MX2015008249A - Composicion de adhesivo termicamente conductora, electricamente conductor. - Google Patents

Composicion de adhesivo termicamente conductora, electricamente conductor.

Info

Publication number
MX2015008249A
MX2015008249A MX2015008249A MX2015008249A MX2015008249A MX 2015008249 A MX2015008249 A MX 2015008249A MX 2015008249 A MX2015008249 A MX 2015008249A MX 2015008249 A MX2015008249 A MX 2015008249A MX 2015008249 A MX2015008249 A MX 2015008249A
Authority
MX
Mexico
Prior art keywords
conductive
electrically
thermally
adhesive composition
conductive adhesive
Prior art date
Application number
MX2015008249A
Other languages
English (en)
Inventor
Irifune Akira
Ichikawa Natsuko
Harada Miyuki
Furusho Rikia
Okuda Akihiko
Ochi Mitsukazu
Kondo Takeshi
Original Assignee
Univ Kansai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Kansai filed Critical Univ Kansai
Publication of MX2015008249A publication Critical patent/MX2015008249A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Inorganic Chemistry (AREA)

Abstract

Se proporciona una composición de adhesivo térmicamente conductora, eléctricamente conductora, que tiene una alta conductividad térmica y la conductividad eléctrica consistente para su uso como un material de matriz de unión. Una composición adhesiva térmicamente conductora, eléctricamente conductora, que incluye: - (A) una carga eléctricamente conductora, - (B) una resina epoxi, y - (C) un agente de curado, la carga eléctricamente conductora (A) siendo un polvo fino de plata submicrométrica, y el contenido del polvo fino de plata con un 75 a 94% en masa de la cantidad total de la composición de adhesivo térmicamente conductora, eléctricamente conductora, - el contenido de la resina epoxi (B) es de 5 a 20% en masa de la cantidad total de la composición de adhesivo térmicamente conductora, eléctricamente conductora, - el agente de curado (C) es un compuesto de Fórmula (I), (II), o (III), y el contenido del compuesto que es de 0.4 a 2.4 equivalentes molares en términos de equivalente de hidrógeno activo, con relación a 1 equivalente molar de epoxi grupos en la resina epoxi (B) , y - durante el curado por calor y antes de que la carga eléctricamente conductora (A) comienza a sinterizar, la composición de adhesivo térmicamente conductora, eléctricamente conductor está en un estado no curado o un estado semi-curado: (ver Fórmula) (en la que X es -SO2-, -CH2-, o -O-, y R1 a R4 son independientemente un átomo de hidrógeno o un grupo alquilo inferior) (ver Fórmula) (en la que X es -SO2-, -CH2-, o -O-, y R5 a R8 son independientemente un átomo de hidrógeno o un grupo alquilo inferior), y (ver Fórmula) (en la que X es -SO2-, -CH2-, o -O-, y R9 a R12 son independientemente un átomo de hidrógeno o un grupo alquilo inferior).
MX2015008249A 2012-12-27 2013-12-25 Composicion de adhesivo termicamente conductora, electricamente conductor. MX2015008249A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012284866A JP5642147B2 (ja) 2012-12-27 2012-12-27 熱伝導性導電性接着剤組成物
PCT/JP2013/084552 WO2014104046A1 (ja) 2012-12-27 2013-12-25 熱伝導性導電性接着剤組成物

Publications (1)

Publication Number Publication Date
MX2015008249A true MX2015008249A (es) 2016-09-19

Family

ID=51021126

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015008249A MX2015008249A (es) 2012-12-27 2013-12-25 Composicion de adhesivo termicamente conductora, electricamente conductor.

Country Status (11)

Country Link
US (1) US20150344749A1 (es)
EP (1) EP2940093B1 (es)
JP (1) JP5642147B2 (es)
KR (1) KR101775255B1 (es)
CN (1) CN104968746B (es)
MX (1) MX2015008249A (es)
MY (1) MY172479A (es)
PH (1) PH12015501480A1 (es)
SG (1) SG11201504998SA (es)
TW (1) TWI510595B (es)
WO (1) WO2014104046A1 (es)

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JP5806760B1 (ja) * 2014-05-29 2015-11-10 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
JP6396189B2 (ja) * 2014-11-27 2018-09-26 日東電工株式会社 導電性フィルム状接着剤、フィルム状接着剤付きダイシングテープ及び半導体装置の製造方法
WO2016116959A1 (ja) * 2015-01-19 2016-07-28 京セラケミカル株式会社 導電性樹脂組成物および半導体装置
JP6091019B2 (ja) * 2015-02-02 2017-03-08 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
JP6164256B2 (ja) * 2015-07-08 2017-07-19 住友ベークライト株式会社 熱伝導性組成物、半導体装置、半導体装置の製造方法、および放熱板の接着方法
WO2017204238A1 (ja) 2016-05-26 2017-11-30 株式会社大阪ソーダ 導電性接着剤
CN109312200B (zh) 2016-06-27 2023-11-17 三键有限公司 热固化型导电性胶粘剂
JP7148799B2 (ja) * 2016-09-02 2022-10-06 株式会社スリーボンド （メタ）アクリル樹脂組成物およびそれを用いた導電性接着剤
JP6859799B2 (ja) * 2017-03-29 2021-04-14 三菱マテリアル株式会社 ペースト状銀粉組成物、接合体の製造方法および銀膜の製造方法
WO2018225773A1 (ja) * 2017-06-07 2018-12-13 田中貴金属工業株式会社 熱伝導性導電性接着剤組成物
JP7350653B2 (ja) * 2017-11-13 2023-09-26 日東電工株式会社 焼結接合用組成物、焼結接合用シート、および焼結接合用シート付きダイシングテープ
CN109837050A (zh) * 2019-03-15 2019-06-04 苏州凡络新材料科技有限公司 一种低温固化型导电胶黏剂及其制备方法
RU2730319C1 (ru) * 2019-08-26 2020-08-21 Акционерное общество "Государственный космический научно-производственный центр им. М.В. Хруничева" Клеевая композиция на основе эпоксидной смолы
CN110885655B (zh) * 2019-12-13 2021-09-03 苏州凡络新材料科技有限公司 一种表面绝缘型电磁屏蔽胶黏剂及其制备方法
CN115011294B (zh) * 2022-06-07 2023-02-10 道尔化成电子材料(上海)有限公司 一种芯片封装用烧结型纳米银导电胶及其制备方法

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Also Published As

Publication number Publication date
EP2940093A4 (en) 2016-08-03
EP2940093A1 (en) 2015-11-04
PH12015501480B1 (en) 2015-09-21
KR20150108844A (ko) 2015-09-30
KR101775255B1 (ko) 2017-09-05
CN104968746A (zh) 2015-10-07
TW201435041A (zh) 2014-09-16
WO2014104046A1 (ja) 2014-07-03
US20150344749A1 (en) 2015-12-03
TWI510595B (zh) 2015-12-01
JP5642147B2 (ja) 2014-12-17
CN104968746B (zh) 2017-09-19
SG11201504998SA (en) 2015-07-30
JP2014125596A (ja) 2014-07-07
PH12015501480A1 (en) 2015-09-21
EP2940093B1 (en) 2017-11-22
MY172479A (en) 2019-11-26

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