MY150671A - Method for manufacturing mask blank and coating apparatus - Google Patents
Method for manufacturing mask blank and coating apparatusInfo
- Publication number
- MY150671A MY150671A MYPI20082358A MY150671A MY 150671 A MY150671 A MY 150671A MY PI20082358 A MYPI20082358 A MY PI20082358A MY 150671 A MY150671 A MY 150671A
- Authority
- MY
- Malaysia
- Prior art keywords
- mask blank
- resist
- resist agent
- liquid
- nozzle
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007171568A JP5086708B2 (ja) | 2007-06-29 | 2007-06-29 | マスクブランクの製造方法及び塗布装置 |
JP2007171569A JP2009010247A (ja) | 2007-06-29 | 2007-06-29 | マスクブランクの製造方法及び塗布装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY150671A true MY150671A (en) | 2014-02-28 |
Family
ID=40486900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20082358 MY150671A (en) | 2007-06-29 | 2008-06-27 | Method for manufacturing mask blank and coating apparatus |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101523093B1 (zh) |
MY (1) | MY150671A (zh) |
TW (1) | TWI471682B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6272138B2 (ja) * | 2014-05-22 | 2018-01-31 | 東京エレクトロン株式会社 | 塗布処理装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4445985A1 (de) * | 1994-12-22 | 1996-06-27 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur Belackung oder Beschichtung eines Substrats |
JP3252325B2 (ja) * | 1999-10-29 | 2002-02-04 | 株式会社ヒラノテクシード | 塗工方法及び塗工装置 |
JP4927274B2 (ja) * | 2001-09-17 | 2012-05-09 | 株式会社ヒラノテクシード | 塗工装置及び塗工方法 |
JP4017372B2 (ja) * | 2001-10-15 | 2007-12-05 | 住友化学株式会社 | 薄膜形成方法 |
JP2003164795A (ja) * | 2001-11-29 | 2003-06-10 | Nitto Denko Corp | 高屈折率フィラーを含有する塗工液の塗工方法 |
JP3871328B2 (ja) * | 2002-03-29 | 2007-01-24 | Hoya株式会社 | 塗布装置、その液面レベル管理方法及び管理装置、レジスト膜付基板の製造方法及びパターン形成方法、並びにフォトマスクの製造方法 |
JP2003340355A (ja) * | 2002-05-30 | 2003-12-02 | Nitto Denko Corp | 塗工液の塗工方法及び光学フィルムの製造方法 |
JP4313026B2 (ja) * | 2002-11-08 | 2009-08-12 | 株式会社ヒラノテクシード | 毛管現象による塗工ノズルを用いた有機elパネルの製造装置及び製造方法 |
JP2004311884A (ja) * | 2003-04-10 | 2004-11-04 | Hoya Corp | レジスト膜の形成方法及びフォトマスクの製造方法 |
JP2007054719A (ja) * | 2005-08-23 | 2007-03-08 | Hirano Tecseed Co Ltd | 薄膜形成方法 |
-
2008
- 2008-06-27 KR KR1020080061683A patent/KR101523093B1/ko active IP Right Grant
- 2008-06-27 TW TW97124016A patent/TWI471682B/zh active
- 2008-06-27 MY MYPI20082358 patent/MY150671A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20090004588A (ko) | 2009-01-12 |
TWI471682B (zh) | 2015-02-01 |
KR101523093B1 (ko) | 2015-05-26 |
TW200931169A (en) | 2009-07-16 |
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