CN111138809B - Halogen-free resin composition - Google Patents
Halogen-free resin composition Download PDFInfo
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- CN111138809B CN111138809B CN202010030542.9A CN202010030542A CN111138809B CN 111138809 B CN111138809 B CN 111138809B CN 202010030542 A CN202010030542 A CN 202010030542A CN 111138809 B CN111138809 B CN 111138809B
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
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- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The invention provides a halogen-free resin composition, which comprises the following components: (A)100 parts by weight of an epoxy resin; (B)25-50 parts by weight of maleic anhydride modified hardener; (C)20-60 parts by weight of benzoxazine resin; (D)20-65 parts by weight of a flame retardant; and (E)0.5 to 20 parts by weight of a hardening accelerator. The invention can achieve the circuit substrate characteristics of high glass transition temperature, low dielectric property, high heat resistance, flame retardance, no halogen and the like by comprising specific components and proportions; the composition can be made into a semi-solidified rubber sheet or a resin film, and further can be applied to metal laminated plates and printed circuit boards.
Description
The application is a divisional application, and the application date of the original application is as follows: 2016, 11, 28 months; the application numbers are: 201611064723.3, respectively; the invention has the name: a halogen-free resin composition.
Technical Field
The present invention relates to a halogen-free resin composition, and more particularly to a halogen-free resin composition with low dielectric constant.
Background
Due to the rising awareness of global environmental protection and the RoHS environmental regulations implemented by European Union, the copper clad laminate gradually replaces the conventional FR-4 laminate by using lead-free process and halogen-free environment-friendly laminate. In addition to the japanese manufacturers, the introduction of environmental protection substrates into mobile phones, consumer electronics and notebook computer products in the international factories such as samsung electronics, apple, dell and lotgin will drive the permeability of environmental protection substrates to grow greatly in recent years.
Moreover, with the rapid development of wireless transmission products and the leap forward of high frequency transmission technology, the materials of the existing epoxy resin and phenolic resin systems have not been able to meet the advanced applications, especially the requirements of high frequency printed circuit boards.
In the prior art of manufacturing a circuit board with a copper clad laminate (or called copper clad laminate), an epoxy resin and a curing agent are used as raw materials of a thermosetting resin composition, a reinforcing material (such as glass fiber cloth) and the thermosetting resin are combined by heating to form a prepreg, and the prepreg and an upper copper foil and a lower copper foil are laminated at high temperature and high pressure. In the prior art, epoxy resin and phenolic (phenolic novolac) resin hardener with hydroxyl (-OH) are generally used as thermosetting resin composition raw materials, the phenolic resin and the epoxy resin are combined to open the ring of the epoxy group to form another hydroxyl group, and the hydroxyl group can improve the dielectric constant and the dielectric loss value, is easy to combine with moisture and increases the hygroscopicity.
There is disclosed a thermosetting resin composition using cyanate ester resin, dicyclopentadienyl epoxy resin, silica and thermoplastic resin, which has low dielectric constant and low dielectric loss. However, this manufacturing method must use flame retardants containing halogen (such as bromine) such as tetrabromocyclohexane, hexabromocyclodecane and 2,4, 6-tris (tribromophenoxy) -1,3, 5-triazabenzene, and these flame retardants containing bromine are likely to cause environmental pollution during product manufacturing, use, and even recycling or discarding. In order to improve the heat resistance, flame retardancy, low dielectric loss, low moisture absorption, high crosslinking density, high glass transition temperature, high adhesion and proper thermal expansion of the copper foil substrate, the materials of the epoxy resin, the hardener and the reinforcing material are selected as main influencing factors.
Therefore, how to develop a material with excellent dielectric properties and meeting the requirements of other characteristics of printed circuit boards, such as high Tg, low thermal expansion coefficient and low water absorption, and apply it to the manufacture of high frequency printed circuit boards is a problem that printed circuit board material suppliers are demanding to solve at present.
Disclosure of Invention
An object of the present invention is to provide a halogen-free resin composition, which comprises specific components and proportions thereof, so as to achieve the circuit board properties of high glass transition temperature, low dielectric characteristics, high heat resistance, flame retardancy, no halogen, and the like.
In order to achieve the above object, the present invention provides a halogen-free resin composition comprising: (A)100 parts by weight of an epoxy resin; (B)25-50 parts by weight of maleic anhydride modified hardener; (C)20-60 parts by weight of benzoxazine resin; (D)20-65 parts by weight of a flame retardant; and (E)0.5 to 20 parts by weight of a hardening accelerator.
The maleic anhydride modified hardener has modified maleic anhydride copolymers of the following formulas 1 and 2, which have the function of effectively reducing the dissipation factor Df.
Formula 1
Wherein m and n are positive integers, which may be the same or different numbers,
r is:
wherein x, y and z are 0 or positive integers,
formula 2
Wherein X, Y and n are the same or different positive integers,
r is a cycloolefin copolymer:
wherein R is1、R2、R3Are respectively independent halogen atoms, carbon-containing alkyl or aromatic, m and n are same or different positive integers,
or R is acetic anhydride:
the maleic anhydride modified hardener further comprises at least one of the following groups:
(1) styrene-maleic anhydride copolymer
Wherein m and n are the same or different positive integers,
(2) maleic anhydride-modified polyimide resin having the following formula 3
Formula 3
Wherein X represents a carbon chain group containing more than 10 carbon atoms, a benzene ring group or a structure of a carbon chain containing more than 10 carbon atoms and a benzene ring group, and m, n and l are integers and are more than or equal to 1.
In one embodiment of the present invention, the epoxy resin is selected from at least one of the following groups: bisphenol a type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol a novolac type epoxy resin, bisphenol F novolac type epoxy resin, stilbene type epoxy resin, epoxy resin containing a triazine skeleton, epoxy resin containing a fluorene skeleton, triphenol methane type epoxy resin, biphenyl type epoxy resin, xylylene type epoxy resin, biphenyl aralkyl type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, alicyclic epoxy resin, polyfunctional phenol and condensed ring aromatic diglycidyl ether compounds, trifunctional and tetrafunctional epoxy resins having 3 or 4 epoxy groups in the molecule, and phosphorus-containing epoxy resins having a function of effectively raising the glass transition temperature Tg (175 °).
The benzoxazine resin is selected from at least one of the following groups: bisphenol A (BPA) type benzoxazines, bisphenol F (BPF) type benzoxazines, bisphenol S (BPS) type benzoxazines, diaminodiphenylmethane (DDM) type benzoxazines, diaminodiphenyl ether (ODA) type benzoxazines, and polyimidized benzoxazines (polybenzoxazine with polyimide) having functions of effectively decreasing the dielectric constant Dk (1 to 10GHz, on average about 4.1), the dissipation factor Df (1 to 10GHz, on average about 0.008), and improving the heat resistance.
Flame retardants such as non-dopo flame retardants, compounds containing phosphorus and/or vinyl groups, the flame retardants being selected from at least one of the group of flame retardants having the following structural formula, which have a flame retardant function;
is like
Wherein R is selected from:
one or more of the group consisting of;
formula II
Wherein X is selected from:
one or more of the group consisting of;
y is selected from:
One or more of the group, n is an integer of 0-500;
formula III
Wherein X is selected from:
one or more of the group consisting of;
a is selected from:
one or more of the group consisting of;
when n is 0, Y is:
when n is an integer from 1 to 500, Y is selected from:
one or more of the group consisting of m is more than or equal to 0;
z is selected from:
one or more of the group consisting of n is more than or equal to 0.
The resin composition of the invention does not adopt 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) derivatives, and has the defect that P-O-C bonds in the DOPO structure are easy to hydrolyze into P-OH, so that the dielectric constant and the low dielectric loss of the material are increased, and Non-DOPO type flame retardants are selected to avoid increasing Dk and Df of the material.
In addition to the Non-dopo type flame retardant, at least one specific flame retardant compound selected from the following compounds may be optionally added. The selected flame retardant compound may be a phosphate compound or a nitrogen-containing phosphate compound, but is not limited thereto, for example: resorcinol bis-xylylphosphates (RDXP, e.g., PX-200)), melamine polyphosphate (melamine polyphosphate), tris (2-carboxyethyl) phosphine (tri (2-carboxyethyl) phosphine, TCEP), trimethylphosphate (trimethy phosphate, TMP), tris (isopropyl chloride) phosphate, dimethyl methyl phosphate (DMMP), bisphenol diphenyl phosphate (biphenol diphenyl phosphate), ammonium polyphosphate (ammonium polyphosphate), hydroquinone-bis- (diphenyl phosphate) (hydroquinone bis- (diphenyl phosphate)), bisphenol a-bis- (diphenyl phosphate) (biphenol a bis- (diphenyl phosphate)).
The hardening accelerator is selected from: imidazole (imidazole), boron trifluoride amine complex, 2-ethyl-4-methylimidazole (2E4MI)), 2-methylimidazole (2MI)), 2-phenylimidazole (2-phenyl-1H-imidizole (2PZ)), ethyltriphenylphosphonium chloride (ethyltriphenylphosphonium chloride), Triphenylphosphine (TPP), and one or more of 4-Dimethylaminopyridine (DMAP)), low molecular weight bromo-terminated liquid butadiene rubber BTPB (tertiary bromine-brominated butadiene rubber).
The resin composition of one embodiment of the present invention may further include an inorganic filler to increase the thermal conductivity of the resin composition and improve the thermal expansion and mechanical strength of the resin composition. The inorganic filler is preferably uniformly distributed in the resin composition. The inorganic filler may be previously surface-treated via a silane coupling agent. The inorganic filler may be spherical, flaky, granular, columnar, plate-like, needle-like or irregular. The inorganic filler may comprise one or more of silica (molten, non-molten, porous or hollow), alumina, aluminum hydroxide, magnesium oxide, magnesium hydroxide, calcium carbonate, aluminum nitride, boron nitride, aluminum silicon carbide, titanium dioxide, zinc oxide, zirconia, barium sulfate, magnesium carbonate, barium carbonate, mica, talc, graphene.
The invention has the beneficial effects that:
the halogen-free resin composition comprises the specific components and the specific proportion, so that the halogen-free resin composition can achieve low dielectric constant, low dielectric loss, high heat resistance and high flame resistance; the semi-cured film or the resin film can be manufactured, and the purpose of being applied to a copper foil substrate and a printed circuit board is achieved; in terms of industrial applicability, the products derived from the invention can fully meet the current market demands.
Detailed Description
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, several embodiments accompanied with figures are described in detail as follows: the resin compositions of examples 1 to 4 are listed in table one, and the resin compositions of comparative examples 1 to 5 are listed in table three, respectively.
Example 1(E1)
A resin composition comprises the following components:
(A)40 parts by weight of dicyclopentadiene epoxy resin (HP-7200);
(B)60 parts by weight of biphenyl epoxy resin (NC-3000);
(C)25 parts by weight of styrene maleic anhydride (EF-60);
(D)50 parts by weight of a benzoxazine resin (LZ 8280);
(E)35 parts by weight of a flame retardant of formula (I);
(F)1.5 parts by weight of a flame retardant compound (PX-200);
(G)35 parts by weight of fused silica;
(H)1 part by weight of a hardening accelerator (2E4 MI);
(I)45 parts by weight of a methyl ethyl ketone solvent (MEK);
(J)20 parts by weight of propylene glycol methyl ether acetate solvent (PMA).
Example 2(E2)
A resin composition comprises the following components:
(A)40 parts by weight of dicyclopentadiene epoxy resin (HP-7200);
(B)60 parts by weight of biphenyl epoxy resin (NC-3000);
(C)15 parts by weight of the modified maleic anhydride copolymer of formula 1;
(D)15 parts by weight of the modified maleic anhydride copolymer of formula 2;
(E)25 parts by weight of a benzoxazine resin (LZ 8280);
(F)55 parts by weight of a flame retardant of formula III;
(G)8 parts by weight of a flame retardant compound (TCEP);
(H)42 parts by weight of fused silica;
(I)1 part by weight of a hardening accelerator (2E4 MI);
(J)35 parts by weight of methyl ethyl ketone solvent (MEK).
Example 3(E3)
A resin composition comprises the following components:
(A)40 parts by weight of dicyclopentadiene epoxy resin (HP-7200);
(B)60 parts by weight of biphenyl epoxy resin (NC-3000);
(C)35 parts by weight of a maleic anhydride-modified polyimide resin of formula 3;
(D)37 parts by weight of a benzoxazine resin (LZ 8280);
(E)49 parts by weight of a flame retardant of formula II;
(F)7 parts by weight of a flame retardant compound (TMP);
(G)38 parts by weight of fused silica;
(H)1 part by weight of a hardening accelerator (2E4 MI);
(I)77 parts by weight of methyl ethyl ketone solvent (MEK).
Example 4(E4)
A resin composition comprises the following components:
(A)40 parts by weight of dicyclopentadiene epoxy resin (HP-7200);
(B)60 parts by weight of biphenyl epoxy resin (NC-3000);
(C)10 parts by weight of styrene maleic anhydride (EF-60);
(D)10 parts by weight of the modified maleic anhydride copolymer of formula 1;
(E)10 parts by weight of the modified maleic anhydride copolymer of formula 2;
(F)20 parts by weight of a maleic anhydride-modified polyimide resin of formula 3;
(G)20 parts by weight of a benzoxazine resin (LZ 8280);
(H)22 parts by weight of a flame retardant of formula II;
(I)30 parts by weight of a flame retardant of formula III;
(J)1 part by weight of a flame retardant compound (PX-200);
(K)3.5 parts by weight of a flame retardant compound (TCEP);
(L)1 part by weight of a flame retardant compound (TMP);
(M)30 parts by weight of fused silica;
(N)10 parts by weight of a spherical silica;
(O)1 part by weight of a hardening accelerator (2E4 MI);
(P)58 parts by weight of a methyl ethyl ketone solvent (MEK);
(Q)20 parts by weight of propylene glycol monomethyl ether acetate solvent (PMA).
Comparative example 1(C1)
A resin composition comprises the following components:
(A)40 parts by weight of dicyclopentadiene epoxy resin (HP-7200);
(B)60 parts by weight of biphenyl epoxy resin (NC-3000);
(C)30 parts by weight of styrene maleic anhydride (EF-60);
(D)36 parts by weight of a flame retardant of formula I;
(E)28 parts by weight of fused silica;
(F)1 part by weight of a hardening accelerator (2E4 MI);
(G)42 parts by weight of a methyl ethyl ketone solvent (MEK);
(H)20 parts by weight of propylene glycol methyl ether acetate solvent (PMA).
Comparative example 2(C2)
A resin composition comprises the following components:
(A)40 parts by weight of dicyclopentadiene epoxy resin (HP-7200);
(B)60 parts by weight of biphenyl epoxy resin (NC-3000);
(C)60 parts by weight of a benzoxazine resin (LZ 8280);
(D)62 parts by weight of a flame retardant of formula III; (with 20-65 parts by weight of a flame retardant modification so as to be within the range)
(E)57 parts by weight of fused silica;
(F)1 part by weight of a hardening accelerator (2E4 MI);
(G)80 parts by weight of methyl ethyl ketone solvent (MEK).
Comparative example 3(C3)
A resin composition comprises the following components:
(A)40 parts by weight of dicyclopentadiene epoxy resin (HP-7200);
(B)60 parts by weight of biphenyl epoxy resin (NC-3000);
(C)20 parts by weight of the modified maleic anhydride copolymer of formula 1;
(D)20 parts by weight of the modified maleic anhydride copolymer of formula 2;
(E)60 parts by weight of a flame retardant of formula II;
(F)47 parts by weight of fused silica;
(G)1 part by weight of a hardening accelerator (2E4 MI);
(H)114 parts by weight of methyl ethyl ketone solvent (MEK).
Comparative example 4(C4)
A resin composition comprises the following components:
(A)40 parts by weight of dicyclopentadiene epoxy resin (HP-7200);
(B)60 parts by weight of biphenyl epoxy resin (NC-3000);
(C)40 parts by weight of a maleic anhydride-modified polyimide resin of formula 3;
(D)50 parts by weight of a benzoxazine resin (LZ 8280);
(E)30 parts by weight of a bromine-containing flame retardant (SAYTEX 8010(10 Br));
(F)41 parts by weight of fused silica;
(G)1 part by weight of a hardening accelerator (2E4 MI);
(H)97 parts by weight of methyl ethyl ketone solvent (MEK).
Comparative example 5(C5)
A resin composition comprises the following components:
(A)40 parts by weight of dicyclopentadiene epoxy resin (HP-7200);
(B)60 parts by weight of biphenyl epoxy resin (NC-3000);
(C)35 parts by weight of a maleic anhydride-modified polyimide resin of formula 3;
(D)20 parts by weight of a benzoxazine resin (LZ 8280);
(E)30 parts by weight of fused silica;
(F)1 part by weight of a hardening accelerator (2E4 MI);
(G)56 parts by weight of methyl ethyl ketone solvent (MEK).
The resin compositions of examples 1 to 4 and comparative examples 1 to 5 were mixed in a stirring tank in batches and then placed in an impregnation tank, and then glass fiber cloth was passed through the impregnation tank to adhere the resin compositions to the glass fiber cloth, and then the mixture was heated and baked to be in a semi-cured state to obtain a prepreg.
And (3) taking four semi-cured films and two 18-micron copper foils of the same batch of semi-cured films, overlapping the semi-cured films and the copper foils in sequence, and pressing the semi-cured films and the copper foils at 220 ℃ for 2 hours under a vacuum condition to form a copper foil substrate, wherein the four semi-cured films are cured to form an insulating layer between the two copper foils.
The physical properties of the copper-containing substrate and the copper-free substrate after copper foil etching were measured, and the physical properties were measured by glass transition temperature (Tg), heat resistance of the copper-containing substrate (T288), solder dip test of the copper-containing substrate (solder dip 288 ℃,10 seconds, heat resistance times, S/D), PCT post-moisture soak test of the copper-free substrate (pressing painting at 121 ℃,1 hour later, solder dip 288 ℃, PCT after 20 seconds, with or without popping up), tension between copper foil and substrate (blanking tension, P/S), dielectric constant (the lower the Dk is, the better the dielectric loss (the lower the Df is), and flame resistance (flame test, UL94, where the order of superiority and inferiority is V-0> V-1> V-2).
Wherein the results of measuring the physical properties of the substrates prepared from the resin compositions of examples 1 to 4 are shown in table two, and the results of measuring the physical properties of the substrates prepared from the resin compositions of comparative examples 1 to 5 are shown in table four. From the second and fourth tables, it can be seen that, when the resin compositions disclosed in the present invention are added in the proportions of the respective components, substrates having good physical properties can be obtained, and the substrates of comparative examples 1 to 5 have poor physical properties. The results of examples 1 to 3 using different maleic anhydride modified curing agents respectively show that the modified maleic anhydride copolymers of formula 1 and formula 2 in combination with benzoxazine resin can provide better substrate heat resistance (Tg, T288, S/D) and copper foil tensile force (P/S), and the maleic anhydride modified polyimide resin of formula 3 in combination with benzoxazine resin can provide better dielectric constant (Dk) and dielectric loss (Df).
The results of comparative example 1 show that the substrates containing no benzoxazine resin and containing styrene maleic anhydride (EF60) all had poor heat resistance (Tg, T288, S/D, PCT). The results of comparative example 2 show that the substrate containing the benzoxazine resin but not containing the maleic anhydride-modified curing agent was inferior in heat resistance (T288, S/D), copper foil tension (P/S), and dielectric constant (Dk). The results of comparative example 3 show that the substrates containing the modified maleic anhydride copolymers of formulae 1 and 2 but no benzoxazine resin had poor heat resistance (Tg, T288, S/D, PCT), poor copper foil tension (P/S), and poor dielectric constant (Dk) and dielectric loss (Df). The results of comparative example 4 show that the substrates with the maleic anhydride modified polyimide resin of formula 3 and the benzoxazine resin are poor in electrical properties, and the bromine-containing compound used in comparative example 4 as the flame retardant component can achieve the flame resistance rating of UL94V-0, but the halogen-free resin composition disclosed by the invention is environmentally friendly because the halogen (bromine) -containing compound is not used. The results of comparative example 5 show that the resin composition disclosed in the present invention uses the substrate of the maleic anhydride modified polyimide resin of formula 3 in combination with benzoxazine resin, but no flame retardant is added, and the flame resistance rating is inferior to UL94V-2 rating, and does not reach the better V-0 rating.
Watch 1
Watch two
| Property testing | Test method | E1 | E2 | E3 | E4 |
| Tg | DSC | 167 | 172 | 158 | 171 |
| T288 | TMA | 19 | >70 | >70 | >70 |
| S/D | dip cycles | 18 | >20 | >20 | >20 |
| PCT | dip 288℃,20s | Qualified | Qualified | Qualified | Qualified |
| P/S | Hoz Cu foil | 6.1 | 6.8 | 6.5 | 7.1 |
| Dk | 1GHz | 3.91 | 4.05 | 3.98 | 3.90 |
| Df | 1GHz | 0.009 | 0.011 | 0.010 | 0.009 |
| Flammability of | UL94 | V-0 | V-0 | V-0 | V-0 |
| Others | Appearance of PP | Jia | Jia | Jia | Jia |
Watch III
Watch four
The halogen-free resin composition of the invention can achieve low dielectric constant, low dielectric loss, high heat resistance and high flame resistance because of containing specific components and proportions; the semi-cured film or the resin film can be manufactured, and the purpose of being applied to a copper foil substrate and a printed circuit board is achieved; in terms of industrial applicability, the products derived from the invention can fully meet the current market demands.
The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (7)
1. A halogen-free resin composition, the composition comprising: (A)100 parts by weight of an epoxy resin; (B)25-50 parts by weight of maleic anhydride modified hardener; (C)20-60 parts by weight of benzoxazine resin; (D)20-65 parts by weight of a flame retardant; and (E)0.5 to 20 parts by weight of a hardening accelerator;
characterized in that the maleic anhydride modified hardener has modified maleic anhydride copolymer of the following formulas 1 and 2:
formula 1
Wherein m and n are positive integers, which may be the same or different numbers,
r is:
wherein x, y and z are 0 or positive integers,
formula 2
Wherein X, Y and n are the same or different positive integers,
r is a cycloolefin copolymer:
wherein R is1、R2、R3Are respectively independent halogen atoms, carbon-containing alkyl or aromatic, m and n are same or different positive integers,
or R is acetic anhydride:
the maleic anhydride modified hardener further comprises at least one of the following groups:
(1) styrene-maleic anhydride copolymer
Wherein m and n are the same or different positive integers,
(2) maleic anhydride-modified polyimide resin having the following formula 3
Formula 3
Wherein X represents a carbon chain group containing more than 10 carbon atoms, a benzene ring group or a structure of a carbon chain containing more than 10 carbon atoms and a benzene ring group, and m, n and l are integers and are more than or equal to 1.
2. The halogen-free resin composition of claim 1, wherein the epoxy resin is selected from at least one of the following group: bisphenol a-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, phenol novolac-type epoxy resin, cresol novolac-type epoxy resin, bisphenol a novolac-type epoxy resin, bisphenol F novolac-type epoxy resin, triazine skeleton-containing epoxy resin, fluorene skeleton-containing epoxy resin, triphenol methane-type epoxy resin, biphenyl aralkyl-type epoxy resin, naphthalene-type epoxy resin, dicyclopentadiene-type epoxy resin, alicyclic epoxy resin, and phosphorus-containing epoxy resin.
3. The halogen-free resin composition of claim 1 wherein the benzoxazine resin is selected from at least one of the following groups: bisphenol A-type benzoxazines, bisphenol F-type benzoxazines, bisphenol S-type benzoxazines, diaminodiphenylmethane-type benzoxazines, diaminodiphenyl ether-type benzoxazines, and polyimidized benzoxazines.
4. The halogen-free resin composition of claim 1 wherein the flame retardant is at least one selected from the group of flame retardants having the following structural formula:
is like
Wherein R is selected from:
one or more of the group consisting of;
formula II
Wherein X is selected from:
one or more of the group consisting of;
y is selected from:
One or more of the group, n is an integer of 0-500;
formula III
Wherein X is selected from:
one or more of the group consisting of;
a is selected from:
one or more of the group consisting of;
when n is 0, Y is:
when n is an integer from 1 to 500, Y is selected from:
one or more of the group consisting of m is more than or equal to 0;
z is selected from:
one or more of the group consisting of n is more than or equal to 0.
5. The halogen-free resin composition of claim 1, further comprising a flame retardant compound selected from at least one of the following groups: resorcinol bisxylyl phosphate, melamine polyphosphate, tris (2-carboxyethyl) phosphine, trimethyl phosphate, tris (isopropyl chloride) phosphate, dimethyl methylphosphonate, bisphenol diphenyl phosphate, ammonium polyphosphate, hydroquinone bis (diphenyl phosphate) and bisphenol a bis (diphenyl phosphate).
6. The halogen-free resin composition of claim 1 wherein the hardening accelerator is selected from at least one of the group consisting of: imidazole, boron trifluoride amine complex, 2-ethyl-4-methylimidazole, 2-phenylimidazole, ethyltriphenylphosphonium chloride, triphenylphosphine and 4-dimethylaminopyridine.
7. The halogen-free resin composition of claim 1 further comprising fused silica or spherical silica.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010030542.9A CN111138809B (en) | 2016-11-28 | 2016-11-28 | Halogen-free resin composition |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010030542.9A CN111138809B (en) | 2016-11-28 | 2016-11-28 | Halogen-free resin composition |
| CN201611064723.3A CN108117718B (en) | 2016-11-28 | 2016-11-28 | Halogen-free resin composition |
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| CN201611064723.3A Division CN108117718B (en) | 2016-11-28 | 2016-11-28 | Halogen-free resin composition |
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| CN111138809A CN111138809A (en) | 2020-05-12 |
| CN111138809B true CN111138809B (en) | 2022-05-06 |
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| CN201611064723.3A Active CN108117718B (en) | 2016-11-28 | 2016-11-28 | Halogen-free resin composition |
| CN202010030542.9A Active CN111138809B (en) | 2016-11-28 | 2016-11-28 | Halogen-free resin composition |
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| CN201911057305.5A Active CN111500015B (en) | 2016-11-28 | 2016-11-28 | Halogen-free resin composition |
| CN201611064723.3A Active CN108117718B (en) | 2016-11-28 | 2016-11-28 | Halogen-free resin composition |
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| CN111205595A (en) * | 2020-02-18 | 2020-05-29 | 联茂(无锡)电子科技有限公司 | Halogen-free low dielectric composition, laminate and printed wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103881299A (en) * | 2012-12-20 | 2014-06-25 | 中山台光电子材料有限公司 | Halogen-free resin composition and applications thereof |
| CN103881302A (en) * | 2012-12-21 | 2014-06-25 | 台光电子材料股份有限公司 | Resin composition, copper foil substrate using same and printed circuit board |
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| US6620512B2 (en) * | 2001-12-21 | 2003-09-16 | Intel Corporation | Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
| CN101942178B (en) * | 2009-07-08 | 2012-08-08 | 台光电子材料股份有限公司 | Composition of thermosetting resin and copper foil laminated plate |
| JP5606752B2 (en) * | 2010-02-25 | 2014-10-15 | 株式会社ダイセル | Resin composition for optical semiconductor sealing and optical semiconductor device using the same |
| US8663803B2 (en) * | 2010-11-29 | 2014-03-04 | Iteq Corporation | Varnish composition, and pre-impregnated manufacture thereof |
| CN102633952B (en) * | 2011-02-10 | 2014-04-16 | 台光电子材料股份有限公司 | Resin composition |
| CN103131131B (en) * | 2011-11-23 | 2015-07-15 | 台光电子材料股份有限公司 | Halogen-free resin composition and copper clad laminate and printed circuit board applying the same |
| CN103421273B (en) * | 2012-05-22 | 2016-02-10 | 中山台光电子材料有限公司 | Halogen-free resin composition |
| CN104694042A (en) * | 2013-12-10 | 2015-06-10 | 上海拓引数码技术有限公司 | Single-component low-temperature instantaneous curing conductive adhesive and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103881299A (en) * | 2012-12-20 | 2014-06-25 | 中山台光电子材料有限公司 | Halogen-free resin composition and applications thereof |
| CN103881302A (en) * | 2012-12-21 | 2014-06-25 | 台光电子材料股份有限公司 | Resin composition, copper foil substrate using same and printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111500015B (en) | 2023-01-17 |
| CN111500015A (en) | 2020-08-07 |
| CN108117718A (en) | 2018-06-05 |
| CN108117718B (en) | 2020-05-15 |
| CN111138809A (en) | 2020-05-12 |
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