SG11201504998SA - Thermally-conductive, electrically-conductive adhesive composition - Google Patents
Thermally-conductive, electrically-conductive adhesive compositionInfo
- Publication number
- SG11201504998SA SG11201504998SA SG11201504998SA SG11201504998SA SG11201504998SA SG 11201504998S A SG11201504998S A SG 11201504998SA SG 11201504998S A SG11201504998S A SG 11201504998SA SG 11201504998S A SG11201504998S A SG 11201504998SA SG 11201504998S A SG11201504998S A SG 11201504998SA
- Authority
- SG
- Singapore
- Prior art keywords
- conductive
- thermally
- electrically
- adhesive composition
- conductive adhesive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Inorganic Chemistry (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012284866A JP5642147B2 (en) | 2012-12-27 | 2012-12-27 | Thermally conductive conductive adhesive composition |
| PCT/JP2013/084552 WO2014104046A1 (en) | 2012-12-27 | 2013-12-25 | Thermally-conductive, electrically-conductive adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201504998SA true SG11201504998SA (en) | 2015-07-30 |
Family
ID=51021126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201504998SA SG11201504998SA (en) | 2012-12-27 | 2013-12-25 | Thermally-conductive, electrically-conductive adhesive composition |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20150344749A1 (en) |
| EP (1) | EP2940093B1 (en) |
| JP (1) | JP5642147B2 (en) |
| KR (1) | KR101775255B1 (en) |
| CN (1) | CN104968746B (en) |
| MX (1) | MX2015008249A (en) |
| MY (1) | MY172479A (en) |
| PH (1) | PH12015501480A1 (en) |
| SG (1) | SG11201504998SA (en) |
| TW (1) | TWI510595B (en) |
| WO (1) | WO2014104046A1 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6062974B2 (en) * | 2014-02-24 | 2017-01-18 | 三ツ星ベルト株式会社 | Conductive composition |
| JP5806760B1 (en) * | 2014-05-29 | 2015-11-10 | 田中貴金属工業株式会社 | Thermally conductive conductive adhesive composition |
| JP6396189B2 (en) * | 2014-11-27 | 2018-09-26 | 日東電工株式会社 | Conductive film adhesive, dicing tape with film adhesive, and method for manufacturing semiconductor device |
| WO2016116959A1 (en) * | 2015-01-19 | 2016-07-28 | 京セラケミカル株式会社 | Conductive resin composition and semiconductor device |
| JP6091019B2 (en) * | 2015-02-02 | 2017-03-08 | 田中貴金属工業株式会社 | Thermally conductive conductive adhesive composition |
| JP6164256B2 (en) * | 2015-07-08 | 2017-07-19 | 住友ベークライト株式会社 | Thermally conductive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heat sink |
| CN109072012A (en) | 2016-05-26 | 2018-12-21 | 株式会社大阪曹達 | conductive adhesive |
| JP6899069B2 (en) * | 2016-06-27 | 2021-07-07 | 株式会社スリーボンド | Thermosetting conductive adhesive |
| CN109641999A (en) * | 2016-09-02 | 2019-04-16 | 三键有限公司 | (methyl) acrylic acid resin composition and the electrically conductive adhesive for using it |
| JP6859799B2 (en) * | 2017-03-29 | 2021-04-14 | 三菱マテリアル株式会社 | Paste-like silver powder composition, method for producing a bonded body, and method for producing a silver film |
| CN110709487B (en) * | 2017-06-07 | 2022-01-14 | 田中贵金属工业株式会社 | Thermally and electrically conductive adhesive composition |
| US20210174984A1 (en) * | 2017-11-13 | 2021-06-10 | Nitto Denko Corporation | Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheet |
| CN109837050A (en) * | 2019-03-15 | 2019-06-04 | 苏州凡络新材料科技有限公司 | A kind of low temperature curing type conductive adhesive and preparation method thereof |
| RU2730319C1 (en) * | 2019-08-26 | 2020-08-21 | Акционерное общество "Государственный космический научно-производственный центр им. М.В. Хруничева" | Adhesive composition based on epoxy resin |
| CN110885655B (en) * | 2019-12-13 | 2021-09-03 | 苏州凡络新材料科技有限公司 | Surface insulation type electromagnetic shielding adhesive and preparation method thereof |
| CN115011294B (en) * | 2022-06-07 | 2023-02-10 | 道尔化成电子材料(上海)有限公司 | Sintered nano silver conductive adhesive for chip packaging and preparation method thereof |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3412043A (en) * | 1966-08-05 | 1968-11-19 | Dexter Corp | Electrically conductive resinous compositions |
| US4557860A (en) * | 1984-07-06 | 1985-12-10 | Stauffer Chemical Company | Solventless, polyimide-modified epoxy composition |
| US4604230A (en) * | 1984-10-15 | 1986-08-05 | Stauffer Chemical Company | Thermally stable adhesive |
| JPH0196278A (en) * | 1987-10-08 | 1989-04-14 | Toray Ind Inc | Adhesive |
| EP0431891A1 (en) * | 1989-12-06 | 1991-06-12 | Teijin Limited | Epoxy compounds, production processes thereof and cured product of the epoxy compound |
| DE4012061A1 (en) * | 1990-04-10 | 1991-10-17 | Mittweida Ing Hochschule | Solvent-free, isotropic adhesive and conductive paste - comprises cycloaliphatic epoxide¨ resin and mixt. of two types of electrically conductive particles differing in size and shape |
| JPH06322350A (en) | 1993-03-17 | 1994-11-22 | Fujitsu Ltd | Conductive adhesive, its production and method for bonding semiconductor chip |
| US5891367A (en) * | 1998-02-23 | 1999-04-06 | General Motors Corporation | Conductive epoxy adhesive |
| JP4355044B2 (en) * | 1999-02-19 | 2009-10-28 | 大日本印刷株式会社 | Curable conductive paste |
| JP3826104B2 (en) * | 2003-03-17 | 2006-09-27 | 株式会社ルネサステクノロジ | Solvent-free liquid silver paste composition and semiconductor device using the same |
| JP2004359830A (en) * | 2003-06-05 | 2004-12-24 | Kyocera Chemical Corp | Electroconductive adhesive composition |
| TWI304835B (en) * | 2003-06-10 | 2009-01-01 | Hitachi Chemical Co Ltd | Film adhesive and manufacturing method thereof,adhesive sheet and semiconductor device |
| JP4790208B2 (en) * | 2003-06-24 | 2011-10-12 | 中国塗料株式会社 | Epoxy resin composition, anticorrosion film formed from the composition, base material with anticorrosion film coated with the anticorrosion film, and anticorrosion method for the base material |
| EP1667501A4 (en) * | 2003-09-10 | 2010-01-06 | Unitika Ltd | Substrate for flexible printed wiring board and method for manufacturing same |
| JP4984385B2 (en) * | 2004-10-18 | 2012-07-25 | Ｄｉｃ株式会社 | Epoxy resin composition and cured product thereof |
| US20070007198A1 (en) * | 2005-07-07 | 2007-01-11 | Loran Balvanz | Method and apparatus for producing dried distiller's grain |
| JP2008186590A (en) | 2007-01-26 | 2008-08-14 | Teijin Ltd | High heat and electric conductivity composition, conductive paste, and conductive adhesive |
| JP5204454B2 (en) | 2007-10-02 | 2013-06-05 | 積水化学工業株式会社 | adhesive |
| WO2009117345A2 (en) * | 2008-03-17 | 2009-09-24 | Henkel Corporation | Adhesive compositions for use in die attach applications |
| JP5770106B2 (en) * | 2009-02-16 | 2015-08-26 | サイテク・テクノロジー・コーポレーシヨン | Co-curing conductive surface film for lightning and electromagnetic interference shielding of thermosetting composites |
| JP5611537B2 (en) * | 2009-04-28 | 2014-10-22 | 日立化成株式会社 | Conductive bonding material, bonding method using the same, and semiconductor device bonded thereby |
| CN101805574A (en) * | 2010-03-11 | 2010-08-18 | 复旦大学 | Sintered type conductive adhesive adopting silver filling with surfaces subjected to activating treatment and preparation method thereof |
| WO2011137108A1 (en) * | 2010-04-29 | 2011-11-03 | Interdigital Patent Holdings, Inc. | Using personal wireless devices for network testing |
| JP5543879B2 (en) * | 2010-09-02 | 2014-07-09 | 旭化成イーマテリアルズ株式会社 | Curing agent composition for epoxy resin and one-part epoxy resin composition |
| WO2012059974A1 (en) * | 2010-11-01 | 2012-05-10 | Ｄｏｗａエレクトロニクス株式会社 | Low-temperature sintering conductive paste, conductive film using same, and method for forming conductive film |
| KR101374365B1 (en) * | 2010-12-27 | 2014-03-17 | 제일모직주식회사 | Adhesive composition for semiconductor, adhesive film comprising the same |
| TW201245364A (en) * | 2011-01-28 | 2012-11-16 | Hitachi Chemical Co Ltd | Adhesive composition and semiconductor device using same |
| JP5652617B2 (en) * | 2011-04-27 | 2015-01-14 | 大日本印刷株式会社 | Thermosetting adhesive composition, adhesive sheet, and method for producing adhesive sheet |
| CN102408856A (en) * | 2011-08-09 | 2012-04-11 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method thereof |
| JP6081231B2 (en) * | 2012-03-05 | 2017-02-15 | ナミックス株式会社 | Thermally conductive paste and use thereof |
| CN102634312A (en) * | 2012-03-27 | 2012-08-15 | 烟台德邦电子材料有限公司 | Silvering powder conductive adhesive for LED packaging and production method thereof |
-
2012
- 2012-12-27 JP JP2012284866A patent/JP5642147B2/en active Active
-
2013
- 2013-12-25 WO PCT/JP2013/084552 patent/WO2014104046A1/en active Application Filing
- 2013-12-25 MY MYPI2015001638A patent/MY172479A/en unknown
- 2013-12-25 US US14/758,050 patent/US20150344749A1/en not_active Abandoned
- 2013-12-25 CN CN201380068512.5A patent/CN104968746B/en active Active
- 2013-12-25 MX MX2015008249A patent/MX2015008249A/en unknown
- 2013-12-25 EP EP13866780.3A patent/EP2940093B1/en active Active
- 2013-12-25 KR KR1020157020220A patent/KR101775255B1/en active IP Right Grant
- 2013-12-25 SG SG11201504998SA patent/SG11201504998SA/en unknown
- 2013-12-26 TW TW102148452A patent/TWI510595B/en active
-
2015
- 2015-06-26 PH PH12015501480A patent/PH12015501480A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP2940093B1 (en) | 2017-11-22 |
| US20150344749A1 (en) | 2015-12-03 |
| WO2014104046A1 (en) | 2014-07-03 |
| EP2940093A1 (en) | 2015-11-04 |
| CN104968746B (en) | 2017-09-19 |
| KR20150108844A (en) | 2015-09-30 |
| EP2940093A4 (en) | 2016-08-03 |
| JP2014125596A (en) | 2014-07-07 |
| PH12015501480B1 (en) | 2015-09-21 |
| TWI510595B (en) | 2015-12-01 |
| TW201435041A (en) | 2014-09-16 |
| CN104968746A (en) | 2015-10-07 |
| MY172479A (en) | 2019-11-26 |
| KR101775255B1 (en) | 2017-09-05 |
| MX2015008249A (en) | 2016-09-19 |
| JP5642147B2 (en) | 2014-12-17 |
| PH12015501480A1 (en) | 2015-09-21 |
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