MY129925A - ULTRASONIC BONDING PROCESS BEYOND 125 kHz. - Google Patents

ULTRASONIC BONDING PROCESS BEYOND 125 kHz.

Info

Publication number
MY129925A
MY129925A MYPI92001565A MYPI9201565A MY129925A MY 129925 A MY129925 A MY 129925A MY PI92001565 A MYPI92001565 A MY PI92001565A MY PI9201565 A MYPI9201565 A MY PI9201565A MY 129925 A MY129925 A MY 129925A
Authority
MY
Malaysia
Prior art keywords
ultrasonic energy
bond
khz
high frequency
transducer
Prior art date
Application number
MYPI92001565A
Other languages
English (en)
Inventor
Thomas H Ramsey
Rafael C Alfaro
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of MY129925A publication Critical patent/MY129925A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
MYPI92001565A 1991-09-30 1992-09-02 ULTRASONIC BONDING PROCESS BEYOND 125 kHz. MY129925A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/767,740 US5244140A (en) 1991-09-30 1991-09-30 Ultrasonic bonding process beyond 125 khz

Publications (1)

Publication Number Publication Date
MY129925A true MY129925A (en) 2007-05-31

Family

ID=25080418

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI92001565A MY129925A (en) 1991-09-30 1992-09-02 ULTRASONIC BONDING PROCESS BEYOND 125 kHz.

Country Status (6)

Country Link
US (1) US5244140A (https=)
EP (1) EP0535433A3 (https=)
JP (1) JPH06204298A (https=)
KR (1) KR930006956A (https=)
MY (1) MY129925A (https=)
TW (1) TW222362B (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2527399B2 (ja) * 1992-09-29 1996-08-21 完テクノソニックス株式会社 ワイヤ―・ボンダ―・システム
US5816476A (en) * 1994-08-24 1998-10-06 Verity Instruments Inc. Dual frequency power supply and transducer
US5660319A (en) * 1995-01-17 1997-08-26 Texas Instruments Incorporated Ultrasonic bonding process
US5614113A (en) * 1995-05-05 1997-03-25 Texas Instruments Incorporated Method and apparatus for performing microelectronic bonding using a laser
CA2245775C (en) * 1996-02-12 2004-04-06 David Finn Method and device for bonding a wire conductor
EP0791955B1 (en) * 1996-02-26 2008-10-29 Texas Instruments Incorporated Integrated circuit interconnections
US5894983A (en) * 1997-01-09 1999-04-20 Harris Corporation High frequency, low temperature thermosonic ribbon bonding process for system-level applications
US6213378B1 (en) * 1997-01-15 2001-04-10 National Semiconductor Corporation Method and apparatus for ultra-fine pitch wire bonding
US5938105A (en) * 1997-01-15 1999-08-17 National Semiconductor Corporation Encapsulated ball bonding apparatus and method
US6065667A (en) * 1997-01-15 2000-05-23 National Semiconductor Corporation Method and apparatus for fine pitch wire bonding
US6180891B1 (en) 1997-02-26 2001-01-30 International Business Machines Corporation Control of size and heat affected zone for fine pitch wire bonding
JP3215084B2 (ja) * 1998-04-28 2001-10-02 株式会社アルテクス 超音波振動接合用共振器
US6135341A (en) * 1998-05-27 2000-10-24 Texas Instruments Incorporated Room temperature gold wire wedge bonding process
US6534327B2 (en) 2000-04-13 2003-03-18 Texas Instruments Incorporated Method for reworking metal layers on integrated circuit bond pads
US6936951B1 (en) 2000-11-27 2005-08-30 Grq Instruments, Inc. Smart sonic bearings and method for frictional force reduction and switching
JP3681676B2 (ja) * 2001-11-16 2005-08-10 松下電器産業株式会社 バンプボンディング方法及び装置
JP3943416B2 (ja) * 2002-03-07 2007-07-11 株式会社ルネサステクノロジ 半導体装置の製造方法
JP4562118B2 (ja) 2003-12-19 2010-10-13 日東電工株式会社 半導体装置の製造方法
US20090001611A1 (en) 2006-09-08 2009-01-01 Takeshi Matsumura Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method
IL184260A0 (en) 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
JP6002437B2 (ja) * 2012-05-17 2016-10-05 新日本無線株式会社 半導体装置及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3054309A (en) * 1959-02-20 1962-09-18 Aeroprojects Inc Vibratory device
US3776447A (en) * 1969-06-30 1973-12-04 Texas Instruments Inc Automatic semiconductor bonding machine
US3641660A (en) * 1969-06-30 1972-02-15 Texas Instruments Inc The method of ball bonding with an automatic semiconductor bonding machine
US4415115A (en) * 1981-06-08 1983-11-15 Motorola, Inc. Bonding means and method
DE3701652A1 (de) * 1987-01-21 1988-08-04 Siemens Ag Ueberwachung von bondparametern waehrend des bondvorganges
US4889274A (en) * 1988-03-22 1989-12-26 Texas Instruments Incorporated Gas mixture for use in control and formation of ball bonds
US4842662A (en) * 1988-06-01 1989-06-27 Hewlett-Packard Company Process for bonding integrated circuit components
JPH02101754A (ja) * 1988-10-11 1990-04-13 Hitachi Ltd ボンディング方法及びボンディング装置

Also Published As

Publication number Publication date
US5244140A (en) 1993-09-14
JPH06204298A (ja) 1994-07-22
EP0535433A3 (en) 1993-06-30
EP0535433A2 (en) 1993-04-07
KR930006956A (ko) 1993-04-22
TW222362B (https=) 1994-04-11

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