CN101010167A - Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method - Google Patents

Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method Download PDF

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Publication number
CN101010167A
CN101010167A CN 200580029265 CN200580029265A CN101010167A CN 101010167 A CN101010167 A CN 101010167A CN 200580029265 CN200580029265 CN 200580029265 CN 200580029265 A CN200580029265 A CN 200580029265A CN 101010167 A CN101010167 A CN 101010167A
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China
Prior art keywords
substrate
polishing
recording medium
end surfaces
medium
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CN 200580029265
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Chinese (zh)
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CN100584530C (en
Inventor
羽根田和幸
川上义男
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Resonac Holdings Corp
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Showa Denko KK
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  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Magnetic Record Carriers (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

The object of the invention is to provide a method of polishing the end surfaces of a substrate for a recording medium, which is capable of efficiently polishing the inner peripheral end surface and/or the outer peripheral end surface of the substrate preventing the reliability of performance of the recording medium from being impaired by the adhesion of the residual polishing material. According to the invention, there is provided a method of polishing end surfaces of a substrate for a recording medium wherein an inner peripheral end surface or an outer peripheral end surface of a substrate for a disk-like recording medium having a circular hole at the central portion thereof is brought into contact with a polishing medium obtained by dispersing polishing grains in a viscoelastic resin carrier and the polishing medium flows, thereby to polish the inner peripheral end surface or the outer peripheral end surface.

Description

Polish the method for the end surfaces of the substrate that is used for recording medium by grain flow processing method
The cross reference of related application
The application submits to according to 35 U.S.C § 111 (a), and requires the priority of on September 9th, 2004 according to the provisional application 60/608103 of 35 U.S.C § 111 (b) submission according to 35 U.S.C § 119 (e).
Technical field
The present invention relates to a kind of method of the end surfaces of the substrate that is used for recording medium being polished by grain flow processing method and a kind of by utilizing said method manufacturing to be used for the method for the substrate of recording medium.
Background technology
Aluminium substrate is widely used as for example substrate of the magnetic recording media of disk.Because the more and more littler thickness of size of disk is more and more thinner, but the density of record data is more and more higher simultaneously, so aluminium substrate substituted by substrate of glass gradually, and substrate of glass has superior surface smoothness and substrate intensity.As the substrate of glass that is used for magnetic recording media, use chemical enhanced type substrate of glass, so that strengthen substrate intensity, and use crystallized glass substrate, this crystallized glass substrate is characterised in that based on crystallization and strengthens substrate intensity.
And along with the development of high density recording trend, magnetic head changes magnetoresistive head (MR magnetic head) and large reluctance magnetic head (GMR magnetic head) into from film magnetic head.Therefore, the content of utilizing magnetoresistive head to reproduce the magnetic recording media of substrate of glass will become following standard.
Therefore, the disk that is used for high density recording has been carried out multiple improvement.Yet along with the improvement of disk, new problem is given birth to thereupon, and these problems relate to the magnetic recording media substrate of glass.One of them problem is the problem of cleaning glass substrate surface.Just, foreign substance adheres to glass basic surface will be caused forming defective in the film on glass basic surface, perhaps will cause forming on the surface of film projection.And, utilizing magnetoresistive head to reproduce in the content of magnetic recording media of substrate of glass, if the flying height (flying height) that reduces magnetic head when increasing packing density, can occur the reproduction operation of mistake usually or reproduce uncompleted phenomenon.Reason is that the projection that forms owing to the particle on the substrate of glass can cause the hot surface roughness, thereby produces heat in magnetoresistive head on the surface of disk, change the magnetic resistance of magnetic head, thereby be unfavorable for electromagnetic conversion.
The main cause that produces foreign substance at above-mentioned magnetic recording media on the surface of substrate of glass is; the end surfaces of substrate of glass is unsmooth; therefore; can the rub wall surface of resin-case of this end surfaces, thus other residual particles can adhere on the surface on interior all end surfaces of the resin that forms by friction or glass particle and substrate of glass and the outer circumference end surface.
Patent documentation 1 (JP-A-11-221742) discloses a kind of finishing method, wherein will be impregnated in the dish type substrate of glass (recording medium substrate) that core has a circular port in the polishing solution that comprises free crystal grain, utilization comprises the polishing solution of free crystal grain, and interior all end surfaces of substrate of glass and/or outer circumference end surface rotation contact polish brush or polishing pad are polished.
Yet being used in combination polish brush and slurries can not advantageously polish being used for for example substrate of the recording medium of small harddisk (for example, internal diameter is no more than 7 millimeters annular substrate).And conventional slurry package oxidation-containing cerium etc. is not easy the material that removes by washing.In addition, in the application scenario that needs high reliability, for example in the application scenario of using vehicle-mounted hard disks (HD) etc., residual cerium oxide then can make and be difficult to obtain the satisfactory performance reliability.
[patent documentation 1] Japanese unexamined patent (Kokai) No.11-221742
Summary of the invention
Therefore, the objective of the invention is, a kind of substrate finishing method is provided, this method is suitable for polishing the substrate that is used for recording medium, especially, is used for the substrate of small recording medium.Another object of the present invention is to provide a kind of and can effectively polish the interior all end surfaces of substrate and/or the finishing method on outer circumference end surface.Another object of the present invention is, a kind of finishing method is provided, and this finishing method can form the polishing substrate, prevents that simultaneously performance reliability is subjected to the infringement that residual polishing material adheres to.
The invention provides the method that a kind of end surfaces that is used for the substrate that is used for recording medium polishes, and the said method manufacturing that utilizes as described below is used for the method for the substrate of recording medium.
(1) a kind of method that the end surfaces of the substrate that is used for recording medium is polished, wherein, feasible interior all end surfaces or the outer circumference end surface contact polishing medium that is used for the substrate of disc-shape recoding medium, and described polishing medium flows, thereby all end surfaces in described or outer circumference end surface are polished, the wherein said disc-shape recoding medium heart therein partly has circular port, and described polishing medium makes by scatter polishing particles in the viscoplasticity resin carrier.
(2) according to above-mentioned (1) the described method that the end surfaces of the substrate that is used for recording medium is polished, wherein simultaneously all end surfaces in described and outer circumference end surface are polished.
(3) according to above-mentioned (1) or (2) the described method that the end surfaces of the substrate that is used for recording medium is polished, wherein said polishing particles is a diamond particles.
(4) according to each described method that the end surfaces of the substrate that is used for recording medium is polished in above-mentioned (1) to (3), the diameter of wherein said circular port is no more than 7 millimeters.
(5) a kind of manufacturing is used for the method for the substrate of recording medium, wherein utilizes according to each finishing method in above-mentioned (1) to (4).
(6) a kind of substrate that is used for recording medium, it is by making according to (5) described method.
(7) a kind of recording medium, it is made by utilizing according to (6) described substrate.
Be different from the conventional method that adopts polish brush, finishing method of the present invention can effectively be carried out polishing, and the disk-shaped substrate that promptly is used in recording medium has very little internal diameter.
And, polish substrate, all end surfaces and outer circumference end surface in can polishing simultaneously by utilizing the polishing particles in the polishing medium that flows.
And, under the state that a plurality of disk-shaped substrate that are used for recording medium are laminated to each other, also can effectively polish it.
And, the method according to this invention, by utilize diamond particles or for example the particle of carborundum advantageously carry out polishing.Therefore, needn't wash, also not cause the problem of performance reliability decline because of residual cerium oxide, and by keeping sufficiently high reliability can obtain high-performance.
Description of drawings
Fig. 1 is the perspective view that is used for the device of grain flow processing;
Fig. 2 is the sectional view that is laminated in substrate under together the situation in the substrate that will polish.
Cylinder on 1
2 lower props
3 anchor clamps
4 polishing mediums
5 substrates
6 cylinder control modules
10 grain flow treating apparatus
21 outer circumference end surfaces
22 ora terminalis surfaces
23 chamfered portion
The specific embodiment
The method that the end surfaces of the substrate that is used for recording medium is polished of the present invention is based on so-called " grain flow processing method ", this method makes substrate touch polishing medium stream when polishing medium flows, and wherein this polishing medium stream makes by scatter polishing particles in the viscoplasticity resin carrier." grain flow processing method " itself is the known method that is used for the metal parts deburring already.Polishing medium makes by the polishing particles that scatters diamond for example or carborundum in having mobile semisolid viscoplasticity resin material.Fig. 1 is the perspective view that is used for the device of grain flow processing.Fig. 2 is the sectional view of substrate under will be by the stacked state of the substrate that finishing method of the present invention polishes.Grain flow treating apparatus 10 shown in Figure 1 is included in last cylinder 1, lower prop 2 and the anchor clamps 3 of combination in the chamber, and in described chamber, last cylinder 1 and lower prop 2 can move freely along the both direction shown in the arrow.And; grain flow treating apparatus 10 comprises cylinder control module 6; the control of this cylinder control module is gone up cylinder 1 and lower prop 2 and is moved with pre-set velocity; wherein the polished substrate that is used for recording medium 5 is fixed between cylinder 1 and the lower prop 2; polishing medium 4 introducings are gone up between cylinder 1 and the lower prop 2, and wherein this polishing medium forms by polishing particles being mixed into have in viscosity and the flexible viscoplasticity resin carrier.The viscoplasticity resin carrier is the viscoelastic polymer material of for example organic siliconresin.
In this structure, polishing medium 4 is subjected to the extruding of cylinder 1 and lower prop 2, and moves on all surface on all end surfaces and outer circumference end surface in the comprising of the substrate 5 that is used for recording medium and simultaneously its pressure is contacted.Because should move, interior all end surfaces that will be used for the substrate 5 of recording medium become specular surface with the outer circumference end surface grinding.This has eliminated surface roughness, and can prevent that substrate 5 from forming particle.In the chamfered portion 23 of periphery end surfaces (referring to Fig. 2), dihedral is become fillet, this has prevented to form particle when substrate 5 touches other objects.Predetermined speed is set in advance, thereby cylinder 1 is gone up in control and lower prop 2 moves with this predetermined speed in cylinder control module 6.
Just, when last cylinder 1 and lower prop 2 moved with constant speed, medium 4 also moved with constant speed.Therefore, even the viscosity of medium 4 and type change, flow velocity also can keep constant and polishing condition can not change.Therefore, can obtain stable polishing precision.
By the control of cylinder control module 6, can keep the constant airspeed of cylinder 1 and lower prop 2.Therefore, do not need complicated control module to carry out this control and keep detecting relevance between the data, these detection data for example are temperature of tonnage, medium 4 or the like.In other words, last cylinder 1 and lower prop 2 can be controlled by the control device that utilizes simple structure.
And, as shown in Figure 2, form duplexer 20 by stacked a plurality of substrates, thereby can handle many substrates simultaneously with works fine efficient.Here, with reference to Fig. 2, the outer circumference end surface 21 of each substrate is made of ora terminalis surface 22 and chamfered portion 23.Interior all end surfaces 21 ' also are made of ora terminalis surface 22 ' and chamfered portion 23.Sunk part 24,24 ' is formed between the end surfaces 21,21 ' of up and down substrate, and the particle that may often can not move by the above-below direction along duplexer 20 is fully polished.In this case, be the rotating shaft rotation with duplexer with the centre bore of stacked substrate, thereby also advantageously chamfered portion 23,23 ' polished.
After cutting sth. askew in circular port in forming the core of substrate of glass and internal all end surfaces and outer circumference end surface, the end surfaces polishing of substrate is minute surface.Afterwards, the recording surface of substrate is polished, and if desired can also for example potassium nitrate or sodium nitrate carry out chemical enhanced processing to it by using chemical enhanced solution.
In the substrate that makes as mentioned above, superpose continuously lining, magnetosphere, protective layer and lubricating layer, thus make magnetic recording media.As lining, adopt nonmagnetic substance usually, for example Cr, Mo, Ta, W, V, B or Al still are not limited to this.As magnetosphere, can adopt the magnetic film that mainly comprises Co.As protective layer, can adopt Cr film or carbon film.As lubricating layer, can utilize the perfluoro-ether of fluorine type solvent dilution by following formation, then with its coating and dry as fluid lubricant.
Example
To method of the present invention be described in further detail by example below, yet it does not limit the present invention.
Example 1
Stacked 30 substrates (TS-10SX that Ohara company makes) that are used for hard disk (HD), each substrate all has 21.6 millimeters diameter (external diameter), 6 millimeters diameter (internal diameter of centre bore) and 0.421 millimeter thickness, by grain flow treating apparatus shown in Figure 1 (Extrude-Horn company make EX-100) the end surfaces polishing of these substrates is minute surface under the following conditions then.The periphery basal surface of substrate and interior all end surfaces comprise 0.181 millimeter ora terminalis surface and respectively in 0.120 millimeter chamfered portion of both sides.
Polishing:
1. polishing medium
Grain type, size: diamond, #600 (average particle size particle size, 30 microns)
Viscoplasticity resin: product coding EH020854
2. grain flow treating apparatus
Column diameter: 15 cm diameters
3. the condition in installing
Temperature: 25 degrees centigrade
Pressure: 3MPa
Polishing time: 120 minutes
In above-mentioned example, the defective on observation surface.By the microscope that Olympus company produces, observe the defective on surface with 200 times magnifying power.Polished surface does not have cut or depression fully.
And, in the present invention, do not adhere to residual polishing material, for example cerium oxide.This expression, when use was used for the substrate of recording medium, in order to satisfy the requirement of high reliability, reliability can be because of residual polishing material worsen, and this is especially favourable.In addition, all end surfaces and outer circumference end surface in can polishing simultaneously, this is favourable aspect operating efficiency.And, being different from the conventional finishing method that adopts polish brush, this example can advantageously polish the substrate of diameter very little (for example, 7 millimeters internal diameter).

Claims (7)

1. method that the end surfaces of the substrate that is used for recording medium is polished, wherein, feasible interior all end surfaces or the outer circumference end surface contact polishing medium that is used for the substrate of disc-shape recoding medium, and described polishing medium flows, thereby all end surfaces in described or outer circumference end surface are polished, the wherein said disc-shape recoding medium heart therein partly has circular port, and described polishing medium makes by scatter polishing particles in the viscoplasticity resin carrier.
2. the method that the end surfaces of the substrate that is used for recording medium is polished according to claim 1 is wherein polished all end surfaces in described and outer circumference end surface simultaneously.
3. the method that the end surfaces of the substrate that is used for recording medium is polished according to claim 1 and 2, wherein said polishing particles is a diamond particles.
4. according to each described method that the end surfaces of the substrate that is used for recording medium is polished in the claim 1 to 3, the diameter of wherein said circular port is no more than 7 millimeters.
5. a manufacturing is used for the method for the substrate of recording medium, wherein utilizes according to each finishing method in the claim 1 to 4.
6. substrate that is used for recording medium, it is by method manufacturing according to claim 5.
7. recording medium, it is by utilizing substrate manufacturing according to claim 6.
CN200580029265A 2004-08-31 2005-08-26 Polish the method for the end surfaces of the substrate that is used for recording medium by grain flow processing method Expired - Fee Related CN100584530C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP252650/2004 2004-08-31
JP2004252650A JP2006068835A (en) 2004-08-31 2004-08-31 End face polishing method for substrate for record medium using abrasive grain fluidized processing
US60/608,103 2004-09-09

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CN101010167A true CN101010167A (en) 2007-08-01
CN100584530C CN100584530C (en) 2010-01-27

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JP2009099250A (en) * 2007-09-28 2009-05-07 Hoya Corp Method of manufacturing glass substrate for magnetic disk and method of manufacturing magnetic disk
JP5227132B2 (en) * 2008-10-01 2013-07-03 Hoya株式会社 Manufacturing method of glass substrate for magnetic disk and manufacturing method of magnetic disk
JP5589209B2 (en) * 2010-03-02 2014-09-17 国立大学法人 宮崎大学 Gear tooth surface polishing agent and polishing method using the same
WO2019003397A1 (en) * 2017-06-28 2019-01-03 三菱製鋼株式会社 Method for manufacturing hollow stabilizer
JP6569152B2 (en) * 2017-07-05 2019-09-04 日本製鉄株式会社 Surface polishing method for rod-shaped specimens
JP6569153B2 (en) * 2017-09-11 2019-09-04 日本製鉄株式会社 Surface polishing apparatus and surface polishing method for rod-shaped test piece

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JPH07266216A (en) * 1994-03-31 1995-10-17 Hitachi Ltd Abrasive grain flow type working device
JP2001162510A (en) * 1999-09-30 2001-06-19 Hoya Corp Method of polishing, method of manufacturing glass substrate for magnetic recording medium, and method of manufacturing magnetic recording medium
JP3119358B1 (en) * 1999-10-18 2000-12-18 株式会社石井表記 Edge polishing equipment for semiconductor wafers
JP2003260653A (en) * 2002-03-05 2003-09-16 Ogawa Seiki Kk Deburring device
JP2003260654A (en) * 2002-03-06 2003-09-16 Hitachi Cable Ltd Abrasive grain fluidizing type working device

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CN100584530C (en) 2010-01-27
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