MY148789A - Layered heat spreader and method of making the same - Google Patents

Layered heat spreader and method of making the same

Info

Publication number
MY148789A
MY148789A MYPI20083462A MYPI20083462A MY148789A MY 148789 A MY148789 A MY 148789A MY PI20083462 A MYPI20083462 A MY PI20083462A MY PI20083462 A MYPI20083462 A MY PI20083462A MY 148789 A MY148789 A MY 148789A
Authority
MY
Malaysia
Prior art keywords
strips
layer
oriented
heat spreader
strip
Prior art date
Application number
MYPI20083462A
Other languages
English (en)
Inventor
Richard James Lemak
V N P Rao
Original Assignee
Specialty Minerals Michigan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Specialty Minerals Michigan filed Critical Specialty Minerals Michigan
Publication of MY148789A publication Critical patent/MY148789A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H10W40/25—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)
MYPI20083462A 2007-09-07 2008-09-08 Layered heat spreader and method of making the same MY148789A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US96790507P 2007-09-07 2007-09-07

Publications (1)

Publication Number Publication Date
MY148789A true MY148789A (en) 2013-05-31

Family

ID=40429224

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20083462A MY148789A (en) 2007-09-07 2008-09-08 Layered heat spreader and method of making the same

Country Status (8)

Country Link
US (1) US8059408B2 (enExample)
EP (1) EP2196075B1 (enExample)
JP (1) JP5612471B2 (enExample)
KR (1) KR101465834B1 (enExample)
CN (1) CN101822134B (enExample)
MY (1) MY148789A (enExample)
TW (1) TW200933117A (enExample)
WO (1) WO2009032310A1 (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7808787B2 (en) 2007-09-07 2010-10-05 Specialty Minerals (Michigan) Inc. Heat spreader and method of making the same
US10012375B1 (en) 2008-05-20 2018-07-03 Nader Salessi Modular LED lamp
US8230690B1 (en) 2008-05-20 2012-07-31 Nader Salessi Modular LED lamp
US8085531B2 (en) * 2009-07-14 2011-12-27 Specialty Minerals (Michigan) Inc. Anisotropic thermal conduction element and manufacturing method
JP2011124194A (ja) * 2009-12-14 2011-06-23 Canon Inc 表示パネルおよび画像表示装置
JP2011258755A (ja) * 2010-06-09 2011-12-22 Denso Corp 熱拡散体および発熱体の冷却装置
JP5316602B2 (ja) 2010-12-16 2013-10-16 株式会社日本自動車部品総合研究所 熱拡散部材の接合構造、発熱体の冷却構造、及び熱拡散部材の接合方法
JP5621698B2 (ja) * 2011-04-08 2014-11-12 株式会社日本自動車部品総合研究所 発熱体モジュール及びその製造方法
CN103766009B (zh) * 2011-08-29 2017-08-11 飞利浦照明控股有限公司 柔性照明组件、灯具和制造柔性层的方法
DE112013006640B4 (de) * 2013-02-20 2018-05-03 Mitsubishi Electric Corporation Kühlvorrichtung und mit Kühlvorrichtung ausgestattetes Leistungsmodul
CA2925816A1 (en) * 2013-09-30 2015-04-02 Specialty Minerals (Michigan) Inc. Performance enhanced heat spreader
US9521738B1 (en) * 2013-12-23 2016-12-13 Flextronics Ap, Llc Graphite sheet to protect SMT components from thermal exposure
US9789572B1 (en) 2014-01-09 2017-10-17 Flextronics Ap, Llc Universal automation line
DE102014000510B4 (de) * 2014-01-20 2018-10-25 Jenoptik Laser Gmbh Halbleiterlaser mit anisotroper Wärmeableitung
US11411370B2 (en) 2015-03-24 2022-08-09 Lawrence Livermore National Security, Llc Si-based CTE-matched substrate for laser diode packaging
JP6544983B2 (ja) * 2015-04-21 2019-07-17 昭和電工株式会社 冷却基板
JP2018518020A (ja) 2015-05-15 2018-07-05 モーメンティブ・パフォーマンス・マテリアルズ・インク 熱管理のための熱分解グラファイトを用いた発光ダイオードアセンブリ
US10090173B2 (en) 2015-06-05 2018-10-02 International Business Machines Corporation Method of fabricating a chip module with stiffening frame and directional heat spreader
US10299407B2 (en) * 2015-06-29 2019-05-21 Microsoft Technology Licensing, Llc Differently oriented layered thermal conduit
US9583408B1 (en) 2015-08-21 2017-02-28 International Business Machines Corporation Reducing directional stress in an orthotropic encapsulation member of an electronic package
JP6617265B2 (ja) * 2015-12-18 2019-12-11 株式会社サーモグラフィティクス 熱伝導構造体、熱伝導構造体の製造方法、冷却装置、及び半導体モジュール
US11367669B2 (en) 2016-11-21 2022-06-21 Rohm Co., Ltd. Power module and fabrication method of the same, graphite plate, and power supply equipment
WO2018117232A1 (ja) * 2016-12-22 2018-06-28 京セラ株式会社 電子素子搭載用基板、電子装置および電子モジュール
WO2020004567A1 (ja) * 2018-06-27 2020-01-02 京セラ株式会社 電子素子搭載用基板、電子装置および電子モジュール
JP7182403B2 (ja) * 2018-09-03 2022-12-02 昭和電工株式会社 冷却装置
JP7631792B2 (ja) * 2020-12-24 2025-02-19 セイコーエプソン株式会社 積層構造体、熱伝導構造体、及び熱伝導構造体の製造方法
JP2023006510A (ja) 2021-06-30 2023-01-18 日亜化学工業株式会社 発光モジュール、車両用灯具、及び、放熱部材
US12496648B2 (en) 2022-11-22 2025-12-16 Raytheon Company Furnace braze cycle enhancement

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
US5155652A (en) * 1991-05-02 1992-10-13 International Business Machines Corporation Temperature cycling ceramic electrostatic chuck
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
JP3345986B2 (ja) * 1993-10-15 2002-11-18 松下電器産業株式会社 グラファイト熱伝導体およびそれを用いたコールドプレート
US5494753A (en) * 1994-06-20 1996-02-27 General Electric Company Articles having thermal conductors of graphite
JP2001024117A (ja) * 1999-07-08 2001-01-26 Yamaha Corp 放熱用シート及びその製造方法
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
US6771502B2 (en) * 2002-06-28 2004-08-03 Advanced Energy Technology Inc. Heat sink made from longer and shorter graphite sheets
WO2005019132A1 (ja) * 2003-08-26 2005-03-03 Matsushita Electric Industrial Co., Ltd. 高熱伝導性部材及びその製造方法ならびにそれを用いた放熱システム
JP2005116839A (ja) * 2003-10-08 2005-04-28 Sony Corp 熱伝導体、冷却装置、電子機器及び熱伝導体の製造方法
JP2005347616A (ja) * 2004-06-04 2005-12-15 Fujitsu Ltd ヒートスプレッダ、電子装置、およびヒートスプレッダ製造方法
US7351360B2 (en) 2004-11-12 2008-04-01 International Business Machines Corporation Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
JP2006294749A (ja) * 2005-04-07 2006-10-26 Mitsubishi Electric Corp 高放熱回路基板およびその製造方法
JP2006303240A (ja) * 2005-04-21 2006-11-02 Fujikura Ltd 放熱シート、放熱体、放熱シート製造方法及び伝熱方法
JP2007059875A (ja) * 2005-07-26 2007-03-08 Kyocera Corp 放熱部材およびこれを用いた電子部品収納用パッケージおよび電子装置
US7297399B2 (en) * 2005-10-11 2007-11-20 General Electric Company Thermal transport structure and associated method
JP4899460B2 (ja) * 2005-12-15 2012-03-21 パナソニック株式会社 熱伝達体とそれを用いた電子機器
US20080085403A1 (en) * 2006-10-08 2008-04-10 General Electric Company Heat transfer composite, associated device and method

Also Published As

Publication number Publication date
KR20100081298A (ko) 2010-07-14
JP5612471B2 (ja) 2014-10-22
US20090095461A1 (en) 2009-04-16
WO2009032310A1 (en) 2009-03-12
EP2196075A1 (en) 2010-06-16
KR101465834B1 (ko) 2014-11-27
EP2196075B1 (en) 2021-06-23
JP2010538493A (ja) 2010-12-09
CN101822134B (zh) 2013-05-01
EP2196075A4 (en) 2014-10-08
CN101822134A (zh) 2010-09-01
TW200933117A (en) 2009-08-01
US8059408B2 (en) 2011-11-15

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