TW222362B - - Google Patents
Info
- Publication number
- TW222362B TW222362B TW082101119A TW82101119A TW222362B TW 222362 B TW222362 B TW 222362B TW 082101119 A TW082101119 A TW 082101119A TW 82101119 A TW82101119 A TW 82101119A TW 222362 B TW222362 B TW 222362B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/767,740 US5244140A (en) | 1991-09-30 | 1991-09-30 | Ultrasonic bonding process beyond 125 khz |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW222362B true TW222362B (https=) | 1994-04-11 |
Family
ID=25080418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082101119A TW222362B (https=) | 1991-09-30 | 1993-02-18 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5244140A (https=) |
| EP (1) | EP0535433A3 (https=) |
| JP (1) | JPH06204298A (https=) |
| KR (1) | KR930006956A (https=) |
| MY (1) | MY129925A (https=) |
| TW (1) | TW222362B (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2527399B2 (ja) * | 1992-09-29 | 1996-08-21 | 完テクノソニックス株式会社 | ワイヤ―・ボンダ―・システム |
| US5816476A (en) * | 1994-08-24 | 1998-10-06 | Verity Instruments Inc. | Dual frequency power supply and transducer |
| US5660319A (en) * | 1995-01-17 | 1997-08-26 | Texas Instruments Incorporated | Ultrasonic bonding process |
| US5614113A (en) * | 1995-05-05 | 1997-03-25 | Texas Instruments Incorporated | Method and apparatus for performing microelectronic bonding using a laser |
| CA2245775C (en) * | 1996-02-12 | 2004-04-06 | David Finn | Method and device for bonding a wire conductor |
| EP0791955B1 (en) * | 1996-02-26 | 2008-10-29 | Texas Instruments Incorporated | Integrated circuit interconnections |
| US5894983A (en) * | 1997-01-09 | 1999-04-20 | Harris Corporation | High frequency, low temperature thermosonic ribbon bonding process for system-level applications |
| US6213378B1 (en) * | 1997-01-15 | 2001-04-10 | National Semiconductor Corporation | Method and apparatus for ultra-fine pitch wire bonding |
| US5938105A (en) * | 1997-01-15 | 1999-08-17 | National Semiconductor Corporation | Encapsulated ball bonding apparatus and method |
| US6065667A (en) * | 1997-01-15 | 2000-05-23 | National Semiconductor Corporation | Method and apparatus for fine pitch wire bonding |
| US6180891B1 (en) | 1997-02-26 | 2001-01-30 | International Business Machines Corporation | Control of size and heat affected zone for fine pitch wire bonding |
| JP3215084B2 (ja) * | 1998-04-28 | 2001-10-02 | 株式会社アルテクス | 超音波振動接合用共振器 |
| US6135341A (en) * | 1998-05-27 | 2000-10-24 | Texas Instruments Incorporated | Room temperature gold wire wedge bonding process |
| US6534327B2 (en) | 2000-04-13 | 2003-03-18 | Texas Instruments Incorporated | Method for reworking metal layers on integrated circuit bond pads |
| US6936951B1 (en) | 2000-11-27 | 2005-08-30 | Grq Instruments, Inc. | Smart sonic bearings and method for frictional force reduction and switching |
| JP3681676B2 (ja) * | 2001-11-16 | 2005-08-10 | 松下電器産業株式会社 | バンプボンディング方法及び装置 |
| JP3943416B2 (ja) * | 2002-03-07 | 2007-07-11 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| JP4562118B2 (ja) | 2003-12-19 | 2010-10-13 | 日東電工株式会社 | 半導体装置の製造方法 |
| US20090001611A1 (en) | 2006-09-08 | 2009-01-01 | Takeshi Matsumura | Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method |
| IL184260A0 (en) | 2007-06-27 | 2008-03-20 | On Track Innovations Ltd | Mobile telecommunications device having sim/antenna coil interface |
| US8028923B2 (en) | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
| JP6002437B2 (ja) * | 2012-05-17 | 2016-10-05 | 新日本無線株式会社 | 半導体装置及びその製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3054309A (en) * | 1959-02-20 | 1962-09-18 | Aeroprojects Inc | Vibratory device |
| US3776447A (en) * | 1969-06-30 | 1973-12-04 | Texas Instruments Inc | Automatic semiconductor bonding machine |
| US3641660A (en) * | 1969-06-30 | 1972-02-15 | Texas Instruments Inc | The method of ball bonding with an automatic semiconductor bonding machine |
| US4415115A (en) * | 1981-06-08 | 1983-11-15 | Motorola, Inc. | Bonding means and method |
| DE3701652A1 (de) * | 1987-01-21 | 1988-08-04 | Siemens Ag | Ueberwachung von bondparametern waehrend des bondvorganges |
| US4889274A (en) * | 1988-03-22 | 1989-12-26 | Texas Instruments Incorporated | Gas mixture for use in control and formation of ball bonds |
| US4842662A (en) * | 1988-06-01 | 1989-06-27 | Hewlett-Packard Company | Process for bonding integrated circuit components |
| JPH02101754A (ja) * | 1988-10-11 | 1990-04-13 | Hitachi Ltd | ボンディング方法及びボンディング装置 |
-
1991
- 1991-09-30 US US07/767,740 patent/US5244140A/en not_active Expired - Lifetime
-
1992
- 1992-09-02 MY MYPI92001565A patent/MY129925A/en unknown
- 1992-09-14 EP EP19920115678 patent/EP0535433A3/en not_active Withdrawn
- 1992-09-29 KR KR1019920017767A patent/KR930006956A/ko not_active Ceased
- 1992-09-30 JP JP4262341A patent/JPH06204298A/ja active Pending
-
1993
- 1993-02-18 TW TW082101119A patent/TW222362B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US5244140A (en) | 1993-09-14 |
| JPH06204298A (ja) | 1994-07-22 |
| EP0535433A3 (en) | 1993-06-30 |
| EP0535433A2 (en) | 1993-04-07 |
| MY129925A (en) | 2007-05-31 |
| KR930006956A (ko) | 1993-04-22 |