CN101822134B - 分层的散热器及制造分层的散热器的方法 - Google Patents

分层的散热器及制造分层的散热器的方法 Download PDF

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Publication number
CN101822134B
CN101822134B CN2008801114731A CN200880111473A CN101822134B CN 101822134 B CN101822134 B CN 101822134B CN 2008801114731 A CN2008801114731 A CN 2008801114731A CN 200880111473 A CN200880111473 A CN 200880111473A CN 101822134 B CN101822134 B CN 101822134B
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China
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plane component
plane
along
thermal conductivity
component
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Expired - Fee Related
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CN2008801114731A
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English (en)
Chinese (zh)
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CN101822134A (zh
Inventor
R·J·勒马克
V·N·P·拉奥
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Specialty Minerals Michigan Inc
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Specialty Minerals Michigan Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)
CN2008801114731A 2007-09-07 2008-09-05 分层的散热器及制造分层的散热器的方法 Expired - Fee Related CN101822134B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US96790507P 2007-09-07 2007-09-07
US60/967,905 2007-09-07
PCT/US2008/010428 WO2009032310A1 (en) 2007-09-07 2008-09-05 Layered heat spreader and method of making the same

Publications (2)

Publication Number Publication Date
CN101822134A CN101822134A (zh) 2010-09-01
CN101822134B true CN101822134B (zh) 2013-05-01

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CN2008801114731A Expired - Fee Related CN101822134B (zh) 2007-09-07 2008-09-05 分层的散热器及制造分层的散热器的方法

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Country Link
US (1) US8059408B2 (enExample)
EP (1) EP2196075B1 (enExample)
JP (1) JP5612471B2 (enExample)
KR (1) KR101465834B1 (enExample)
CN (1) CN101822134B (enExample)
MY (1) MY148789A (enExample)
TW (1) TW200933117A (enExample)
WO (1) WO2009032310A1 (enExample)

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US8230690B1 (en) 2008-05-20 2012-07-31 Nader Salessi Modular LED lamp
US10012375B1 (en) 2008-05-20 2018-07-03 Nader Salessi Modular LED lamp
US8085531B2 (en) * 2009-07-14 2011-12-27 Specialty Minerals (Michigan) Inc. Anisotropic thermal conduction element and manufacturing method
JP2011124194A (ja) * 2009-12-14 2011-06-23 Canon Inc 表示パネルおよび画像表示装置
JP2011258755A (ja) * 2010-06-09 2011-12-22 Denso Corp 熱拡散体および発熱体の冷却装置
JP5316602B2 (ja) 2010-12-16 2013-10-16 株式会社日本自動車部品総合研究所 熱拡散部材の接合構造、発熱体の冷却構造、及び熱拡散部材の接合方法
JP5621698B2 (ja) * 2011-04-08 2014-11-12 株式会社日本自動車部品総合研究所 発熱体モジュール及びその製造方法
EP2752101A1 (en) * 2011-08-29 2014-07-09 Koninklijke Philips N.V. A flexible lighting assembly, a luminaire, and a method of manufacturing a flexible layer
DE112013006640B4 (de) * 2013-02-20 2018-05-03 Mitsubishi Electric Corporation Kühlvorrichtung und mit Kühlvorrichtung ausgestattetes Leistungsmodul
KR20160065141A (ko) * 2013-09-30 2016-06-08 스페셜티 미네랄스 (미시간) 인코포레이티드 성능이 증강된 열 확산기
US9521738B1 (en) * 2013-12-23 2016-12-13 Flextronics Ap, Llc Graphite sheet to protect SMT components from thermal exposure
US9789572B1 (en) 2014-01-09 2017-10-17 Flextronics Ap, Llc Universal automation line
DE102014000510B4 (de) * 2014-01-20 2018-10-25 Jenoptik Laser Gmbh Halbleiterlaser mit anisotroper Wärmeableitung
US9768584B2 (en) 2015-03-24 2017-09-19 Lawrence Livermore National Security, Llc High flux diode packaging using passive microscale liquid-vapor phase change
JP6544983B2 (ja) * 2015-04-21 2019-07-17 昭和電工株式会社 冷却基板
EP3295081B1 (en) * 2015-05-15 2020-07-08 Momentive Performance Materials Inc. Light emitting diode assembly using thermal pyrolytic graphite for thermal management
US10090173B2 (en) 2015-06-05 2018-10-02 International Business Machines Corporation Method of fabricating a chip module with stiffening frame and directional heat spreader
US10299407B2 (en) 2015-06-29 2019-05-21 Microsoft Technology Licensing, Llc Differently oriented layered thermal conduit
US9583408B1 (en) 2015-08-21 2017-02-28 International Business Machines Corporation Reducing directional stress in an orthotropic encapsulation member of an electronic package
JP6617265B2 (ja) * 2015-12-18 2019-12-11 株式会社サーモグラフィティクス 熱伝導構造体、熱伝導構造体の製造方法、冷却装置、及び半導体モジュール
US11367669B2 (en) * 2016-11-21 2022-06-21 Rohm Co., Ltd. Power module and fabrication method of the same, graphite plate, and power supply equipment
WO2018117232A1 (ja) * 2016-12-22 2018-06-28 京セラ株式会社 電子素子搭載用基板、電子装置および電子モジュール
WO2020004567A1 (ja) * 2018-06-27 2020-01-02 京セラ株式会社 電子素子搭載用基板、電子装置および電子モジュール
JP7182403B2 (ja) * 2018-09-03 2022-12-02 昭和電工株式会社 冷却装置
JP7631792B2 (ja) * 2020-12-24 2025-02-19 セイコーエプソン株式会社 積層構造体、熱伝導構造体、及び熱伝導構造体の製造方法
JP2023006510A (ja) 2021-06-30 2023-01-18 日亜化学工業株式会社 発光モジュール、車両用灯具、及び、放熱部材

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US5155652A (en) * 1991-05-02 1992-10-13 International Business Machines Corporation Temperature cycling ceramic electrostatic chuck
CN1679383A (zh) * 2002-06-28 2005-10-05 先进能源科技公司 由较长和较短的石墨片制成的散热器
CN1772834A (zh) * 2004-11-12 2006-05-17 国际商业机器公司 具有各向异性热传导特征的浆状组合物及其形成方法

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US5155652A (en) * 1991-05-02 1992-10-13 International Business Machines Corporation Temperature cycling ceramic electrostatic chuck
CN1679383A (zh) * 2002-06-28 2005-10-05 先进能源科技公司 由较长和较短的石墨片制成的散热器
CN1772834A (zh) * 2004-11-12 2006-05-17 国际商业机器公司 具有各向异性热传导特征的浆状组合物及其形成方法

Also Published As

Publication number Publication date
EP2196075A4 (en) 2014-10-08
JP2010538493A (ja) 2010-12-09
MY148789A (en) 2013-05-31
US20090095461A1 (en) 2009-04-16
US8059408B2 (en) 2011-11-15
TW200933117A (en) 2009-08-01
CN101822134A (zh) 2010-09-01
WO2009032310A1 (en) 2009-03-12
EP2196075A1 (en) 2010-06-16
KR101465834B1 (ko) 2014-11-27
KR20100081298A (ko) 2010-07-14
JP5612471B2 (ja) 2014-10-22
EP2196075B1 (en) 2021-06-23

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