MY160200A - Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition - Google Patents

Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition

Info

Publication number
MY160200A
MY160200A MYPI2012003298A MYPI2012003298A MY160200A MY 160200 A MY160200 A MY 160200A MY PI2012003298 A MYPI2012003298 A MY PI2012003298A MY PI2012003298 A MYPI2012003298 A MY PI2012003298A MY 160200 A MY160200 A MY 160200A
Authority
MY
Malaysia
Prior art keywords
resin composition
optical semiconductor
curing agent
compounds
sealing
Prior art date
Application number
MYPI2012003298A
Other languages
English (en)
Inventor
Noriko Kimura
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of MY160200A publication Critical patent/MY160200A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
MYPI2012003298A 2010-02-25 2011-02-04 Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition MY160200A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010040950A JP5606752B2 (ja) 2010-02-25 2010-02-25 光半導体封止用樹脂組成物とこれを使用した光半導体装置

Publications (1)

Publication Number Publication Date
MY160200A true MY160200A (en) 2017-02-28

Family

ID=44506610

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012003298A MY160200A (en) 2010-02-25 2011-02-04 Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition

Country Status (5)

Country Link
JP (1) JP5606752B2 (zh)
CN (1) CN102782000B (zh)
MY (1) MY160200A (zh)
TW (1) TWI500651B (zh)
WO (1) WO2011105192A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012036320A (ja) * 2010-08-10 2012-02-23 Daicel Corp 硬化性樹脂組成物及びその硬化物
JP2012077257A (ja) * 2010-10-06 2012-04-19 Daicel Corp 硬化物の製造方法及び硬化物
JP6047294B2 (ja) * 2012-03-30 2016-12-21 株式会社ダイセル 硬化性エポキシ樹脂組成物
TWI494339B (zh) 2012-10-23 2015-08-01 Ind Tech Res Inst 部分酯化環氧樹脂及應用其製成之環氧樹脂組成物及其製法
JP6332907B2 (ja) 2013-02-14 2018-05-30 東京応化工業株式会社 封止用樹脂組成物、表示装置、及び光半導体装置
JP6523780B2 (ja) 2014-09-29 2019-06-05 東京応化工業株式会社 膜形成性組成物、及びそれを用いた硬化被膜の製造方法
JP6512699B2 (ja) * 2015-03-30 2019-05-15 ペルノックス株式会社 半導体封止用一液性エポキシ樹脂組成物、硬化物、半導体部品の製造方法及び半導体部品
CN108117718B (zh) * 2016-11-28 2020-05-15 联茂电子股份有限公司 无卤素树脂组成物
KR102140259B1 (ko) * 2018-01-11 2020-07-31 주식회사 엘지화학 반도체 몰딩용 에폭시 수지 조성물, 이를 이용한 몰딩필름 및 반도체 패키지

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0258530A (ja) * 1988-08-23 1990-02-27 Toshiba Corp エポキシ樹脂組成物
WO2005028536A1 (ja) * 2003-09-22 2005-03-31 Mitsubishi Chemical Corporation 脂環式エポキシ樹脂、その製造方法、その組成物、エポキシ樹脂硬化体および脂環式エポキシ樹脂組成物の用途
CN100513453C (zh) * 2003-09-22 2009-07-15 三菱化学株式会社 脂环式环氧树脂、其制造方法、其组合物、环氧树脂固化物以及脂环式环氧树脂组合物的用途
JP2005225964A (ja) * 2004-02-12 2005-08-25 Jsr Corp 光半導体封止用組成物
JP2005263869A (ja) * 2004-03-16 2005-09-29 Nagase Chemtex Corp 光半導体封止用樹脂組成物
WO2005100445A1 (ja) * 2004-04-16 2005-10-27 Jsr Corporation 光半導体封止用組成物、光半導体封止材および光半導体封止用組成物の製造方法
JP4578188B2 (ja) * 2004-09-15 2010-11-10 ダイセル化学工業株式会社 エポキシ樹脂組成物、光半導体封止剤及び光半導体装置
JP2006225515A (ja) * 2005-02-17 2006-08-31 Jsr Corp 光半導体、その封止材および封止用組成物
US20090163652A1 (en) * 2007-12-19 2009-06-25 Chisso Corporation Thermosetting resin composition and use thereof
JP5013127B2 (ja) * 2007-12-19 2012-08-29 Ｊｎｃ株式会社 熱硬化性樹脂組成物およびその用途
JP2009191217A (ja) * 2008-02-18 2009-08-27 Shin Etsu Chem Co Ltd エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP5077894B2 (ja) * 2008-03-28 2012-11-21 信越化学工業株式会社 光半導体素子封止用エポキシ・シリコーン混成樹脂組成物及びそれからなるトランスファー成型用タブレット
JP5669289B2 (ja) * 2008-05-23 2015-02-12 新日鉄住金化学株式会社 新規エポキシ樹脂及びその製造方法、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及び該エポキシ樹脂を必須成分とする硬化物
JP2010031149A (ja) * 2008-07-29 2010-02-12 Shin-Etsu Chemical Co Ltd 光半導体素子封止用樹脂組成物

Also Published As

Publication number Publication date
TW201139493A (en) 2011-11-16
CN102782000B (zh) 2014-12-31
JP2011174023A (ja) 2011-09-08
TWI500651B (zh) 2015-09-21
WO2011105192A1 (ja) 2011-09-01
JP5606752B2 (ja) 2014-10-15
CN102782000A (zh) 2012-11-14

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