MY160200A - Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition - Google Patents
Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin compositionInfo
- Publication number
- MY160200A MY160200A MYPI2012003298A MYPI2012003298A MY160200A MY 160200 A MY160200 A MY 160200A MY PI2012003298 A MYPI2012003298 A MY PI2012003298A MY PI2012003298 A MYPI2012003298 A MY PI2012003298A MY 160200 A MY160200 A MY 160200A
- Authority
- MY
- Malaysia
- Prior art keywords
- resin composition
- optical semiconductor
- curing agent
- compounds
- sealing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Abstract
DISCLOSED IS A RESIN COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR, WHICH CONTAINS AN EPOXY RESIN, A CURING AGENT, AND A CURING ACCELERATOR AND CONTAINS, AS AN ALICYCLIC EPOXY RESIN (A), AT LEAST ONE SELECTED FROM THE GROUP CONSISTING OF COMPOUNDS REPRESENTED BY FOLLOWING FORMULA (I), COMPOUNDS HAVING AN EPOXY GROUP BONDED DIRECTLY TO AN ALICYCLE THROUGH A SINGLE BOND, AND COMPOUNDS HAVING THREE OR MORE EPOXY GROUPS EACH FORMED BY AN OXYGEN ATOM AND ADJACENT TWO CARBON ATOMS CONSTITUTING AN ALICYCLE, IN A CONTENT OF FROM 55 TO 100 PERCENT BY WEIGHT BASED ON THE TOTAL AMOUNT OF EPOXY RESIN(S). THE CURING AGENT IS AN ACID ANHYDRIDE CURING AGENT, AND THE CURING ACCELERATOR INCLUDES AN IONIC CONJUGATE BETWEEN A PHOSPHONIUM ION REPRESENTED BY FOLLOWING FORMULA (1) AND A HALOGEN ANION CAPABLE OF FORMING AN ION PAIR WITH THE PHOSPHONIUM ION.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010040950A JP5606752B2 (en) | 2010-02-25 | 2010-02-25 | Resin composition for optical semiconductor sealing and optical semiconductor device using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
MY160200A true MY160200A (en) | 2017-02-28 |
Family
ID=44506610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2012003298A MY160200A (en) | 2010-02-25 | 2011-02-04 | Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5606752B2 (en) |
CN (1) | CN102782000B (en) |
MY (1) | MY160200A (en) |
TW (1) | TWI500651B (en) |
WO (1) | WO2011105192A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012036320A (en) * | 2010-08-10 | 2012-02-23 | Daicel Corp | Curable resin composition and cured article thereof |
JP2012077257A (en) * | 2010-10-06 | 2012-04-19 | Daicel Corp | Method for producing cured product, and cured product |
JP6047294B2 (en) * | 2012-03-30 | 2016-12-21 | 株式会社ダイセル | Curable epoxy resin composition |
TWI494339B (en) | 2012-10-23 | 2015-08-01 | Ind Tech Res Inst | Partially esterified epoxy resin and epoxy resin composition applied with the same, and method for preparing the composition |
JP6332907B2 (en) | 2013-02-14 | 2018-05-30 | 東京応化工業株式会社 | Resin composition for sealing, display device, and optical semiconductor device |
JP6523780B2 (en) | 2014-09-29 | 2019-06-05 | 東京応化工業株式会社 | Film-forming composition and method for producing cured film using the same |
JP6512699B2 (en) * | 2015-03-30 | 2019-05-15 | ペルノックス株式会社 | One-component epoxy resin composition for semiconductor encapsulation, cured product, method for producing semiconductor component and semiconductor component |
CN111138809B (en) * | 2016-11-28 | 2022-05-06 | 联茂电子股份有限公司 | Halogen-free resin composition |
KR102140259B1 (en) | 2018-01-11 | 2020-07-31 | 주식회사 엘지화학 | Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0258530A (en) * | 1988-08-23 | 1990-02-27 | Toshiba Corp | Epoxy resin composition |
WO2005028536A1 (en) * | 2003-09-22 | 2005-03-31 | Mitsubishi Chemical Corporation | Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition |
CN100513453C (en) * | 2003-09-22 | 2009-07-15 | 三菱化学株式会社 | Alicyclic epoxy resins, their preparation process, their compositions, epoxy resin cured product, and uses of alicyclic epoxy resin compositions |
JP2005225964A (en) * | 2004-02-12 | 2005-08-25 | Jsr Corp | Composition for optical semiconductor encapsulation |
JP2005263869A (en) * | 2004-03-16 | 2005-09-29 | Nagase Chemtex Corp | Resin composition for sealing optical semiconductor |
EP1736500A4 (en) * | 2004-04-16 | 2010-03-24 | Jsr Corp | Composition for sealing optical semiconductor, optical semiconductor sealing material, and method for producing composition for sealing optical semiconductor |
JP4578188B2 (en) * | 2004-09-15 | 2010-11-10 | ダイセル化学工業株式会社 | Epoxy resin composition, optical semiconductor encapsulant, and optical semiconductor device |
JP2006225515A (en) * | 2005-02-17 | 2006-08-31 | Jsr Corp | Optical semiconductor element, sealing material therefor and sealing composition |
JP5013127B2 (en) * | 2007-12-19 | 2012-08-29 | Jnc株式会社 | Thermosetting resin composition and use thereof |
US20090163652A1 (en) * | 2007-12-19 | 2009-06-25 | Chisso Corporation | Thermosetting resin composition and use thereof |
JP2009191217A (en) * | 2008-02-18 | 2009-08-27 | Shin Etsu Chem Co Ltd | Epoxy-silicone composite resin composition and light-emitting semiconductor device |
JP5077894B2 (en) * | 2008-03-28 | 2012-11-21 | 信越化学工業株式会社 | Epoxy / silicone hybrid resin composition for optical semiconductor element sealing and transfer molding tablet comprising the same |
JP5669289B2 (en) * | 2008-05-23 | 2015-02-12 | 新日鉄住金化学株式会社 | Novel epoxy resin and method for producing the same, epoxy resin composition containing epoxy resin as essential component, and cured product containing epoxy resin as essential component |
JP2010031149A (en) * | 2008-07-29 | 2010-02-12 | Shin-Etsu Chemical Co Ltd | Resin composition for sealing optical semiconductor device |
-
2010
- 2010-02-25 JP JP2010040950A patent/JP5606752B2/en active Active
-
2011
- 2011-02-04 MY MYPI2012003298A patent/MY160200A/en unknown
- 2011-02-04 WO PCT/JP2011/052347 patent/WO2011105192A1/en active Application Filing
- 2011-02-04 CN CN201180008555.5A patent/CN102782000B/en active Active
- 2011-02-24 TW TW100106116A patent/TWI500651B/en active
Also Published As
Publication number | Publication date |
---|---|
JP5606752B2 (en) | 2014-10-15 |
WO2011105192A1 (en) | 2011-09-01 |
JP2011174023A (en) | 2011-09-08 |
CN102782000A (en) | 2012-11-14 |
TWI500651B (en) | 2015-09-21 |
CN102782000B (en) | 2014-12-31 |
TW201139493A (en) | 2011-11-16 |
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