MY143539A - Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method - Google Patents

Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method

Info

Publication number
MY143539A
MY143539A MYPI20054083A MY143539A MY 143539 A MY143539 A MY 143539A MY PI20054083 A MYPI20054083 A MY PI20054083A MY 143539 A MY143539 A MY 143539A
Authority
MY
Malaysia
Prior art keywords
medium
substrate
recording medium
flow processing
grain flow
Prior art date
Application number
Other languages
English (en)
Inventor
Kazuyuki Haneda
Yoshio Kawakami
Original Assignee
Showa Denko Kk
Kohken Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk, Kohken Kogyo Co Ltd filed Critical Showa Denko Kk
Publication of MY143539A publication Critical patent/MY143539A/en

Links

Landscapes

  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
MYPI20054083 2004-08-31 2005-08-30 Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method MY143539A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004252650A JP2006068835A (ja) 2004-08-31 2004-08-31 砥粒流動加工法による記録媒体用基板の端面研磨方法

Publications (1)

Publication Number Publication Date
MY143539A true MY143539A (en) 2011-05-31

Family

ID=36149969

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20054083 MY143539A (en) 2004-08-31 2005-08-30 Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method

Country Status (3)

Country Link
JP (1) JP2006068835A (zh)
CN (1) CN100584530C (zh)
MY (1) MY143539A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009099250A (ja) * 2007-09-28 2009-05-07 Hoya Corp 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法
JP5227132B2 (ja) * 2008-10-01 2013-07-03 Ｈｏｙａ株式会社 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法
JP5589209B2 (ja) * 2010-03-02 2014-09-17 国立大学法人 宮崎大学 歯車の歯面研磨剤及びこれを用いた研磨方法
WO2019003397A1 (ja) 2017-06-28 2019-01-03 三菱製鋼株式会社 中空スタビライザーの製造方法
JP6569152B2 (ja) * 2017-07-05 2019-09-04 日本製鉄株式会社 棒状試験片の表面研磨方法
JP6569153B2 (ja) * 2017-09-11 2019-09-04 日本製鉄株式会社 棒状試験片の表面研磨装置および表面研磨方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07266216A (ja) * 1994-03-31 1995-10-17 Hitachi Ltd 砥粒流動加工装置
JP2001162510A (ja) * 1999-09-30 2001-06-19 Hoya Corp 研磨方法並びに磁気記録媒体用ガラス基板の製造方法及び磁気記録媒体の製造方法
JP3119358B1 (ja) * 1999-10-18 2000-12-18 株式会社石井表記 半導体ウエハーのエッジ研磨装置
JP2003260653A (ja) * 2002-03-05 2003-09-16 Ogawa Seiki Kk バリ取り装置
JP2003260654A (ja) * 2002-03-06 2003-09-16 Hitachi Cable Ltd 砥粒流動加工装置

Also Published As

Publication number Publication date
CN100584530C (zh) 2010-01-27
CN101010167A (zh) 2007-08-01
JP2006068835A (ja) 2006-03-16

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