MY143539A - Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method - Google Patents

Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method

Info

Publication number
MY143539A
MY143539A MYPI20054083A MY143539A MY 143539 A MY143539 A MY 143539A MY PI20054083 A MYPI20054083 A MY PI20054083A MY 143539 A MY143539 A MY 143539A
Authority
MY
Malaysia
Prior art keywords
medium
substrate
recording medium
flow processing
grain flow
Prior art date
Application number
Inventor
Kazuyuki Haneda
Yoshio Kawakami
Original Assignee
Showa Denko Kk
Kohken Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk, Kohken Kogyo Co Ltd filed Critical Showa Denko Kk
Publication of MY143539A publication Critical patent/MY143539A/en

Links

Landscapes

  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Magnetic Record Carriers (AREA)

Abstract

12 METHOD OF POLISHING END SURFACES OF A SUBSTRATE FOR A RECORDING MEDIUM BY A GRAIN FLOW PROCESSING METHOD ABSTRACT TH* OBJECT OF THE IS TO I:)ROVIDE A METHOD @,F PCLI@3HINCJ THE END 21L]RF_@._ES OF A @,))DSLRATP A INE.-JIULN, IS C'APABL@ OF EFFICIEL-ITI'Y P.-LISHING THE INNER PERIPHERAL END 5URFAC@_ AND/,JR THE OLUTER PEI:.LPH@ERAL END SURF3CE OF THE SUOSTRATE PUEVENTINGL THE REIIABIL@TV OF PERFORMANCE OF THE RECORCLINQ MEDIUM 10 FROM B@__NCJ II,LLPAIRED BV THE ADHESIE@N OF THE VESIRLUAL POIISHII@CJ LRAT@_RIAI. A.-CORDIF,@J T@-' 11HE THEI:@ IS PR-VICLECL A RILETHOD OF POLISHINCL END SURTAC@_S OF A SUBSTRA@.E FOR A R-ECORDINQ MEDIUM WHEREIN AN INNER PERIPHERAL END SURFACE CIR AN CALLEL: PERIPHERAL END SURFACE -1 --,F A SUBSTRA TE FOR A DISK-LI@:E CT=CR-RDING LILEDIUM HAVING A CIRCULAR HOLE AT THE CENTRAL THERE-F IS B.'--OUGHL: INTO CONTACT WL-TH A POLISHINQ MEDIUM OL-LAINED 1-,' DI.SP'@-RSINRL P-,DISHING (:;I:AIRL5 IN EL VI_@C.DELASTIC RESIN CACFLER AND THE P'DLISHILLQ 1':@EDILLVL FL-OWS, THEREBY LO POLISH 20 THE NEI:IUHERAL END SIL OR THE :,LITER PECIPHERAL END SUL 40 K2 3 O /O /J 6Q)S
MYPI20054083 2004-08-31 2005-08-30 Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method MY143539A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004252650A JP2006068835A (en) 2004-08-31 2004-08-31 End face polishing method for substrate for record medium using abrasive grain fluidized processing

Publications (1)

Publication Number Publication Date
MY143539A true MY143539A (en) 2011-05-31

Family

ID=36149969

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20054083 MY143539A (en) 2004-08-31 2005-08-30 Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method

Country Status (3)

Country Link
JP (1) JP2006068835A (en)
CN (1) CN100584530C (en)
MY (1) MY143539A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009099250A (en) * 2007-09-28 2009-05-07 Hoya Corp Method of manufacturing glass substrate for magnetic disk and method of manufacturing magnetic disk
JP5227132B2 (en) * 2008-10-01 2013-07-03 Ｈｏｙａ株式会社 Manufacturing method of glass substrate for magnetic disk and manufacturing method of magnetic disk
JP5589209B2 (en) * 2010-03-02 2014-09-17 国立大学法人 宮崎大学 Gear tooth surface polishing agent and polishing method using the same
WO2019003397A1 (en) 2017-06-28 2019-01-03 三菱製鋼株式会社 Method for manufacturing hollow stabilizer
JP6569152B2 (en) * 2017-07-05 2019-09-04 日本製鉄株式会社 Surface polishing method for rod-shaped specimens
JP6569153B2 (en) * 2017-09-11 2019-09-04 日本製鉄株式会社 Surface polishing apparatus and surface polishing method for rod-shaped test piece

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07266216A (en) * 1994-03-31 1995-10-17 Hitachi Ltd Abrasive grain flow type working device
JP2001162510A (en) * 1999-09-30 2001-06-19 Hoya Corp Method of polishing, method of manufacturing glass substrate for magnetic recording medium, and method of manufacturing magnetic recording medium
JP3119358B1 (en) * 1999-10-18 2000-12-18 株式会社石井表記 Edge polishing equipment for semiconductor wafers
JP2003260653A (en) * 2002-03-05 2003-09-16 Ogawa Seiki Kk Deburring device
JP2003260654A (en) * 2002-03-06 2003-09-16 Hitachi Cable Ltd Abrasive grain fluidizing type working device

Also Published As

Publication number Publication date
CN101010167A (en) 2007-08-01
CN100584530C (en) 2010-01-27
JP2006068835A (en) 2006-03-16

Similar Documents

Publication Publication Date Title
MY143539A (en) Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method
MY149975A (en) Polishing composition and method utilizing abrasive particles treated with an aminosilane
CN204700767U (en) A kind of sponge sand lump
TW200722931A (en) Coating compositions for use with an overcoated photoresist
WO2007076396A3 (en) Cleaning and/or polishing compositions and methods for use thereof
MY147729A (en) Polishing composition and method utilizing abrasive particles treated with an aminosilane
TW200602154A (en) Chemical mechanical polishing pad and chemical mechanical polishing method
WO2007041394A3 (en) Reactive surfaces, substrates and methods for producing and using same
AR016922A1 (en) PROCESS FOR THE PRODUCTION OF A STRUCTURED COATED STRUCTURED AND STRUCTURED COATED ABRASIVE OBTAINED
UA100413C2 (en) Hydrophilic and hydrophobic silane surface modification of abrasive grains
TW200642797A (en) Radial-biased polishing pad
TW200631999A (en) Polishing pad
WO2008088323A3 (en) Method of applying a composition
TW200621967A (en) Polishing composition
TW200613090A (en) Chemical mechanical polishing pad
JP2010155338A5 (en)
WO2009030802A3 (en) Substrates containing a polymer layer and preparation methods therefor
KR101944695B1 (en) Abrasive material and production method of abrasive material
TW200724247A (en) Substrate processing apparatus and substrate processing method
MY201888A (en) Hard disk substrate and hard disk device including the hard disk substrate
TW200609336A (en) Polishing composition and substrate polishing method
EP2367682A4 (en) Coating compositions and coated substrates for articles of manufacture used in contact with human body surfaces
HK1084190A1 (en) Nozzle assembly for applying a liquid to a substrate
TW200640608A (en) Polishing device
CN204976386U (en) Flocking abrasive paper