2018-03-28 | 2019-10-03 | 日本板硝子株式会社 | 樹脂組成物の硬化物、積層体、及び樹脂組成物 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3477111B2 (ja) * | 1999-06-01 | 2003-12-10 | 四国化成工業株式会社 | 熱硬化性エポキシ樹脂組成物 |
JP4560982B2 (ja) * | 2000-04-17 | 2010-10-13 | 三菱電機株式会社 | 高圧回転機用絶縁コイルの製造方法 |
JP2003277591A (ja) * | 2002-03-26 | 2003-10-02 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、プリプレグ及び積層板 |
JP3787658B2 (ja) * | 2002-10-09 | 2006-06-21 | よこはまティーエルオー株式会社 | エポキシ樹脂組成物 |
CN102850721A (zh) * | 2005-11-25 | 2013-01-02 | 日立化成工业株式会社 | 电子零件用液状树脂组合物及电子零件装置 |
JP5638812B2 (ja) * | 2010-02-01 | 2014-12-10 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
-
2011
- 2011-12-21 JP JP2012551830A patent/JP5852014B2/ja active Active
- 2011-12-21 CN CN201180048615.6A patent/CN103154072B/zh active Active
- 2011-12-21 WO PCT/JP2011/079691 patent/WO2012093591A1/ja active Application Filing
- 2011-12-21 KR KR1020137013078A patent/KR101832537B1/ko active IP Right Grant
- 2011-12-21 MY MYPI2013001561A patent/MY161535A/en unknown
-
2012
- 2012-01-06 TW TW101100545A patent/TWI512034B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN103154072B (zh) | 2015-11-25 |
KR101832537B1 (ko) | 2018-02-26 |
TW201233726A (en) | 2012-08-16 |
CN103154072A (zh) | 2013-06-12 |
WO2012093591A1 (ja) | 2012-07-12 |
TWI512034B (zh) | 2015-12-11 |
JPWO2012093591A1 (ja) | 2014-06-09 |
JP5852014B2 (ja) | 2016-02-03 |
KR20140009202A (ko) | 2014-01-22 |
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