MY139319A - Bottom cover tape for electronic part carrier - Google Patents

Bottom cover tape for electronic part carrier

Info

Publication number
MY139319A
MY139319A MYPI20020076A MYPI20020076A MY139319A MY 139319 A MY139319 A MY 139319A MY PI20020076 A MYPI20020076 A MY PI20020076A MY PI20020076 A MYPI20020076 A MY PI20020076A MY 139319 A MY139319 A MY 139319A
Authority
MY
Malaysia
Prior art keywords
bottom cover
parts
cover tape
weight
electronic part
Prior art date
Application number
MYPI20020076A
Other languages
English (en)
Inventor
Hiroki Ichikawa
Ichirou Nakano
Kyouichi Araki
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of MY139319A publication Critical patent/MY139319A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Packaging Frangible Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Packages (AREA)
  • Wrappers (AREA)
MYPI20020076A 2001-01-11 2002-01-09 Bottom cover tape for electronic part carrier MY139319A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001003710A JP4573442B2 (ja) 2001-01-11 2001-01-11 電子部品キャリア用ボトムカバーテープ

Publications (1)

Publication Number Publication Date
MY139319A true MY139319A (en) 2009-09-30

Family

ID=18872007

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20020076A MY139319A (en) 2001-01-11 2002-01-09 Bottom cover tape for electronic part carrier

Country Status (6)

Country Link
JP (1) JP4573442B2 (ja)
KR (1) KR20020060618A (ja)
CN (1) CN1200062C (ja)
MY (1) MY139319A (ja)
SG (1) SG96676A1 (ja)
TW (1) TW555829B (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG115510A1 (en) * 2001-12-20 2005-10-28 Nitto Denko Corp Cover tape for the electronic part conveyance, process for its production and electronic part conveying member
JP2004189314A (ja) * 2002-12-13 2004-07-08 Nitta Ind Corp 電子部品支持体
JP3808852B2 (ja) * 2003-09-12 2006-08-16 大王製紙株式会社 キャリアテープ台紙基材
JP4710072B2 (ja) * 2004-06-23 2011-06-29 電気化学工業株式会社 カバーテープ
JP4766863B2 (ja) * 2004-10-22 2011-09-07 電気化学工業株式会社 カバーテープ及び電子部品包装用キャリアテープシステム
JP2005306460A (ja) * 2004-04-26 2005-11-04 Denki Kagaku Kogyo Kk カバーテープ及び電子部品包装用キャリアテープシステム
WO2005102860A1 (ja) * 2004-04-26 2005-11-03 Denki Kagaku Kogyo Kabushiki Kaisha カバーテープ及び電子部品包装用キャリアテープシステム
JP4444814B2 (ja) * 2004-12-28 2010-03-31 信越ポリマー株式会社 カバーテープおよび電子部品包装体
JP6758801B2 (ja) * 2015-03-20 2020-09-23 株式会社サンエー化研 表面保護フィルム
JP2018193121A (ja) * 2017-05-22 2018-12-06 Koa株式会社 ボトムカバーテープ
JP7211239B2 (ja) * 2018-06-25 2023-01-24 Tdk株式会社 電子部品の収容方法
JP7324049B2 (ja) * 2019-05-24 2023-08-09 株式会社ダイセル 半導体装置
CN114787052A (zh) * 2019-12-10 2022-07-22 住友电木株式会社 盖带及电子部件包装体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52104547A (en) * 1976-02-29 1977-09-02 Tokyo Silicone Kk Antistatic paint
CA1222071A (en) * 1984-01-30 1987-05-19 Joseph A. Aurichio Conductive die attach tape
US4645711A (en) * 1985-08-26 1987-02-24 Minnesota Mining And Manufacturing Company Removable pressure-sensitive adhesive tape
US4699842A (en) * 1985-10-17 1987-10-13 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive having broad useful temperature range
IT1217821B (it) * 1988-06-09 1990-03-30 Autoadesivitalia Spa Mastro autoadesivo a bassa rumorosita' di svolgimento e procedimento per la sua preparazione
US5834538A (en) * 1996-06-18 1998-11-10 Hercules Incorporated Pressure sensitive adhesives
JP2000191991A (ja) * 1998-12-24 2000-07-11 Nitto Denko Corp チップ型電子部品キャリア用トップカバーテープ
JP2001003014A (ja) * 1999-06-16 2001-01-09 Nitto Denko Corp チップ型電子部品キャリア用ボトムカバーテープ

Also Published As

Publication number Publication date
JP2002211677A (ja) 2002-07-31
JP4573442B2 (ja) 2010-11-04
SG96676A1 (en) 2003-06-16
KR20020060618A (ko) 2002-07-18
TW555829B (en) 2003-10-01
CN1200062C (zh) 2005-05-04
CN1364842A (zh) 2002-08-21

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