MY155995A - Prepreg, laminate, printed wiring board, and semiconductor device - Google Patents

Prepreg, laminate, printed wiring board, and semiconductor device

Info

Publication number
MY155995A
MY155995A MYPI2013002669A MYPI2013002669A MY155995A MY 155995 A MY155995 A MY 155995A MY PI2013002669 A MYPI2013002669 A MY PI2013002669A MY PI2013002669 A MYPI2013002669 A MY PI2013002669A MY 155995 A MY155995 A MY 155995A
Authority
MY
Malaysia
Prior art keywords
prepreg
semiconductor device
wiring board
printed wiring
laminate
Prior art date
Application number
MYPI2013002669A
Other languages
English (en)
Inventor
Ohigashi Noriyuki
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY155995A publication Critical patent/MY155995A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
MYPI2013002669A 2011-01-24 2012-01-19 Prepreg, laminate, printed wiring board, and semiconductor device MY155995A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011012166 2011-01-24

Publications (1)

Publication Number Publication Date
MY155995A true MY155995A (en) 2015-12-31

Family

ID=46580569

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013002669A MY155995A (en) 2011-01-24 2012-01-19 Prepreg, laminate, printed wiring board, and semiconductor device

Country Status (6)

Country Link
JP (1) JP5234195B2 (enrdf_load_stackoverflow)
KR (1) KR101355777B1 (enrdf_load_stackoverflow)
CN (1) CN103347938B (enrdf_load_stackoverflow)
MY (1) MY155995A (enrdf_load_stackoverflow)
TW (1) TWI539869B (enrdf_load_stackoverflow)
WO (1) WO2012101991A1 (enrdf_load_stackoverflow)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6008104B2 (ja) * 2012-09-04 2016-10-19 住友ベークライト株式会社 プリプレグおよび金属張積層板
JP6217069B2 (ja) * 2012-10-26 2017-10-25 住友ベークライト株式会社 樹脂基板、金属張積層板、プリント配線基板、および半導体装置
JP6226232B2 (ja) * 2012-11-12 2017-11-08 パナソニックＩｐマネジメント株式会社 金属張積層板、金属張積層板の製造方法、プリント配線板、多層プリント配線板
JP2014111719A (ja) * 2012-11-12 2014-06-19 Panasonic Corp 積層板、金属張積層板、プリント配線板、多層プリント配線板
DE102012025409A1 (de) * 2012-12-20 2014-06-26 Thomas Hofmann Leiterplatte mit echtholzlagenverbundwerkstoff
JP6327429B2 (ja) * 2013-08-01 2018-05-23 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
JP6221620B2 (ja) * 2013-10-22 2017-11-01 住友ベークライト株式会社 金属張積層板、プリント配線基板、および半導体装置
KR101641544B1 (ko) * 2013-11-29 2016-07-21 니토 보세키 가부시기가이샤 유리 섬유 직물-수지 조성물 적층체
CN103796435B (zh) * 2014-01-16 2017-08-11 广州兴森快捷电路科技有限公司 测量线路板层压偏位的方法
JP2016069401A (ja) * 2014-09-26 2016-05-09 住友ベークライト株式会社 プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
JP6435947B2 (ja) * 2015-03-24 2018-12-12 住友ベークライト株式会社 フィラーの含浸率の評価方法、フィラーの含浸率の評価装置、およびコンピュータプログラム
JP6497652B2 (ja) * 2015-04-15 2019-04-10 京セラ株式会社 封止用エポキシ樹脂成形材料及び電子部品
KR20220084442A (ko) * 2016-05-25 2022-06-21 쇼와덴코머티리얼즈가부시끼가이샤 금속장 적층판, 프린트 배선판 및 반도체 패키지
JP6972522B2 (ja) * 2016-09-01 2021-11-24 住友ベークライト株式会社 プリプレグ、金属張積層板、プリント配線基板および半導体パッケージ
EP3541152B1 (en) * 2016-11-09 2022-01-05 Showa Denko Materials Co., Ltd. Printed wiring board and semiconductor package
JP7465093B2 (ja) * 2017-10-10 2024-04-10 味の素株式会社 硬化体及びその製造方法、樹脂シート及び樹脂組成物
JPWO2019111416A1 (ja) * 2017-12-08 2020-12-10 昭和電工マテリアルズ株式会社 プリプレグ、積層板、及びそれらの製造方法、並びにプリント配線板及び半導体パッケージ
JP7123744B2 (ja) * 2018-10-26 2022-08-23 旭化成株式会社 ロール状長尺ガラスクロス、プリプレグ、及びプリント配線板
CN112423463A (zh) * 2019-08-23 2021-02-26 鹏鼎控股(深圳)股份有限公司 多层电路板及其制作方法
WO2021039582A1 (ja) * 2019-08-27 2021-03-04 日東紡績株式会社 ガラスクロス、プリプレグ、及び、ガラス繊維強化樹脂成形品
CN113529237B (zh) * 2020-03-30 2023-04-07 旭化成株式会社 卷状长条玻璃布、预浸料、及印刷线路板
US20230226630A1 (en) * 2020-06-26 2023-07-20 Ngk Spark Plug Co., Ltd. Joined body and electrostatic chuck
CN112566356B (zh) * 2020-11-20 2022-03-18 深圳市金晟达电子技术有限公司 一种毫米波雷达印制电路板
DE102021117278B4 (de) * 2021-07-05 2023-05-04 Lisa Dräxlmaier GmbH Leiterplatte für ein steuergerät eines fahrzeugs und verfahren zum herstellen einer solchen leiterplatte
JPWO2024122587A1 (enrdf_load_stackoverflow) * 2022-12-07 2024-06-13
JP2024155375A (ja) * 2023-04-21 2024-10-31 味の素株式会社 熱硬化性樹脂組成物

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JP3166324B2 (ja) * 1992-06-17 2001-05-14 信越化学工業株式会社 シリカ微粉末、その製造方法及び該シリカ微粉末を含有する樹脂組成物
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US8852734B2 (en) * 2009-10-14 2014-10-07 Sumitomo Bakelite Company, Ltd. Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device

Also Published As

Publication number Publication date
CN103347938B (zh) 2014-07-30
KR20130102654A (ko) 2013-09-17
TW201251534A (en) 2012-12-16
JP2012167256A (ja) 2012-09-06
TWI539869B (zh) 2016-06-21
JP5234195B2 (ja) 2013-07-10
WO2012101991A1 (ja) 2012-08-02
CN103347938A (zh) 2013-10-09
KR101355777B1 (ko) 2014-02-04

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