JP6047294B2 - Curable epoxy resin composition - Google Patents

Description

  The present invention relates to a curable epoxy resin composition, a cured product obtained by curing the curable epoxy resin composition, and an optical semiconductor device in which an optical semiconductor element is sealed with a cured product of the curable epoxy resin composition About.

  In recent years, the output of optical semiconductor devices has been increased, and in such an optical semiconductor device, a resin (encapsulant) that covers the optical semiconductor element is required to have high heat resistance and light resistance. Conventionally, as a sealing agent for forming a sealing material having high heat resistance, for example, a composition containing monoallyl diglycidyl isocyanurate and a bisphenol A type epoxy resin is known (see Patent Document 1). However, when the composition is used as a sealant for a high-output blue / white light semiconductor, the coloring of the sealant proceeds by light and heat emitted from the optical semiconductor element and should be output originally. As a result, the light is absorbed, and as a result, the intensity of the light output from the optical semiconductor device is lowered with time.

  3,4-epoxycyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate, 3,4 as a sealing agent that forms a cured product (sealing material) that has high heat resistance and light resistance and is not easily yellowed -Liquid alicyclic epoxy resins having an alicyclic skeleton such as an adduct of epoxycyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate and ε-caprolactone and 1,2,8,9-diepoxylimonene are known. ing. However, the cured products of these alicyclic epoxy resins are susceptible to various stresses, and cracks are generated when a thermal shock such as a cooling cycle (repeating heating and cooling periodically) is applied. Etc. had occurred.

  In addition, an optical semiconductor device (for example, a surface-mount type optical semiconductor device) generally undergoes a reflow process for bonding an electrode of the optical semiconductor device to a wiring board by soldering. In recent years, lead-free solder having a high melting point has been used as a solder as a bonding material, and heat treatment in a reflow process has become a higher temperature (for example, a peak temperature of 240 to 260 ° C.). . Under such circumstances, in the conventional optical semiconductor device, there is a problem of deterioration such that the sealing material is peeled off from the lead frame of the optical semiconductor device due to the heat treatment in the reflow process, or the sealing material is cracked. Has occurred.

  For this reason, the sealing material in the optical semiconductor device has high heat resistance and light resistance, and also has a characteristic that cracks are not easily generated when a thermal shock is applied (sometimes referred to as “thermal shock resistance”), and Further, there is a demand for characteristics in which cracks and peeling are unlikely to occur even when heat treatment is performed in the reflow process. In particular, in recent years, from the viewpoint of ensuring higher reliability of the sealing material, the optical semiconductor device is kept under high humidity conditions for a certain period of time (for example, 168 hours under conditions of 30 ° C. and 70% RH; 60 ° C., 60% RH). The above-mentioned cracks and peeling are not likely to occur even when heat treatment is performed in the reflow process after absorbing moisture after being placed under the above conditions (for 40 hours, etc.) (this characteristic is sometimes referred to as “moisture absorption reflow resistance”). ) Is required.

JP 2000-344867 A

Accordingly, an object of the present invention is to provide a curable epoxy resin composition having high heat resistance, light resistance, and thermal shock resistance, and in particular, capable of forming a cured product excellent in moisture absorption reflow resistance.
Another object of the present invention is to provide a cured product having high heat resistance, light resistance, and thermal shock resistance, and particularly excellent in moisture absorption reflow resistance.
Another object of the present invention is to suppress degradation such as a decrease in luminous intensity, and in particular, an optical semiconductor device in which degradation such as a decrease in luminous intensity is suppressed when heat treatment is performed in a reflow process after storage under high humidity conditions. Is to provide.

  As a result of intensive studies to solve the above problems, the present inventor has found that an alicyclic epoxy compound, a monoallyl diglycidyl isocyanurate compound, a quaternary phosphonium salt, a curing agent, a curing accelerator, and a specific A curable epoxy resin composition comprising a siloxane derivative and further controlling the weight ratio of the quaternary phosphonium salt and the curing accelerator to a specific ratio has high heat resistance, light resistance, and thermal shock resistance. In particular, the present inventors have found that a cured product excellent in moisture absorption reflow resistance can be formed, and completed the present invention.

［式中、Ｒ¹、Ｒ²は、水素原子又は炭素数１〜８のアルキル基を示す］
で表されるモノアリルジグリシジルイソシアヌレート化合物（Ｂ）と、第四級ホスホニウム塩（Ｃ）と、硬化剤（Ｄ）と、硬化促進剤（Ｅ）と、分子内に２以上のエポキシ基を有するシロキサン誘導体とを含み、第四級ホスホニウム塩（Ｃ）と硬化促進剤（Ｅ）の重量比［第四級ホスホニウム塩（Ｃ）／硬化促進剤（Ｅ）］が０．０１〜１００であることを特徴とする硬化性エポキシ樹脂組成物を提供する。 That is, the present invention relates to an alicyclic epoxy compound (A) and the following formula (1).

[Wherein R ¹ and R ² represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms]
A monoallyl diglycidyl isocyanurate compound (B), a quaternary phosphonium salt (C), a curing agent (D), a curing accelerator (E), and two or more epoxy groups in the molecule. The weight ratio of the quaternary phosphonium salt (C) to the curing accelerator (E) [quaternary phosphonium salt (C) / curing accelerator (E)] is 0.01 to 100. A curable epoxy resin composition is provided.

  Furthermore, the curable epoxy resin composition is provided in which the alicyclic epoxy compound (A) is a compound having a cyclohexene oxide group.

で表される化合物である前記の硬化性エポキシ樹脂組成物を提供する。 Furthermore, the alicyclic epoxy compound (A) is represented by the following formula (I-1)

The said curable epoxy resin composition which is a compound represented by these is provided.

  Furthermore, the curable epoxy resin composition is provided in which the quaternary phosphonium salt (C) is an organic acid salt of quaternary phosphonium.

  Furthermore, the said curable epoxy resin composition containing an alicyclic polyester resin is provided.

  Furthermore, the said curable epoxy resin composition containing a rubber particle is provided.

  Moreover, this invention provides the hardened | cured material obtained by hardening | curing the said curable epoxy resin composition.

  Furthermore, the said curable epoxy resin composition which is a resin composition for optical semiconductor sealing is provided.

  Moreover, this invention provides the optical semiconductor device by which the optical semiconductor element was sealed with the hardened | cured material of the said curable epoxy resin composition.

  Since the curable epoxy resin composition of the present invention has the above-described configuration, by curing the resin composition, it has high heat resistance, light resistance, and thermal shock resistance, and particularly excellent in moisture absorption reflow resistance. A cured product can be formed. For this reason, when the curable epoxy resin composition of the present invention is used as a resin composition for optical semiconductor encapsulation, particularly when it is stored in a high humidity condition and then heat-treated in a reflow process, the light intensity is reduced. It is possible to obtain a high-quality optical semiconductor device that is hardly deteriorated and has high durability.

It is the schematic which shows one Embodiment of the optical semiconductor device by which the optical semiconductor element was sealed with the hardened | cured material of the curable epoxy resin composition of this invention. The left figure (a) is a perspective view, and the right figure (b) is a sectional view. It is an example of the surface temperature profile (temperature profile in one heat processing among two heat processing) of the optical semiconductor device in the solder heat resistance test of an Example.

で表されるモノアリルジグリシジルイソシアヌレート化合物（Ｂ）と、第四級ホスホニウム塩（Ｃ）と、硬化剤（Ｄ）と、硬化促進剤（Ｅ）と、分子内に２以上のエポキシ基を有するシロキサン誘導体とを少なくとも含む樹脂組成物である。 <Curable epoxy resin composition>
The curable epoxy resin composition of the present invention comprises an alicyclic epoxy compound (A) and a formula (1).

A monoallyl diglycidyl isocyanurate compound (B), a quaternary phosphonium salt (C), a curing agent (D), a curing accelerator (E), and two or more epoxy groups in the molecule. A siloxane derivative having at least a resin composition.

[Alicyclic epoxy compound (A)]
The alicyclic epoxy compound (A) in the curable epoxy resin composition of the present invention is a compound having at least an alicyclic (aliphatic ring) structure and an epoxy group in the molecule (in one molecule). As said alicyclic epoxy compound (A), specifically, (i) The compound which has an epoxy group (alicyclic epoxy group) comprised by two adjacent carbon atoms and oxygen atoms which comprise an alicyclic ring. And (ii) compounds in which an epoxy group is directly bonded to the alicyclic ring with a single bond. However, the alicyclic epoxy compound (A) does not include a siloxane derivative having two or more epoxy groups in the molecule described later.

  The compound having an epoxy group (alicyclic epoxy group) composed of two adjacent carbon atoms and oxygen atoms constituting the alicyclic ring (i) is arbitrarily selected from known or commonly used compounds. Can be used. Especially, as said alicyclic epoxy group, a cyclohexene oxide group is preferable.

As the compound having an epoxy group composed of two adjacent carbon atoms and oxygen atoms constituting the alicyclic ring (i) described above, a compound having a cyclohexene oxide group is particularly preferable from the viewpoint of transparency and heat resistance. The compound (alicyclic epoxy compound) represented by the following formula (I) is particularly preferable.

  In the above formula (I), X represents a single bond or a linking group (a divalent group having one or more atoms). Examples of the linking group include a divalent hydrocarbon group, a carbonyl group, an ether bond, an ester bond, a carbonate group, an amide group, and a group in which a plurality of these are linked.

Examples of the alicyclic epoxy compound in which X in the formula (I) is a single bond include compounds represented by the following formula. As such an alicyclic epoxy compound, for example, a commercial product such as a trade name “Celoxide 8000” (manufactured by Daicel Corporation) can be used.

  As said bivalent hydrocarbon group, a C1-C18 linear or branched alkylene group, a bivalent alicyclic hydrocarbon group, etc. are mentioned. Examples of the linear or branched alkylene group having 1 to 18 carbon atoms include a methylene group, a methylmethylene group, a dimethylmethylene group, an ethylene group, a propylene group, and a trimethylene group. Examples of the divalent alicyclic hydrocarbon group include 1,2-cyclopentylene group, 1,3-cyclopentylene group, cyclopentylidene group, 1,2-cyclohexylene group, 1,3-cyclopentylene group, And divalent cycloalkylene groups (including cycloalkylidene groups) such as a cyclohexylene group, a 1,4-cyclohexylene group, and a cyclohexylidene group.

  As the linking group X, a linking group containing an oxygen atom is particularly preferable. Specifically, -CO-, -O-CO-O-, -COO-, -O-, -CONH-; A group in which a plurality of groups are linked; a group in which one or more of these groups are linked to one or more of divalent hydrocarbon groups, and the like. Examples of the divalent hydrocarbon group include those exemplified above.

Typical examples of the alicyclic epoxy compound represented by the above formula (I) include compounds represented by the following formulas (I-1) to (I-10). In the following formulas (I-5) and (I-7), l and m each represent an integer of 1 to 30. R in the following formula (I-5) is an alkylene group having 1 to 8 carbon atoms, methylene group, ethylene group, propylene group, isopropylene group, butylene group, isobutylene group, s-butylene group, pentylene group, hexylene. And linear or branched alkylene groups such as a group, a heptylene group, and an octylene group. Among these, C1-C3 linear or branched alkylene groups, such as a methylene group, ethylene group, a propylene group, an isopropylene group, are preferable. N1 to n6 in the following formulas (I-9) and (I-10) each represent an integer of 1 to 30.

Examples of the compound (ii) in which the epoxy group is directly bonded to the alicyclic ring with a single bond include compounds represented by the following formula (II).

In the formula (II), R ′ is a group obtained by removing p —OH from a p-valent alcohol, and p and n represent natural numbers. Examples of the p-valent alcohol [R ′-(OH) _p ] include polyhydric alcohols such as 2,2-bis (hydroxymethyl) -1-butanol (such as alcohols having 1 to 15 carbon atoms). p is preferably 1 to 6, and n is preferably 1 to 30. When p is 2 or more, n in each () (in parentheses) may be the same or different. Specifically, as the above compound, 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 2,2-bis (hydroxymethyl) -1-butanol, trade name “EHPE3150” (Co., Ltd.) Daicel) and the like.

  In the curable epoxy resin composition of the present invention, the alicyclic epoxy compound (A) can be used singly or in combination of two or more. Moreover, as said alicyclic epoxy compound (A), commercial items, such as brand name "Celoxide 2021P" and "Celoxide 2081" (above, Daicel Corporation make), for example, can also be used.

  Examples of the alicyclic epoxy compound (A) include 3,4-epoxycyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate represented by the above formula (I-1), trade name “Celoxide 2021P” ((stock) ) Manufactured by Daicel) is particularly preferable.

  Although content (blending amount) of the alicyclic epoxy compound (A) in the curable epoxy resin composition of the present invention is not particularly limited, it is 5 to 70 with respect to the curable epoxy resin composition (100% by weight). % By weight is preferred, more preferably 10 to 60% by weight, and still more preferably 15 to 50% by weight. When the content of the alicyclic epoxy compound (A) is less than 5% by weight, the heat resistance, light resistance, thermal shock resistance, and moisture absorption reflow resistance of the cured product may be lowered.

  The content (blending amount) of the alicyclic epoxy compound (A) with respect to the total amount of the compound having an epoxy group contained in the curable epoxy resin composition (total epoxy compound) (100 wt%) is not particularly limited, but 10 -95 weight% is preferable, More preferably, it is 20-92 weight%, More preferably, it is 30-90 weight%. When the content of the alicyclic epoxy compound (A) is less than 10% by weight, the heat resistance, light resistance, thermal shock resistance, and moisture absorption reflow resistance of the cured product may be lowered.

[Monoallyl diglycidyl isocyanurate compound (B)]
The monoallyl diglycidyl isocyanurate compound (B) in the curable epoxy resin composition of the present invention is a compound represented by the following formula (1). The monoallyl diglycidyl isocyanurate compound (B) improves the toughness of the cured product, and provides thermal shock resistance and moisture absorption reflow resistance (especially crack resistance in heat treatment in the reflow process after moisture absorption (occurs cracks). It plays a role of improving difficult characteristics)).

Above formula ^{(1), R 1, R} 2 are each a hydrogen atom or an alkyl group having 1 to 8 carbon atoms. Examples of the alkyl group having 1 to 8 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, s-butyl, pentyl, hexyl, heptyl, and octyl groups. Examples thereof include a chain or branched alkyl group. Among these, a linear or branched alkyl group having 1 to 3 carbon atoms such as a methyl group, an ethyl group, a propyl group, and an isopropyl group is preferable. R ¹ and R ² in the above formula (1) are particularly preferably hydrogen atoms.

  Representative examples of the monoallyl diglycidyl isocyanurate compound (B) include monoallyl diglycidyl isocyanurate, 1-allyl-3,5-bis (2-methylepoxypropyl) isocyanurate, 1- (2- Methylpropenyl) -3,5-diglycidyl isocyanurate, 1- (2-methylpropenyl) -3,5-bis (2-methylepoxypropyl) isocyanurate, and the like. In addition, monoallyl diglycidyl isocyanurate compound (B) can be used individually by 1 type or in combination of 2 or more types.

  The monoallyl diglycidyl isocyanurate compound (B) may be modified in advance by adding a compound that reacts with an epoxy group such as alcohol or acid anhydride.

  The content (blending amount) of the monoallyl diglycidyl isocyanurate compound (B) is not particularly limited, but is based on the total amount (100% by weight) of the compound having an epoxy group contained in the curable epoxy resin composition. 5 to 60 weight% is preferable, More preferably, it is 8 to 55 weight%, More preferably, it is 10 to 50 weight%. When the content of the monoallyl diglycidyl isocyanurate compound (B) exceeds 60% by weight, the solubility of the monoallyl diglycidyl isocyanurate compound (B) in the curable epoxy resin composition is lowered, and the physical properties of the cured product are reduced. May have adverse effects. On the other hand, if the content of the monoallyl diglycidyl isocyanurate compound (B) is less than 5% by weight, the thermal shock resistance and moisture absorption reflow resistance of the cured product may be lowered.

  The content (blending amount) of the monoallyl diglycidyl isocyanurate compound (B) with respect to the total amount (100% by weight) of the alicyclic epoxy compound (A) and the monoallyl diglycidyl isocyanurate compound (B) is particularly Although not limited, 5 to 60 weight% is preferable, More preferably, it is 8 to 55 weight%, More preferably, it is 10 to 50 weight%. When the content of the monoallyl diglycidyl isocyanurate compound (B) exceeds 60% by weight, the solubility of the monoallyl diglycidyl isocyanurate compound (B) in the curable epoxy resin composition is lowered, and the physical properties of the cured product are reduced. May have adverse effects. On the other hand, if the content of the monoallyl diglycidyl isocyanurate compound (B) is less than 5% by weight, the thermal shock resistance and moisture absorption reflow resistance of the cured product may be lowered.

[Quaternary phosphonium salt (C)]
The quaternary phosphonium salt (C) in the curable epoxy resin composition of the present invention is an ionic conjugate of a quaternary phosphonium cation (quaternary phosphonium ion) and an anion (counter anion of quaternary phosphonium cation). is there. In particular, the quaternary phosphonium salt (C) improves the moisture absorption reflow resistance of the cured product, and when the moisture is absorbed and then heat-treated in the reflow process, cracks in the cured product and peeling of the cured product from the electrode occur. To play a role in controlling

As the quaternary phosphonium salt (C), known or conventional ones can be used, and are not particularly limited. Particularly, from the viewpoint of improving moisture absorption reflow resistance, a compound represented by the following formula (2) ( Quaternary phosphonium salts) are preferred.

R ^a , R ^b , R ^c and R ^d (R ^{a to} R ^d ) in the above formula (2) each represent a hydrocarbon group having 1 to 20 carbon atoms, and may be the same as each other, May be different. Examples of the hydrocarbon group having 1 to 20 carbon atoms include an alkyl group having 1 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, and an aryl group having 6 to 20 carbon atoms. Examples of the alkyl group having 1 to 20 carbon atoms include methyl group, ethyl group, propyl group, butyl group (n-butyl group), isobutyl group, s-butyl group, pentyl group, isopentyl group, hexyl group, and isohexyl. And linear, branched, or cyclic alkyl groups such as a group, cyclohexyl group, methylcyclohexyl group, heptyl group, octyl group, isooctyl group, nonyl group, isononyl group, decyl group, and isodecyl group. Examples of the aralkyl group having 7 to 20 carbon atoms include benzyl group, methylbenzyl group, ethylbenzyl group, dimethylbenzyl group, diethylbenzyl group, phenethyl group, methylphenethyl group, ethylphenethyl group, methylphenethyl group, and ethylphenethyl group. Is mentioned. Examples of the aryl group having 6 to 20 carbon atoms include a phenyl group; a substituted phenyl group such as a methylphenyl group, a dimethylphenyl group, and an ethylphenyl group; a naphthyl group. Among them, alkyl groups having 2 to 4 carbon atoms such as ethyl group, propyl group and butyl group; aralkyl groups having 7 to 10 carbon atoms such as benzyl group, ethylbenzyl group, phenethyl group and ethylphenethyl group; phenyl group and methylphenyl An aryl group having 6 to 8 carbon atoms such as a group is preferable, and a phenyl group, a butyl group, and an ethyl group are particularly preferable.

A ⁻ in the above formula (2) represents an anion (a counter anion of a quaternary phosphonium cation). The anion is not particularly limited, but, for example, halide ion (halogen anion), borate ion (borate anion), benzotriazolate ion (benzotriazolate anion), organic acid anion (anion residue of organic acid) Etc.

Examples of the halide ions include fluoride ions (F ⁻ ), chloride ions (Cl ⁻ ), bromide ions (Br ⁻ ), iodide ions (I ⁻ ), and the like. Examples of the borate ions include tetraarylborate ions such as tetraphenylborate ions and tetra (p-tolyl) borate ions; tetraalkylborate ions such as tetraethylborate ions; tetrahaloborate ions such as tetrafluoroborate ions and the like. Can be mentioned. Examples of the benzotriazolate ions include unsubstituted benzotriazolate ions and substituted benzotriazolate ions having a substituent such as an alkyl group.

  Examples of the organic acid anion include an anion residue of a known or commonly used organic acid (such as carboxylic acid, organic sulfonic acid, and organic acidic phosphate ester), and are not particularly limited. Examples of the organic acid include aliphatic monocarboxylic acids such as formic acid, acetic acid, propionic acid, butyric acid, and trifluoroacetic acid; oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, and azelain. Acid, sebacic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, dimethylmalonic acid, diethylmalonic acid, dipropylmalonic acid, 2-methylglutaric acid, 3-methylglutaric acid, 3,3-dimethylglutaric acid, Saturated aliphatic dicarboxylic acids such as 3-methyladipic acid, 1,6-decanedicarboxylic acid, 5,6-decanedicarboxylic acid, 2,3-dibutylsuccinic acid, cyclohexanedicarboxylic acid; maleic acid, citraconic acid, dimethylmaleic acid Unsaturated aliphatic dicarboxylic acids such as 1,2-cyclohexene dicarboxylic acid; , Toluic acid, cumic acid, t-butylbenzoic acid, salicylic acid, γ-resorcinic acid, anisic acid and other aromatic monocarboxylic acids; phthalic acid, 4-methylphthalic acid, 4-nitrophthalic acid and other aromatic dicarboxylic acids; benzene Organic sulfonic acids such as sulfonic acid, p-toluenesulfonic acid, trifluoromethanesulfonic acid and nonafluorobutanesulfonic acid; organic phosphoric acid esters such as monoalkyl phosphate and dialkyl phosphate; monoalkyl thiophosphate, dialkyl thiophosphate, etc. And organic dithiophosphates such as monoalkyl dithiophosphate and dialkyl dithiophosphate.

  More specifically, as the quaternary phosphonium salt (C), for example, tetra-n-butylphosphonium O, O-diethylphosphodithionate, tetra-n-butylphosphonium bromide, tetra-n-butylphosphonium benzotri Azolate, tetra-n-butylphosphonium tetrafluoroborate, tetra-n-butylphosphonium tetraphenylborate, tetraphenylphosphonium bromide, methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, ethyltriphenylphosphonium iodide, ethyltriphenyl Phosphonium acetate, n-butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium tetraphenylborate Such as over doors and the like. In addition, a quaternary phosphonium salt (C) can also be used individually by 1 type, and can also be used in combination of 2 or more type.

Among them, the quaternary phosphonium salt (C) is preferably an organic acid salt of quaternary phosphonium (quaternary phosphonium ion), more preferably from the following formula (2 ′), from the viewpoint of improving moisture absorption reflow resistance. ) Is an organic acid salt of quaternary phosphonium.

R ^a to R ^d in the formula (2 ') is the same as R ^a to R ^d in the formula (2) represents a hydrocarbon group having 1 to 20 carbon atoms. R ^{a to} R ^d in the above formula (2 ′) may be the same as or different from each other.

R ^e and R ^f in the above formula (2 ′) each represent a hydrocarbon group having 1 to 20 carbon atoms, and may be the same or different from each other. The hydrocarbon groups of 1 to 20 carbon atoms, the same as R ^a to R ^d are illustrated. Among these, as R ^e and R ^f , an alkyl group having 2 to 4 carbon atoms; an aralkyl group having 7 to 10 carbon atoms; an aryl group having 6 to 8 carbon atoms is preferable, and a phenyl group, a methyl group, and an ethyl group are particularly preferable. .

  Y and Z in the above formula (2 ′) each represent an oxygen atom or a sulfur atom, and may be the same or different from each other. Among these, as Y and Z, a sulfur atom is preferable.

  The quaternary phosphonium salt (C) can be produced by a known or conventional method, and the production method is not particularly limited. In addition, as the quaternary phosphonium salt (C), for example, trade name “U-CAT 5003” (above, manufactured by San Apro Co., Ltd.), trade name “PX-4ET”, “PX-4MP” (above, Commercial products such as Nippon Chemical Industry Co., Ltd., trade names “TBP-BB”, “TPP-K”, and “TPP-MK” (above, manufactured by Hokuko Chemical Co., Ltd.) can also be used.

  The content (blending amount) of the quaternary phosphonium salt (C) is not particularly limited, but with respect to the total amount (100 parts by weight) of the compound having an epoxy group contained in the curable epoxy resin composition of the present invention. 0.1-5 weight part is preferable, More preferably, it is 0.2-5 weight part, More preferably, it is 0.5-5 weight part. When the content of the quaternary phosphonium salt (C) is less than 0.1 parts by weight, the moisture absorption reflow resistance of the cured product may be lowered. On the other hand, if the content of the quaternary phosphonium salt (C) exceeds 5 parts by weight, the cured product may be colored to deteriorate the hue. The “content of quaternary phosphonium salt (C)” means the total amount (total amount) when two or more quaternary phosphonium salts (C) are used in combination.

  The weight ratio [quaternary phosphonium salt (C) / curing accelerator (E)] of the quaternary phosphonium salt (C) and the curing accelerator (E) in the curable epoxy resin composition of the present invention is 0.01. It is -100, Preferably it is 0.1-20, More preferably, it is 0.5-15, More preferably, it is 0.5-12. When the weight ratio is less than 0.01, the moisture absorption reflow resistance of the cured product decreases. On the other hand, when the said weight ratio exceeds 100, hardened | cured material will color and a hue will deteriorate.

[Curing agent (D)]
The curing agent (D) in the curable epoxy resin composition of the present invention is a compound having a function of curing a compound having an epoxy group. As said hardening | curing agent (D), a well-known thru | or usual hardening | curing agent can be used as a hardening | curing agent for epoxy resins. As the curing agent (D), acid anhydrides which are liquid at 25 ° C. are preferable, for example, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, dodecenyl succinic anhydride, methylendomethylenetetrahydrophthalic anhydride, etc. Is mentioned. In addition, solid acid anhydrides at room temperature (about 25 ° C.) such as phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methylcyclohexene dicarboxylic acid anhydride are also liquid at room temperature (about 25 ° C.). It can use preferably as a hardening | curing agent (D) in this invention by making it melt | dissolve in acid anhydride of this, and making it a liquid mixture. In addition, a hardening | curing agent (D) can be used individually by 1 type or in combination of 2 or more types. As described above, as the curing agent (D), from the viewpoint of heat resistance, light resistance, and crack resistance of a cured product, an anhydride of a saturated monocyclic hydrocarbon dicarboxylic acid (a ring has a substituent such as an alkyl group). (Including those bonded).

  In the present invention, as the curing agent (D), trade names “Rikacid MH-700” (manufactured by Shin Nippon Rika Co., Ltd.), “Rikacid MH-700F” (manufactured by Shin Nippon Rika Co., Ltd.), trade names Commercial products such as “HN-5500” (manufactured by Hitachi Chemical Co., Ltd.) can also be used.

  Although content (blending amount) of a hardening | curing agent (D) is not specifically limited, 50-200 with respect to the whole quantity (100 weight part) of the compound which has an epoxy group contained in the curable epoxy resin composition of this invention. Part by weight is preferred, more preferably 80 to 145 parts by weight. More specifically, it is preferably used at a ratio of 0.5 to 1.5 equivalents per 1 equivalent of epoxy groups in all compounds having epoxy groups contained in the curable epoxy resin composition of the present invention. When the content of the curing agent (D) is less than 50 parts by weight, the curing becomes insufficient and the toughness of the cured product tends to decrease. On the other hand, when content of a hardening | curing agent (D) exceeds 200 weight part, hardened | cured material may color and hue may deteriorate.

[Curing accelerator (E)]
The curing accelerator (E) in the curable epoxy resin composition of the present invention is a compound having a function of accelerating the curing rate when the compound having an epoxy group is cured by the curing agent. As said hardening accelerator (E), a well-known thru | or usual hardening accelerator can be used, for example, 1,8- diazabicyclo [5.4.0] undecene-7 (DBU) or its salt (for example, Phenol salt, octylate, p-toluenesulfonate, formate, tetraphenylborate salt); 1,5-diazabicyclo [4.3.0] nonene-5 (DBN) or a salt thereof (for example, phenol salt, Octylate, p-toluenesulfonate, formate, tetraphenylborate salt); tertiary amines such as benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, N, N-dimethylcyclohexylamine Imidazoles such as 2-ethyl-4-methylimidazole and 1-cyanoethyl-2-ethyl-4-methylimidazole; phosphoric acid Ester, phosphines such as triphenylphosphine; (excluding those falling under quaternary phosphonium salt (C)) phosphonium compounds; organic metal salts such as zinc octylate and tin octylate; metal chelate and the like. A hardening accelerator (E) can be used individually by 1 type or in combination of 2 or more types.

  In the present invention, as the curing accelerator (E), trade names “U-CAT SA 506”, “U-CAT SA 102”, “U-CAT 18X”, “12XD” (developed product) (above, Commercial products such as San Apro Co., Ltd. can also be used.

  Although content (blending amount) of the said hardening accelerator (E) is not specifically limited, 0.05-about with respect to the whole quantity (100 weight part) of the compound which has an epoxy group contained in a curable epoxy resin composition. 7 parts by weight is preferable, more preferably 0.1 to 6 parts by weight, still more preferably 0.2 to 6 parts by weight, and particularly preferably 0.25 to 6 parts by weight. If the content of the curing accelerator (E) is less than 0.05 parts by weight, the curing acceleration effect may be insufficient. On the other hand, when content of a hardening accelerator (E) exceeds 7 weight part, hardened | cured material may color and a hue may deteriorate.

[Siloxane derivatives having two or more epoxy groups in the molecule]
The curable epoxy resin composition of the present invention further contains a siloxane derivative having two or more epoxy groups in the molecule (in one molecule). By including a siloxane derivative having two or more epoxy groups in the molecule, particularly, the heat resistance and light resistance of the cured product can be improved to a higher level.

  The siloxane skeleton (Si—O—Si skeleton) in the siloxane derivative having two or more epoxy groups in the molecule is not particularly limited. For example, a cyclic siloxane skeleton; a linear silicone, a cage type or a ladder type And a polysiloxane skeleton such as polysilsesquioxane. Among these, as the siloxane skeleton, a cyclic siloxane skeleton and a linear silicone skeleton are preferable from the viewpoint of improving the heat resistance and light resistance of the cured product and suppressing the decrease in luminous intensity. That is, the siloxane derivative having two or more epoxy groups in the molecule is preferably a cyclic siloxane having two or more epoxy groups in the molecule or a linear silicone having two or more epoxy groups in the molecule. In addition, the siloxane derivative which has 2 or more epoxy groups in a molecule | numerator can be used individually by 1 type or in combination of 2 or more types.

  When the siloxane derivative having two or more epoxy groups in the molecule is a cyclic siloxane having two or more epoxy groups, the number of Si-O units forming the siloxane ring (the number of silicon atoms forming the siloxane ring) (Equal) is not particularly limited, but is preferably 2 to 12 and more preferably 4 to 8 from the viewpoint of improving the heat resistance and light resistance of the cured product.

  The weight average molecular weight of the siloxane derivative having two or more epoxy groups in the molecule is not particularly limited, but is preferably 100 to 3000, more preferably 180 to 2000, from the viewpoint of improving the heat resistance and light resistance of the cured product. It is.

  The number of epoxy groups in one molecule of the siloxane derivative having two or more epoxy groups in the molecule is not particularly limited as long as it is two or more. From the viewpoint of improving the heat resistance and light resistance of the cured product, 2 ~ 4 (2, 3, or 4) are preferred.

  The epoxy equivalent (based on JIS K7236) of the siloxane derivative having two or more epoxy groups in the molecule is not particularly limited, but is preferably 180 to 400 from the viewpoint of improving the heat resistance and light resistance of the cured product. Preferably it is 240-400, More preferably, it is 240-350.

  The epoxy group in the siloxane derivative having two or more epoxy groups in the molecule is not particularly limited. From the viewpoint of improving the heat resistance and light resistance of the cured product, two adjacent carbon atoms constituting the aliphatic ring and An epoxy group (alicyclic epoxy group) composed of an oxygen atom is preferable, and among them, a cyclohexene oxide group is particularly preferable.

Specific examples of the siloxane derivative having two or more epoxy groups in the molecule include 2,4-di [2- (3- {oxabicyclo [4.1.0] heptyl}) ethyl]- 2,4,6,6,8,8-hexamethyl-cyclotetrasiloxane, 4,8-di [2- (3- {oxabicyclo [4.1.0] heptyl}) ethyl] -2,2,4 , 6,6,8-hexamethyl-cyclotetrasiloxane, 2,4-di [2- (3- {oxabicyclo [4.1.0] heptyl}) ethyl] -6,8-dipropyl-2,4 6,8-tetramethyl-cyclotetrasiloxane, 4,8-di [2- (3- {oxabicyclo [4.1.0] heptyl}) ethyl] -2,6-dipropyl-2,4,6 8-tetramethyl-cyclotetrasiloxane, 2,4,8-to [2- (3- {Oxabicyclo [4.1.0] heptyl}) ethyl] -2,4,6,6,8-pentamethyl-cyclotetrasiloxane, 2,4,8-tri [2- (3 -{Oxabicyclo [4.1.0] heptyl}) ethyl] -6-propyl-2,4,6,8-tetramethyl-cyclotetrasiloxane, 2,4,6,8-tetra [2- (3 -{Oxabicyclo [4.1.0] heptyl}) ethyl] -2,4,6,8-tetramethyl-cyclotetrasiloxane, silsesquioxane having two or more epoxy groups in the molecule, and the like. . More specifically, for example, a cyclic siloxane having two or more epoxy groups in the molecule represented by the following formula.

  Examples of the siloxane derivative having two or more epoxy groups in the molecule include alicyclic epoxy group-containing silicone resins described in JP-A-2008-248169, and one described in JP-A-2008-19422. An organopolysilsesquioxane resin having at least two epoxy functional groups in the molecule can also be used.

  Examples of the siloxane derivative having two or more epoxy groups in the molecule include a trade name “X-40-2678” (manufactured by Shin-Etsu Chemical Co., Ltd.), which is a cyclic siloxane having two or more epoxy groups in the molecule. Commercial products such as trade name “X-40-2670” (manufactured by Shin-Etsu Chemical Co., Ltd.) and trade name “X-40-2720” (manufactured by Shin-Etsu Chemical Co., Ltd.) can also be used.

  The content (blending amount) of the siloxane derivative having two or more epoxy groups in the molecule is not particularly limited, but is based on the total amount (100% by weight) of the compounds having an epoxy group contained in the curable epoxy resin composition. 5 to 60% by weight is preferable, more preferably 8 to 55% by weight, still more preferably 10 to 50% by weight, and particularly preferably 15 to 40% by weight. When the content of the siloxane derivative having two or more epoxy groups in the molecule is less than 5% by weight, the heat resistance and light resistance of the cured product may be insufficient. On the other hand, if the content of the siloxane derivative having two or more epoxy groups in the molecule exceeds 60% by weight, the thermal shock resistance and moisture absorption reflow resistance of the cured product may be lowered.

  Further, the content (blending amount) of the siloxane derivative having two or more epoxy groups in the molecule relative to 100 parts by weight of the alicyclic epoxy compound (A) is not particularly limited, but is preferably 10 to 200 parts by weight, more Preferably it is 20-180 weight part, More preferably, it is 30-150 weight part, Most preferably, it is 35-145 weight part. When the content of the siloxane derivative having two or more epoxy groups in the molecule is less than 10 parts by weight, the heat resistance and light resistance of the cured product may be insufficient. On the other hand, when the content of the siloxane derivative having two or more epoxy groups in the molecule exceeds 200 parts by weight, the thermal shock resistance and moisture absorption reflow resistance of the cured product may be lowered.

[Alicyclic polyester resin]
The curable epoxy resin composition of the present invention preferably further contains an alicyclic polyester resin. By containing the alicyclic polyester resin, particularly, the heat resistance and light resistance of the cured product are improved, and the light intensity of the optical semiconductor device tends to be further suppressed. The alicyclic polyester resin is a polyester resin having at least an alicyclic structure (aliphatic ring structure). In particular, from the viewpoint of improving the heat resistance, light resistance, and thermal shock resistance of the cured product, the alicyclic polyester resin is preferably an alicyclic polyester resin having an alicyclic ring (alicyclic structure) in the main chain.

  The alicyclic structure in the alicyclic polyester resin is not particularly limited, and examples thereof include a monocyclic hydrocarbon structure and a bridged ring hydrocarbon structure (for example, a bicyclic hydrocarbon). Among these, a saturated monocyclic hydrocarbon structure or a saturated bridged ring hydrocarbon structure in which the alicyclic skeleton is entirely composed of carbon-carbon single bonds is preferable. In addition, the alicyclic structure in the alicyclic polyester resin may be introduced into only one of the structural unit derived from dicarboxylic acid and the structural unit derived from diol, or both may be introduced, It is not limited.

  The alicyclic polyester resin has a structural unit derived from a monomer component having an alicyclic structure. Examples of the monomer having an alicyclic structure include diols and dicarboxylic acids having a known or commonly used alicyclic structure, and are not particularly limited. For example, 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 4-methyl-1,2-cyclohexanedicarboxylic acid, highmic acid, 1,4-decahydronaphthalenedicarboxylic acid, 1,5-decahydronaphthalenedicarboxylic acid, 2,6-decahydronaphthalene Dicarboxylic acids having an alicyclic structure such as dicarboxylic acid and 2,7-decahydronaphthalenedicarboxylic acid (including derivatives such as acid anhydrides) and the like; 1,2-cyclopentanediol, 1,3-cyclopentanediol, 1 , 2-Cyclopentanedimethanol, 1,3-cyclopentanedimethanol 5-membered ring diol such as bis (hydroxymethyl) tricyclo [5.2.1.0] decane, 1,2-cyclohexanediol, 1,3-cyclohexanediol, 1,4-cyclohexanediol, 1,2-cyclohexanedi Diols having an alicyclic structure such as 6-membered ring diols such as methanol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, 2,2-bis- (4-hydroxycyclohexyl) propane, and hydrogenated bisphenol A (Including these derivatives).

  The said alicyclic polyester resin may have the structural unit derived from the monomer component which does not have an alicyclic structure. Examples of the monomer having no alicyclic structure include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, phthalic acid and naphthalenedicarboxylic acid (including derivatives such as acid anhydrides); adipic acid, sebacic acid and azelaic acid Aliphatic dicarboxylic acids such as succinic acid, fumaric acid, maleic acid (including derivatives such as acid anhydrides); ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3- Butanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 3-methyl-1,5-pentanediol, 2-methyl -1,3-propanediol, 2,2-diethyl-1,3-propanediol 2-butyl-2-ethyl-1,3-propanediol, xylylene glycol, ethylene oxide adduct of bisphenol A, diols such as propylene oxide adduct of bisphenol A (including derivatives thereof) and the like. In addition, a monomer having a suitable substituent (for example, an alkyl group, an alkoxy group, a halogen atom, etc.) bonded to the dicarboxylic acid or diol having no alicyclic structure is also included in the monomer having no alicyclic structure.

  Although the ratio of the monomer unit which has an alicyclic ring with respect to all the monomer units (all monomer components) (100 mol%) which comprise the said alicyclic polyester resin is not specifically limited, 10 mol% or more (for example, 10-80 mol%) ) Is preferable, more preferably 25 to 70 mol%, still more preferably 40 to 60 mol%. When the ratio of the monomer unit having an alicyclic ring is less than 10 mol%, the heat resistance, light resistance, thermal shock resistance, and moisture absorption reflow resistance of the cured product may be lowered.

  Especially as said alicyclic polyester resin, the alicyclic polyester resin containing at least 1 or more types of structural units represented by following formula (3)-(5) is preferable.

［式中、Ｒ³は直鎖、分岐鎖、又は環状の炭素数２〜１５のアルキレン基を表す。また、Ｒ⁴〜Ｒ⁷は、それぞれ独立に、水素原子又は直鎖若しくは分岐鎖状の炭素数１〜４のアルキル基を表し、Ｒ⁴〜Ｒ⁷から選ばれる二つが結合して環を形成していてもよい。］

[Wherein, R ³ represents a linear, branched, or cyclic alkylene group having 2 to 15 carbon atoms. R ^{4 to} R ⁷ each independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms, and two selected from R ^{4 to} R ⁷ are bonded to form a ring. You may do it. ]

［式中、Ｒ³は直鎖、分岐鎖、又は環状の炭素数２〜１５のアルキレン基を表す。また、Ｒ⁴〜Ｒ⁷は、それぞれ独立に、水素原子又は直鎖若しくは分岐鎖状の炭素数１〜４のアルキル基を表し、Ｒ⁴〜Ｒ⁷から選ばれる二つが結合して環を形成していてもよい。］

[Wherein, R ³ represents a linear, branched, or cyclic alkylene group having 2 to 15 carbon atoms. R ^{4 to} R ⁷ each independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms, and two selected from R ^{4 to} R ⁷ are bonded to form a ring. You may do it. ]

［式中、Ｒ³は直鎖、分岐鎖、又は環状の炭素数２〜１５のアルキレン基を表す。また、Ｒ⁴〜Ｒ⁷は、それぞれ独立に、水素原子又は直鎖若しくは分岐鎖状の炭素数１〜４のアルキル基を表し、Ｒ⁴〜Ｒ⁷から選ばれる二つが結合して環を形成していてもよい。］

[Wherein, R ³ represents a linear, branched, or cyclic alkylene group having 2 to 15 carbon atoms. R ^{4 to} R ⁷ each independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms, and two selected from R ^{4 to} R ⁷ are bonded to form a ring. You may do it. ]

As a preferable specific example of the structural unit represented by the above formulas (3) to (5), for example, a configuration derived from 4-methyl-1,2-cyclohexanedicarboxylic acid and ethylene glycol represented by the following formula (6) Units are listed. The alicyclic polyester resin having the structural unit can be obtained, for example, by polycondensation of methylhexahydrophthalic anhydride and ethylene glycol.

Other preferred specific examples of the structural units represented by the above formulas (3) to (5) include, for example, those derived from 1,4-cyclohexanedicarboxylic acid and neopentyl glycol represented by the following formula (7). A structural unit is mentioned. The alicyclic polyester resin having the structural unit can be obtained, for example, by polycondensing 1,4-cyclohexanedicarboxylic acid and neopentyl glycol.

  When the alicyclic polyester resin has structural units represented by the above formulas (3) to (5), the total content of the structural units (total content; all monomer units constituting the structural unit) Is not particularly limited, but is 20 mol% or more (for example, 20 to 100 mol%) with respect to all structural units (100 mol%; all monomer units constituting the alicyclic polyester resin) of the alicyclic polyester resin. More preferably, it is 50-100 mol%, More preferably, it is 80-100 mol%. When the content of the structural unit represented by the above formulas (3) to (5) is less than 20 mol%, the heat resistance, light resistance, thermal shock resistance, and moisture absorption reflow resistance of the cured product may be deteriorated. .

  Although the number average molecular weight of the said alicyclic polyester resin is not specifically limited, 300-100,000 are preferable, More preferably, it is 300-30000. If the number average molecular weight of the alicyclic polyester resin is less than 300, the toughness of the cured product may not be sufficient, and the thermal shock resistance and moisture absorption reflow resistance may decrease. On the other hand, when the number average molecular weight of the alicyclic polyester resin exceeds 100,000, the compatibility with the curing agent (D) is lowered, and the transparency of the cured product may be lowered. In addition, the number average molecular weight of alicyclic polyester resin can be measured as a value of standard polystyrene conversion, for example by GPC (gel permeation chromatography) method.

  In addition, the said alicyclic polyester resin can be used individually by 1 type or in combination of 2 or more types.

  The said alicyclic polyester resin is not specifically limited, It can manufacture by a well-known thru | or usual method. More specifically, for example, the alicyclic polyester resin may be obtained by polycondensation of the above dicarboxylic acid and diol by a conventional method, or a derivative of the above dicarboxylic acid (an acid anhydride, ester, acid). It may be obtained by polycondensing a halide or the like) and a diol by a conventional method.

  In the curable epoxy resin composition of the present invention, the content (blending amount) of the alicyclic polyester resin is not particularly limited, but is the total amount (100% by weight) of the alicyclic polyester resin and the curing agent (D). ) To 1 to 60% by weight, and more preferably 5 to 30% by weight. If the content of the alicyclic polyester resin is less than 1% by weight, the thermal shock resistance and moisture absorption reflow resistance of the cured product may be insufficient. On the other hand, if the content of the alicyclic polyester resin exceeds 60% by weight, the transparency and heat resistance of the cured product may be lowered.

[Rubber particles]
The curable epoxy resin composition of the present invention may further contain rubber particles. Examples of the rubber particles include rubber particles such as particulate NBR (acrylonitrile-butadiene rubber), reactive terminal carboxyl group NBR (CTBN), metal-free NBR, particulate SBR (styrene-butadiene rubber). The rubber particles are preferably rubber particles having a multilayer structure (core-shell structure) composed of a core portion having rubber elasticity and at least one shell layer covering the core portion. The rubber particles are particularly composed of a polymer (polymer) having (meth) acrylic acid ester as an essential monomer component, and react with a compound having an epoxy group such as an alicyclic epoxy compound (A) on the surface. Rubber particles having a hydroxyl group and / or a carboxyl group (either one or both of a hydroxyl group and a carboxyl group) as the functional group to be obtained are preferred. When there is no hydroxyl group and / or carboxyl group on the surface of the rubber particles, the cured product becomes clouded by a thermal shock such as a cold cycle and the transparency is lowered, which is not preferable.

  The polymer constituting the core portion having rubber elasticity in the rubber particles is not particularly limited, but (meth) acrylic acid esters such as methyl (meth) acrylate, ethyl (meth) acrylate, and butyl (meth) acrylate are used. The essential monomer component is preferred. The polymer constituting the core portion having rubber elasticity is, for example, aromatic vinyl such as styrene and α-methylstyrene, nitrile such as acrylonitrile and methacrylonitrile, conjugated diene such as butadiene and isoprene, ethylene, propylene, Isobutene or the like may be contained as a monomer component.

  Especially, the polymer which comprises the said core part which has the rubber elasticity contains 1 type, or 2 or more types selected from the group which consists of aromatic vinyl, a nitrile, and a conjugated diene with a (meth) acrylic acid ester as a monomer component. It is preferable to include it in combination. That is, as the polymer constituting the core part, for example, (meth) acrylic acid ester / aromatic vinyl, (meth) acrylic acid ester / conjugated diene and other binary copolymers; (meth) acrylic acid ester / aromatic And terpolymers such as group vinyl / conjugated dienes. The polymer constituting the core part may contain silicone such as polydimethylsiloxane and polyphenylmethylsiloxane, polyurethane, and the like.

  The polymer constituting the core part includes, as other monomer components, divinylbenzene, allyl (meth) acrylate, ethylene glycol di (meth) acrylate, diallyl maleate, triallyl cyanurate, diallyl phthalate, butylene glycol diacrylate, etc. One monomer (one molecule) may contain a reactive crosslinking monomer having two or more reactive functional groups.

  The core part of the rubber particles is a core part composed of a (meth) acrylic ester / aromatic vinyl binary copolymer (particularly butyl acrylate / styrene). It is preferable in that the rate can be easily adjusted.

  The core part of the rubber particles can be produced by a commonly used method. For example, it can be produced by a method of polymerizing the monomer by an emulsion polymerization method. In the emulsion polymerization method, the whole amount of the monomer may be charged at once and may be polymerized, or after polymerizing a part of the monomer, the remainder may be added continuously or intermittently to polymerize, Furthermore, a polymerization method using seed particles may be used.

  The polymer constituting the shell layer of the rubber particles is preferably a polymer different from the polymer constituting the core portion. In addition, as described above, the shell layer preferably has a hydroxyl group and / or a carboxyl group as a functional group capable of reacting with a compound having an epoxy group such as the alicyclic epoxy compound (A). Thereby, especially with respect to the hardened | cured material which can improve adhesiveness in an interface with an alicyclic epoxy compound (A), and hardened the curable epoxy resin composition containing the rubber particle which has this shell layer. , Excellent crack resistance can be exhibited. Moreover, the fall of the glass transition temperature of hardened | cured material can also be prevented.

  The polymer constituting the shell layer preferably contains (meth) acrylic acid ester such as methyl (meth) acrylate, ethyl (meth) acrylate, and butyl (meth) acrylate as an essential monomer component. For example, when butyl acrylate is used as the (meth) acrylic acid ester in the core part, (meth) acrylic acid esters other than butyl acrylate (for example, (meth) acrylic) as the monomer component of the polymer constituting the shell layer It is preferable to use methyl acid, ethyl (meth) acrylate, butyl methacrylate and the like. Examples of the monomer component that may be contained in addition to the (meth) acrylic acid ester include aromatic vinyl such as styrene and α-methylstyrene, and nitrile such as acrylonitrile and methacrylonitrile. In the rubber particles, as a monomer component constituting the shell layer, it is preferable to contain the monomer alone or in combination of two or more, together with (meth) acrylic acid ester, and particularly at least aromatic vinyl. Is preferable in that the refractive index of the rubber particles can be easily adjusted.

  Further, the polymer constituting the shell layer forms a hydroxyl group and / or a carboxyl group as a functional group capable of reacting with a compound having an epoxy group such as an alicyclic epoxy compound (A) as a monomer component. , Hydroxyl group-containing monomers (hydroxyalkyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate), carboxyl group-containing monomers (α, β-unsaturated acids such as (meth) acrylic acid, maleic anhydride, etc. It is preferable to contain α, β-unsaturated acid anhydrides such as

  It is preferable that the polymer which comprises the shell layer in the said rubber particle contains 1 type, or 2 or more types selected from the said monomer in combination with (meth) acrylic acid ester as a monomer component. That is, the shell layer is formed of, for example, a ternary copolymer such as (meth) acrylic acid ester / aromatic vinyl / hydroxyalkyl (meth) acrylate, (meth) acrylic acid ester / aromatic vinyl / α, β-unsaturated acid. A shell layer composed of a polymer or the like is preferable.

  Further, the polymer constituting the shell layer includes, as the other monomer components, divinylbenzene, allyl (meth) acrylate, ethylene glycol di (meth) acrylate, diallyl maleate, trimethyl, as well as the above-described monomer. A reactive crosslinking monomer having two or more reactive functional groups may be contained in one monomer (one molecule) such as allyl cyanurate, diallyl phthalate, or butylene glycol diacrylate.

  The rubber particles (rubber particles having a core-shell structure) can be obtained by covering the core portion with a shell layer. Examples of the method of coating the core part with a shell layer include a method of coating the surface of the core part having rubber elasticity obtained by the above method by applying a copolymer constituting the shell layer, and the above method Examples thereof include a graft polymerization method in which the core portion having rubber elasticity obtained by the above is used as a trunk component, and each component constituting the shell layer is used as a branch component.

  The average particle diameter of the rubber particles is not particularly limited, but is preferably 10 to 500 nm, and more preferably 20 to 400 nm. The maximum particle size of the rubber particles is not particularly limited, but is preferably 50 to 1000 nm, more preferably 100 to 800 nm. If the average particle diameter exceeds 500 nm or the maximum particle diameter exceeds 1000 nm, the dispersibility of the rubber particles in the cured product may be reduced, and crack resistance may be reduced. On the other hand, if the average particle size is less than 10 nm or the maximum particle size is less than 50 nm, the effect of improving the crack resistance of the cured product may be difficult to obtain.

  Although the refractive index of the said rubber particle is not specifically limited, 1.40-1.60 are preferable, More preferably, it is 1.42-1.58. The difference between the refractive index of the rubber particles and the refractive index of the cured product obtained by curing the curable epoxy resin composition (the curable epoxy resin composition of the present invention) containing the rubber particles is ± 0.03. Is preferably within. When the difference in refractive index exceeds ± 0.03, the transparency of the cured product decreases, sometimes it becomes cloudy, the light intensity of the optical semiconductor device tends to decrease, and the function of the optical semiconductor device is lost. There is.

  The refractive index of the rubber particles is, for example, 1 g of rubber particles cast into a mold and compression molded at 210 ° C. and 4 MPa to obtain a flat plate having a thickness of 1 mm. And using a multi-wavelength Abbe refractometer (trade name “DR-M2”, manufactured by Atago Co., Ltd.) in a state where the prism and the test piece are in close contact using monobromonaphthalene as an intermediate solution, It can be determined by measuring the refractive index at 20 ° C. and sodium D line.

  The refractive index of the cured product of the curable epoxy resin composition of the present invention is, for example, a test of 20 mm in length, 6 mm in width, and 1 mm in thickness from a cured product obtained by the heat curing method described in the section of the optical semiconductor device below. A multi-wavelength Abbe refractometer (trade name “DR-M2”, manufactured by Atago Co., Ltd.) is used with the prism and the test piece in close contact using monobromonaphthalene as an intermediate solution. It can be obtained by measuring the refractive index at 20 ° C. and sodium D line.

  The content (blending amount) of the rubber particles in the curable epoxy resin composition of the present invention is not particularly limited, but the total amount (100 parts by weight) of the compound having an epoxy group contained in the curable epoxy resin composition. On the other hand, 0.5-30 weight part is preferable, More preferably, it is 1-20 weight part. When the content of the rubber particles is less than 0.5 parts by weight, the crack resistance of the cured product tends to decrease. On the other hand, when the content of the rubber particles exceeds 30 parts by weight, the heat resistance of the cured product tends to decrease.

[Additive]
In addition to the above, the curable epoxy resin composition of the present invention may contain various additives as long as the effects of the present invention are not impaired. For example, when a compound having a hydroxyl group such as ethylene glycol, diethylene glycol, propylene glycol, or glycerin is included as the additive, the reaction can be allowed to proceed slowly. In addition, silicone and fluorine antifoaming agents, leveling agents, and silane coupling agents such as γ-glycidoxypropyltrimethoxysilane and 3-mercaptopropyltrimethoxysilane as long as the viscosity and transparency are not impaired. Use conventional additives such as surfactants, inorganic fillers such as silica and alumina, flame retardants, colorants, antioxidants, UV absorbers, ion adsorbents, pigments, phosphors, mold release agents, etc. Can do.

<Method for producing curable epoxy resin composition>
The curable epoxy resin composition of the present invention comprises the above-described alicyclic epoxy compound (A), monoallyl diglycidyl isocyanurate compound (B), quaternary phosphonium salt (C), and curing agent (D). And the hardening accelerator (E) should just be included at least, The manufacturing method (preparation method) is not specifically limited. Specifically, for example, each component can be stirred and mixed at a predetermined ratio, and defoamed under vacuum as necessary, or the alicyclic epoxy compound (A), monoallyl A composition containing an epoxy group-containing compound such as a diglycidyl isocyanurate compound (B) as an essential component (sometimes referred to as “epoxy resin”), a curing agent (D) and a curing accelerator (E) as essential components Prepared separately (sometimes referred to as "epoxy curing agent"), stirring and mixing the epoxy resin and epoxy curing agent at a predetermined ratio, and defoaming under vacuum if necessary It can also be prepared. In this case, the quaternary phosphonium salt (C) may be mixed in advance as a constituent component of the epoxy resin and / or the epoxy curing agent, or the epoxy resin and the epoxy curing agent are mixed. In addition, you may mix | blend as components other than the said epoxy resin and the said epoxy hardening | curing agent.

  Although the temperature at the time of stirring and mixing at the time of preparing the said epoxy resin is not specifically limited, 30-150 degreeC is preferable, More preferably, it is 35-130 degreeC. Moreover, the temperature at the time of stirring and mixing at the time of preparing the said epoxy hardening | curing agent is although it does not specifically limit, 30-100 degreeC is preferable, More preferably, it is 35-80 degreeC. For the stirring / mixing, a known apparatus such as a rotation / revolution mixer, a planetary mixer, a kneader, or a dissolver can be used.

  In particular, when the alicyclic polyester resin is used as a constituent component of the curable epoxy resin composition, the alicyclic polyester resin and the curing agent (D) are mixed in advance from the viewpoint of obtaining a uniform composition. After obtaining these mixtures (a mixture of alicyclic polyester resin and curing agent (D)), quaternary phosphonium salt (C), curing accelerator (E), and other additives are blended into the mixture. It is preferable to prepare an epoxy curing agent by mixing the epoxy curing agent and a separately prepared epoxy resin. Although the temperature at the time of mixing the said alicyclic polyester resin and a hardening | curing agent (D) is not specifically limited, 60-130 degreeC is preferable, More preferably, it is 90-120 degreeC. The mixing time is not particularly limited, but is preferably 30 to 100 minutes, more preferably 45 to 80 minutes. Although mixing is not specifically limited, It is preferable to carry out in nitrogen atmosphere. Moreover, the above-mentioned well-known apparatus can be used for mixing.

  Although it does not specifically limit after mixing the said alicyclic polyester resin and a hardening | curing agent (D), Furthermore, you may give appropriate chemical processing (for example, hydrogenation, terminal modification | denaturation of an alicyclic polyester resin, etc.) etc. . In the mixture of the alicyclic polyester resin and the curing agent (D), a part of the curing agent (D) is reacted with the alicyclic polyester resin (for example, a hydroxyl group of the alicyclic polyester resin). May be.

  Examples of the mixture of the alicyclic polyester resin and the curing agent (D) include “HN-7200” (manufactured by Hitachi Chemical Co., Ltd.), “HN-5700” (manufactured by Hitachi Chemical Co., Ltd.), and the like. A commercially available product can also be used.

<Hardened product>
By curing the curable epoxy resin composition of the present invention, a cured product having excellent heat resistance, light resistance, and thermal shock resistance, and particularly excellent in moisture absorption reflow resistance can be obtained. Although the heating temperature (curing temperature) in the case of hardening is not specifically limited, 45-200 degreeC is preferable, More preferably, it is 100-190 degreeC, More preferably, it is 100-180 degreeC. In addition, the heating time (curing time) for curing is not particularly limited, but is preferably 30 to 600 minutes, more preferably 45 to 540 minutes, and still more preferably 60 to 480 minutes. When the curing temperature and the curing time are lower than the lower limit value in the above range, curing is insufficient. On the contrary, when the curing temperature and the curing time are higher than the upper limit value in the above range, the resin component may be decomposed. Although the curing conditions depend on various conditions, for example, when the curing temperature is increased, the curing time can be shortened, and when the curing temperature is decreased, the curing time can be appropriately increased.

<Resin composition for optical semiconductor encapsulation>
The curable epoxy resin composition of the present invention can be preferably used as a resin composition for optical semiconductor encapsulation. An optical semiconductor in which an optical semiconductor element is sealed with a cured product having high heat resistance, light resistance, and thermal shock resistance, and particularly excellent in moisture absorption and reflow resistance, by using the resin composition for sealing an optical semiconductor. A device is obtained. Even if the above optical semiconductor device is provided with a high-output, high-brightness optical semiconductor element, the light intensity is unlikely to decrease with time, especially when it is heated in a reflow process after being stored under high humidity conditions. However, deterioration such as a decrease in luminous intensity is unlikely to occur.

<Optical semiconductor device>
The optical semiconductor device of the present invention is an optical semiconductor device in which an optical semiconductor element is sealed with a cured product of the curable epoxy resin composition (resin composition for optical semiconductor sealing) of the present invention. The optical semiconductor element is sealed by injecting the curable epoxy resin composition prepared by the above-described method into a predetermined mold and heat-curing under predetermined conditions. Thereby, the optical semiconductor device with which the optical semiconductor element was sealed with the hardened | cured material of the curable epoxy resin composition is obtained. The curing temperature and the curing time can be set in the same range as at the time of preparing the cured product.

  The curable epoxy resin composition of the present invention is not limited to the above-mentioned optical semiconductor element sealing application, for example, an adhesive, an electrical insulating material, a laminate, a coating, an ink, a paint, a sealant, a resist, a composite material, It can also be used for applications such as transparent substrates, transparent sheets, transparent films, optical elements, optical lenses, optical members, optical modeling, electronic paper, touch panels, solar cell substrates, optical waveguides, light guide plates, holographic memories, etc. .

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

Production Example 1
(Manufacture of rubber particles)
In a 1 L polymerization vessel equipped with a reflux condenser, 500 g of ion-exchanged water and 0.68 g of sodium dioctylsulfosuccinate were charged, and the temperature was raised to 80 ° C. while stirring under a nitrogen stream. A monomer mixture consisting of 9.5 g of butyl acrylate, 2.57 g of styrene, and 0.39 g of divinylbenzene corresponding to about 5% by weight of the amount required to form the core portion is added here. After stirring for 20 minutes to emulsify, 9.5 mg of potassium peroxodisulfate was added and stirred for 1 hour for initial seed polymerization. Subsequently, 180.5 mg of potassium peroxodisulfate was added and stirred for 5 minutes. Here, the remaining amount (about 95% by weight) of butyl acrylate 180.5 g, styrene 48.89 g, divinylbenzene 7.33 g and 0.95 g of sodium dioctyl sulfosuccinate were added to form the core part. The dissolved monomer mixture was continuously added over 2 hours to perform the second seed polymerization, and then aged for 1 hour to obtain a core part.
Next, 60 mg of potassium peroxodisulfate was added and stirred for 5 minutes. Here, 0.3 g of sodium dioctylsulfosuccinate was dissolved in 60 g of methyl methacrylate, 1.5 g of acrylic acid and 0.3 g of allyl methacrylate. The monomer mixture was continuously added over 30 minutes to perform seed polymerization. Then, it aged for 1 hour and formed the shell layer which coat | covers a core part.
Next, the mixture was cooled to room temperature (25 ° C.) and filtered through a plastic mesh having an opening of 120 μm to obtain a latex containing rubber particles having a core-shell structure. The obtained latex was frozen at −30 ° C., dehydrated and washed with a suction filter, and then blown and dried at 60 ° C. overnight to obtain rubber particles. The resulting rubber particles had an average particle size of 254 nm and a maximum particle size of 486 nm.

The average particle size and the maximum particle size of the rubber particles are “Nanotrac ^™ ” type nanotrack particle size distribution measuring device (trade name “UPA-EX150”, manufactured by Nikkiso Co., Ltd.) based on the dynamic light scattering method. ) Was used to measure the sample, and in the obtained particle size distribution curve, the average particle size, which is the particle size when the cumulative curve becomes 50%, is the average particle size, and the frequency (%) of the particle size distribution measurement result is 0 The maximum particle size at the time of exceeding 0.000 was defined as the maximum particle size. In addition, as said sample, what disperse | distributed 1 weight part of rubber particle dispersion | distribution epoxy compounds obtained by the following manufacture example 2 to 20 weight part of tetrahydrofuran was used.

Production Example 2
(Manufacture of rubber particle-dispersed epoxy compounds)
Using a dissolver (1000 rpm, 60 minutes) with 10 parts by weight of the rubber particles obtained in Production Example 1 heated to 60 ° C. under a nitrogen stream, the product name “Celoxide 2021P” (3,4-epoxy) Cyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate (manufactured by Daicel Corporation) is dispersed in 64 parts by weight and vacuum degassed to obtain a rubber particle-dispersed epoxy compound (viscosity at 25 ° C .: 724 mPa · s). It was.
The viscosity (viscosity at 25 ° C.) of the rubber particle-dispersed epoxy compound obtained in Production Example 2 (10 parts by weight of rubber particles dispersed in 64 parts by weight of ceroxide 2021P) is a digital viscometer (trade name) It measured using "DVU-EII type | mold, Tokimec Co., Ltd.).

Production Example 3
(Manufacture of epoxy resin)
In the blending ratio (unit: parts by weight) shown in Table 1 and Table 2, the trade name “Celoxide 2021P” (alicyclic epoxy compound, manufactured by Daicel Corporation), monoallyl diglycidyl isocyanurate (MA-DGIC, Shikoku Chemicals) Kogyo Co., Ltd.), trade name "X-40-2678" (siloxane derivative having two epoxy groups in the molecule, manufactured by Shin-Etsu Chemical Co., Ltd.), trade name "X-40-2720" (intramolecular Siloxane derivative having 3 epoxy groups, manufactured by Shin-Etsu Chemical Co., Ltd., trade name “X-40-2670” (siloxane derivative having 4 epoxy groups in the molecule, manufactured by Shin-Etsu Chemical Co., Ltd.) ), Trade name “YD-128” (bisphenol A type epoxy resin, manufactured by Nippon Steel Chemical Co., Ltd.), and rubber particle-dispersed epoxy resin obtained in Production Example 2 were mixed with a self-revolving stirrer (Sinky Corporation). Were homogeneously mixed using a Awatori Rentaro AR-250), to obtain an epoxy resin (epoxy resin in Examples and Comparative Examples 2 to 7) and degassed. In addition, when MA-DGIC was used as a component of an epoxy resin, the said mixing was implemented by dissolving MA-DGIC by stirring at 80 degreeC for 1 hour. In Tables 1 and 2, “-” means that the component was not blended, and the same applies to the following.

Production Example 4
(Manufacture of epoxy curing agent)
In the blending ratios (unit: parts by weight) shown in Tables 1 and 2, the trade name “Ricacid MH-700” (curing agent, manufactured by Shin Nippon Rika Co., Ltd.), the trade name “HN-7200” (curing agent and fat Mixture of cyclic polyester resin, manufactured by Hitachi Chemical Co., Ltd.), trade name “HN-5700” (mixture of curing agent and alicyclic polyester resin, manufactured by Hitachi Chemical Co., Ltd.), trade name “PX-4ET "(Tetra-n-butylphosphonium diethylphosphodithionate, manufactured by Nippon Chemical Industry Co., Ltd.), trade name" TBP-BB "tetra-n-butylphosphonium bromide (produced by Hokuko Chemical Co., Ltd.), trade name" U -CAT 18X "(curing accelerator, manufactured by San Apro Co., Ltd.), ethylene glycol (additive, manufactured by Wako Pure Chemical Industries, Ltd.), self-revolving stirrer (manufactured by Shinky Co., Ltd., Kentaro Awatori AR) -250) Uniformly mixed by use, to obtain an epoxy curing agent (sometimes referred to as K agent) was degassed.

Example 1
In order to obtain the blending ratio (unit: parts by weight) shown in Table 1, the epoxy resin obtained in Production Example 3 and the epoxy curing agent obtained in Production Example 4 were mixed with a self-revolving stirrer (trade name “Awatori”). The mixture was uniformly mixed and defoamed using Nertaro AR-250 "(manufactured by Shinky Co., Ltd.) to obtain a curable epoxy resin composition.
Further, the curable epoxy resin composition obtained above was cast into an optical semiconductor lead frame (InGaN element, 3.5 mm × 2.8 mm) shown in FIG. 1, and then in an oven (resin curing oven) at 120 ° C. By heating for 5 hours, the optical semiconductor device with which the optical semiconductor element was sealed with the hardened | cured material of the said curable epoxy resin composition was obtained. In FIG. 1, 100 is a reflector (light reflecting resin composition), 101 is a metal wiring, 102 is an optical semiconductor element, 103 is a bonding wire, and 104 is a cured product (sealing material).

Examples 2-14, Comparative Examples 1-10
A curable epoxy resin composition was prepared in the same manner as in Example 1 except that the composition of the curable epoxy resin composition was changed to the compositions shown in Tables 1 and 2. In addition, an optical semiconductor device was fabricated in the same manner as in Example 1.

<Evaluation>
The following evaluation tests were carried out on the optical semiconductor devices obtained in the examples and comparative examples.

[Energization test]
The total luminous flux of the optical semiconductor devices obtained in the examples and comparative examples was measured using a total luminous flux measuring machine, and this was defined as “total luminous flux for 0 hour”. Further, the total luminous flux after flowing a current of 30 mA through the optical semiconductor device for 100 hours in an 85 ° C. constant temperature bath was measured, and this was defined as “total luminous flux after 100 hours”. And luminous intensity retention was computed from the following formula. The results are shown in the column of “Luminance retention [%]” in Tables 1 and 2.
{Luminance retention (%)}
= {Total luminous flux after 100 hours (lm)} / {total luminous flux after 0 hours (lm)} × 100

[Solder heat resistance test]
The optical semiconductor devices (two used for each curable epoxy resin composition) obtained in the examples and comparative examples were left to stand for 192 hours under the conditions of 30 ° C. and 70% RH for moisture absorption treatment. Subsequently, the said optical semiconductor device was put into the reflow furnace, and it heat-processed on the following heating conditions. Thereafter, the optical semiconductor device was taken out in a room temperature environment and allowed to cool, and then again placed in a reflow furnace and heat-treated under the same conditions. That is, in the solder heat resistance test, the thermal history under the following heating conditions was given twice to the optical semiconductor device.
[Heating conditions (based on surface temperature of optical semiconductor device)]
(1) Preheating: 150 to 190 ° C. for 60 to 120 seconds (2) Main heating after preheating: 217 ° C. or more for 60 to 150 seconds, maximum temperature 260 ° C.
However, the rate of temperature increase when shifting from preheating to main heating was controlled to 3 ° C./second at the maximum.
FIG. 2 shows an example of a surface temperature profile (temperature profile in one of the two heat treatments) of the optical semiconductor device when heated by the reflow furnace.
Thereafter, the optical semiconductor device was observed using a digital microscope (trade name “VHX-900”, manufactured by Keyence Co., Ltd.), whether or not a crack having a length of 90 μm or more occurred in the cured product, and It was evaluated whether or not electrode peeling (peeling of the cured product from the electrode surface) occurred. Of the two optical semiconductor devices, the number of optical semiconductor devices having a crack of 90 μm or longer in the cured product is shown in the column of “Solder heat resistance test [number of cracks]” in Tables 1 and 2, and electrode peeling The number of the optical semiconductor devices in which the occurrence of the problem is shown in the column of “Solder heat resistance test [number of electrode peelings]” in Tables 1 and 2.

[Thermal shock test]
The optical semiconductor devices obtained in the examples and comparative examples (two were used for each curable epoxy resin composition) were exposed in an atmosphere of −40 ° C. for 30 minutes, and then in an atmosphere of 120 ° C. A thermal shock with one cycle of exposure to 30 minutes was applied for 200 cycles using a thermal shock tester. Then, the length of the crack which arose in the hardened | cured material in an optical semiconductor device was observed using a digital microscope (brand name "VHX-900", the Keyence Co., Ltd. product), and hardening was carried out among two optical semiconductor devices. The number of optical semiconductor devices in which cracks having a length of 90 μm or more occurred in the object was measured. The results are shown in the column of “thermal shock test [number of cracks]” in Tables 1 and 2.

[Comprehensive judgment]
As a result of each test, what satisfy | filled all the following (1)-(4) was determined as (circle) (good). On the other hand, when any of the following (1) to (4) was not satisfied, it was determined as x (defective).
(1) Current test: luminous intensity retention of 90% or more (2) Solder heat resistance test: No. of optical semiconductor devices having cracks of 90 μm or more in cured product (3) Solder heat resistance test: The number of optical semiconductor devices in which electrode peeling occurred was zero. (4) Thermal shock test: the number of optical semiconductor devices in which a crack having a length of 90 μm or more occurred in a cured product was zero. The results are shown in Tables 1 and 2 below. It is shown in the column of “Overall judgment”.

In addition, the component used by the Example and the comparative example is as follows.
(Epoxy resin)
CEL2021P (Celoxide 2021P): 3,4-epoxycyclohexylmethyl (3,4-epoxy) cyclohexanecarboxylate, manufactured by Daicel Corporation MA-DGIC: monoallyl diglycidyl isocyanurate, manufactured by Shikoku Kasei Kogyo Co., Ltd. X-40 -2678: Siloxane derivative having two epoxy groups in the molecule, manufactured by Shin-Etsu Chemical Co., Ltd. X-40-2720: Siloxane derivative having three epoxy groups in the molecule, manufactured by Shin-Etsu Chemical Co., Ltd. X -40-2670: Siloxane derivative having 4 epoxy groups in the molecule, manufactured by Shin-Etsu Chemical Co., Ltd. YD-128: Bisphenol A type epoxy resin, manufactured by Nippon Steel Chemical Co., Ltd. (K agent)
MH-700 (Licacid MH-700): 4-methylhexahydrophthalic anhydride / hexahydrophthalic anhydride = 70/30, manufactured by Shin Nippon Rika Co., Ltd. HN-7200: 4-methylhexahydrophthalic anhydride and alicyclic ring Mixture of polyester resin, manufactured by Hitachi Chemical Co., Ltd. HN-5700: Mixture of 4-methylhexahydrophthalic anhydride / 3-methylhexahydrophthalic anhydride = 70/30 and alicyclic polyester resin, Hitachi Chemical PX-4ET: Tetra-n-butylphosphonium O, O-diethylphosphodithioate, manufactured by Nippon Chemical Industry Co., Ltd. TBP-BB: Tetra-n-butylphosphonium bromide, manufactured by Hokuko Chemical Co., Ltd. U -CAT 18X: Curing accelerator, manufactured by San Apro Co., Ltd. Ethylene glycol: manufactured by Wako Pure Chemical Industries, Ltd.

Test equipment ・ Resin curing oven ESPH Co., Ltd. GPH-201
-Thermostatic chamber ESPEC Co., Ltd. Small high temperature chamber ST-120B1
・ Total luminous flux measuring machine Optronic Laboratories Multi-spectral Radiation Measurement System OL771
・ Thermal shock tester Espec Co., Ltd. Small thermal shock device TSE-11-A
-Reflow furnace manufactured by Nippon Antom Co., Ltd., UNI-5016F

100: Reflector (resin composition for light reflection)
101: Metal wiring 102: Optical semiconductor element 103: Bonding wire 104: Hardened material (sealing material)

Claims (9)

Alicyclic epoxy compound (A) and the following formula (1)

[Wherein R ¹ and R ² represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms]
A monoallyl diglycidyl isocyanurate compound (B), a quaternary phosphonium salt (C), a curing agent (D), and a curing accelerator (E) (provided that the quaternary phosphonium salt (C) And a siloxane derivative having two or more epoxy groups in the molecule,
Curability characterized in that the weight ratio of the quaternary phosphonium salt (C) to the curing accelerator (E) [quaternary phosphonium salt (C) / curing accelerator (E)] is 0.01-100. an epoxy resin composition,
The quaternary phosphonium salt (C) is selected from a halide salt of quaternary phosphonium, a borate salt of quaternary phosphonium, a benzotriazolate salt of quaternary phosphonium, and an organic acid salt of quaternary phosphonium. A curable epoxy resin composition which is at least one kind .   The curable epoxy resin composition according to claim 1, wherein the alicyclic epoxy compound (A) is a compound having a cyclohexene oxide group. The alicyclic epoxy compound (A) is represented by the following formula (I-1)

The curable epoxy resin composition according to claim 1, which is a compound represented by the formula:   The curable epoxy resin composition according to any one of claims 1 to 3, wherein the quaternary phosphonium salt (C) is an organic acid salt of quaternary phosphonium.   Furthermore, the curable epoxy resin composition of any one of Claims 1-4 containing an alicyclic polyester resin.   Furthermore, the curable epoxy resin composition of any one of Claims 1-5 containing a rubber particle.   Hardened | cured material of the curable epoxy resin composition of any one of Claims 1-6.   It is a resin composition for optical semiconductor sealing, The curable epoxy resin composition of any one of Claims 1-6.   An optical semiconductor device in which an optical semiconductor element is sealed with a cured product of the curable epoxy resin composition according to claim 8.

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